ZHCSIP5 August   2018 PGA305

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      PAG305 简化方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics – Reverse Voltage Protection
    6. 6.6  Electrical Characteristics – Regulators
    7. 6.7  Electrical Characteristics – Internal Reference
    8. 6.8  Electrical Characteristics – Bridge Sensor Supply
    9. 6.9  Electrical Characteristics – Temperature Sensor Supply
    10. 6.10 Electrical Characteristics – Internal Temperature Sensor
    11. 6.11 Electrical Characteristics – P Gain (Chopper Stabilized)
    12. 6.12 Electrical Characteristics – P Analog-to-Digital Converter
    13. 6.13 Electrical Characteristics – T Gain (Chopper Stabilized)
    14. 6.14 Electrical Characteristics – T Analog-to-Digital Converter
    15. 6.15 Electrical Characteristics – One-Wire Interface
    16. 6.16 I2C Interface
    17. 6.17 Electrical Characteristics – DAC Output
    18. 6.18 Electrical Characteristics – DAC Gain
    19. 6.19 Electrical Characteristics – Non-Volatile Memory
    20. 6.20 Electrical Characteristics – Diagnostics
    21. 6.21 Operating Characteristics
    22. 6.22 I2C Interface Timing Requirements
    23. 6.23 Timing Diagram
    24. 6.24 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Reverse-Voltage Protection Block
      2. 7.3.2  Linear Regulators
      3. 7.3.3  Internal Reference
        1. 7.3.3.1 High-Voltage Reference
        2. 7.3.3.2 Accurate Reference
      4. 7.3.4  BRG+ to BRG– Supply for the Resistive Bridge
      5. 7.3.5  ITEMP Supply for the Temperature Sensor
      6. 7.3.6  Internal Temperature Sensor
      7. 7.3.7  P Gain
      8. 7.3.8  P Analog-to-Digital Converter
        1. 7.3.8.1 P Sigma-Delta Modulator for P ADC
        2. 7.3.8.2 P Decimation Filter for P ADC
      9. 7.3.9  T Gain
      10. 7.3.10 T Analog-to-Digital Converter
        1. 7.3.10.1 T Sigma-Delta Modulator for T ADC
        2. 7.3.10.2 T Decimation Filters for T ADC
      11. 7.3.11 P GAIN and T GAIN Calibration
      12. 7.3.12 One-Wire Interface (OWI)
        1. 7.3.12.1 Overview of OWI
        2. 7.3.12.2 Activating and Deactivating the OWI Interface
          1. 7.3.12.2.1 Activating OWI Communication
          2. 7.3.12.2.2 Deactivating OWI Communication
        3. 7.3.12.3 OWI Protocol
          1. 7.3.12.3.1 OWI Frame Structure
            1. 7.3.12.3.1.1 Standard Field Structure
            2. 7.3.12.3.1.2 Frame Structure
            3. 7.3.12.3.1.3 Sync Field
            4. 7.3.12.3.1.4 Command Field
            5. 7.3.12.3.1.5 Data Fields
          2. 7.3.12.3.2 OWI Commands
            1. 7.3.12.3.2.1 OWI Write Command
            2. 7.3.12.3.2.2 OWI Read Initialization Command
            3. 7.3.12.3.2.3 OWI Read-Response Command
            4. 7.3.12.3.2.4 OWI Burst-Write Command (EEPROM Cache Access)
            5. 7.3.12.3.2.5 OWI Burst Read Command (EEPROM Cache Access)
          3. 7.3.12.3.3 OWI Operations
            1. 7.3.12.3.3.1 Write Operation
            2. 7.3.12.3.3.2 Read Operation
            3. 7.3.12.3.3.3 EEPROM Burst Write
            4. 7.3.12.3.3.4 EEPROM Burst Read
        4. 7.3.12.4 OWI Communication-Error Status
      13. 7.3.13 I2C Interface
        1. 7.3.13.1 Overview of I2C Interface
        2. 7.3.13.2 Clocking Details of I2C Interface
        3. 7.3.13.3 I2C Interface Protocol
        4. 7.3.13.4 PGA305 I2C Runtime Commands
        5. 7.3.13.5 PGA305 I2C Transfer Example
      14. 7.3.14 DAC Output
        1. 7.3.14.1 Ratiometric vs Absolute
      15. 7.3.15 DAC Gain
      16. 7.3.16 Memory
        1. 7.3.16.1 EEPROM Memory
          1. 7.3.16.1.1 EEPROM Cache
          2. 7.3.16.1.2 EEPROM Programming Procedure
          3. 7.3.16.1.3 EEPROM Programming Current
          4. 7.3.16.1.4 CRC
        2. 7.3.16.2 Control and Status Registers Memory
      17. 7.3.17 Diagnostics
        1. 7.3.17.1 Power Supply Diagnostics
        2. 7.3.17.2 Signal Chain Faults
          1. 7.3.17.2.1 P Gain and T Gain Input Faults
          2. 7.3.17.2.2 P Gain and T Gain Output Diagnostics
          3. 7.3.17.2.3 Masking Signal Chain Faults
          4. 7.3.17.2.4 Fault Detection Timing
      18. 7.3.18 Reading Diagnostics Information Through I2C
      19. 7.3.19 Digital Compensation and Filter
        1. 7.3.19.1 Digital Gain and Offset
        2. 7.3.19.2 TC and NL Correction
          1. 7.3.19.2.1 TC and NL Coefficients
            1. 7.3.19.2.1.1 No TC and NL Coefficients
          2. 7.3.19.2.2 TC Compensation Using the Internal Temperature Sensor
