ZHCSIH0A December 2017 – July 2018 LP87702-Q1
The performance of the LP87702-Q1 device depends greatly on the care taken in designing the printed circuit board (PCB). The use of low-inductance and low serial-resistance ceramic capacitors is strongly recommended, while proper grounding is crucial. Attention should be given to decoupling the power supplies. Decoupling capacitors must be connected close to the device and between the power and ground pins to support high peak currents being drawn from system power rail during turnon of the switching MOSFETs. Keep input and output traces as short as possible, because trace inductance, resistance, and capacitance can easily become the performance limiting items. The separate buck converter power pins VIN_Bx are not connected together internally. The VIN_Bx power connections shall be connected together outside the package using power plane construction.