        3. 7.3.19.3 Clamping
        4. 7.3.19.4 Filter
      20. 7.3.20 Filter Coefficients
        1. 7.3.20.1 No Filtering
        2. 7.3.20.2 Filter Coefficients for P ADC Sampling Rate = 1024 µs
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage Mode
      2. 7.4.2 Current Mode
    5. 7.5 Register Maps
      1. 7.5.1 Register Settings
      2. 7.5.2 Control and Status Registers
        1. 7.5.2.1  Digital Interface Control (M0 Address = 0x40000506) (DI Page Address = 0x2) (DI Page Offset = 0x06)
        2. 7.5.2.2  DAC_CTRL_STATUS (M0 Address: 0x40000538) (DI Page Address: 0x2) (DI Page Offset: 0x38)
        3. 7.5.2.3  DAC_CONFIG (EEPROM Address = 0x40000032) (DI Page Address: 0x2) (DI Page Offset: 0x39)
        4. 7.5.2.4  OP_STAGE_CTRL (EEPROM Address = 0x40000033) (DI Page Address: 0x2) (DI Page Offset: 0x3B)
        5. 7.5.2.5  BRDG_CTRL (EEPROM Address = 0x40000034) (DI Page Address: 0x2) (DI Page Offset: 0x46)
        6. 7.5.2.6  P_GAIN_SELECT (EEPROM Address = 0x40000035) (DI Page Address: 0x2) (DI Page Offset: 0x47)
        7. 7.5.2.7  T_GAIN_SELECT (EEPROM Address = 0x40000036) (DI Page Address: 0x2) (DI Page Offset: 0x48)
        8. 7.5.2.8  TEMP_CTRL (EEPROM Address = 0x40000037) (DI Page Address: 0x2) (DI Page Offset: 0x4C)
        9. 7.5.2.9  TEMP_SE (EEPROM Address = 0x4000003A)
        10. 7.5.2.10 DIAG_ENABLE (EEPROM Address = 0x40000056)
        11. 7.5.2.11 EEPROM_LOCK (EEPROM Address = 0x40000057)
        12. 7.5.2.12 AFEDIAG_CFG (EEPROM Address = 0x40000058)
        13. 7.5.2.13 AFEDIAG_MASK (EEPROM Address = 0x40000059)
        14. 7.5.2.14 ADC_24BIT_ENABLE (EEPROM Address = 0x40000068)
        15. 7.5.2.15 OFFSET_ENABLE (EEPROM Address = 0x40000069)
        16. 7.5.2.16 COMPENSATION_CONTROL (EEPROM Address = N/A) (DI Page Address: 0x0) (DI Page Offset: 0x0C)
        17. 7.5.2.17 EEPROM_PAGE_ADDRESS (EEPROM Address = N/A) (DI Page Address: 0x5) (DI Page Offset: 0x88)
        18. 7.5.2.18 EEPROM_CTRL (EEPROM Address = N/A) (DI Page Address: 0x5) (DI Page Offset: 0x89)
        19. 7.5.2.19 EEPROM_CRC (EEPROM Address = N/A) (DI Page Address: 0x5) (DI Page Offset: 0x8A)
        20. 7.5.2.20 EEPROM_STATUS (EEPROM Address = N/A) (DI Page Address: 0x5) (DI Page Offset: 0x8B)
        21. 7.5.2.21 EEPROM_CRC_STATUS (EEPROM Address = N/A) (DI Page Address: 0x5) (DI Page Offset: 0x8C)
        22. 7.5.2.22 EEPROM_CRC_VALUE (EEPROM Address = 0x4000007F) (DI Page Address: 0x5) (DI Page Offset: 0x8D)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 4-mA to 20-mA Output With Internal Sense Resistor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Calibration Tips
            1. 8.2.1.2.1.1 Programming the EEPROM for 4-mA to 20-mA Output
        3. 8.2.1.3 Application Curve
      2. 8.2.2 0- to 10-V Absolute Output With Internal Drive
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 0- to 5-V Ratiometric Output With Internal Drive
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Programmer Tips
            1. 8.2.3.2.1.1 Resetting the Microprocessor and Enable Digital Interface
            2. 8.2.3.2.1.2 Turning On the Accurate Reference Buffer (REFCAP Voltage)
            3. 8.2.3.2.1.3 Turning On DAC and DAC GAIN
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3.12.3.3.2 Read Operation

The read operation requires two consecutive transmission frames to move data from the slave to the master. The first frame is the read-initialization frame. It tells the slave to retrieve data from a particular location within the slave device and prepare to send it over the OWI. The data location may be specified in the command field or may require additional data fields for complete data-location specification. The data is not sent until the master commands it to be sent in the subsequent frame called the read-response frame. During the read-response frame, the data direction changes from master → slave to slave → master immediately after the read response command field is sent. Enough time elapses between the command field and data field to allow the signal drivers to change direction. This wait time is 20 µs, and the timer for this wait time is located on the slave device. After this wait time is complete, the slave transmits the requested data. The master device is expected to have switched its signal drivers and is ready to receive data. The read frames are shown in Figure 15.

PGA305 read_ini_file_SLDS204.gifFigure 15. Read-Initialization Frame, N = 1 to 8
PGA305 read_response_SLDS204.gifFigure 16. Read-Response Frame, N = 1 to 8