SLVSEE8B November   2019  – May 2021 DRV8899-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Indexer Timing Requirements
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 rms Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Controlling VREF with an MCU DAC
      5. 7.3.5  Current Regulation
      6. 7.3.6  Decay Modes
        1. 7.3.6.1 Slow Decay for Increasing and Decreasing Current
        2. 7.3.6.2 Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        3. 7.3.6.3 Mode 4: Slow Decay for Increasing Current, Fast Decay for Decreasing current
        4. 7.3.6.4 Mixed Decay for Increasing and Decreasing Current
        5. 7.3.6.5 Smart tune Dynamic Decay
        6. 7.3.6.6 Smart tune Ripple Control
      7. 7.3.7  Blanking Time
      8. 7.3.8  Charge Pump
      9. 7.3.9  Linear Voltage Regulators
      10. 7.3.10 Logic Level Pin Diagrams
        1. 7.3.10.1 nFAULT Pin
      11. 7.3.11 Protection Circuits
        1. 7.3.11.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.11.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.11.3 Overcurrent Protection (OCP)
          1. 7.3.11.3.1 Latched Shutdown (OCP_MODE = 0b)
          2. 7.3.11.3.2 Automatic Retry (OCP_MODE = 1b)
        4. 7.3.11.4 Open-Load Detection (OL)
        5. 7.3.11.5 Thermal Shutdown (OTSD)
          1. 7.3.11.5.1 Latched Shutdown (OTSD_MODE = 0b)
          2. 7.3.11.5.2 Automatic Recovery (OTSD_MODE = 1b)
        6. 7.3.11.6 Overtemperature Warning (OTW)
        7. 7.3.11.7 Undertemperature Warning (UTW)
        8.      
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Disable Mode (nSLEEP = 1, DRVOFF = 1)
      3. 7.4.3 Operating Mode (nSLEEP = 1, DRVOFF = 0)
      4. 7.4.4 nSLEEP Reset Pulse
      5.     
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI) Communication
        1. 7.5.1.1 SPI Format
        2. 7.5.1.2 SPI for a Single Slave Device
        3. 7.5.1.3 SPI for Multiple Slave Devices in Parallel Configuration
        4. 7.5.1.4 SPI for Multiple Slave Devices in Daisy Chain Configuration
    6. 7.6 Register Maps
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
      4. 8.2.4 Thermal Application
        1. 8.2.4.1 Power Dissipation
          1. 8.2.4.1.1 Conduction Loss
          2. 8.2.4.1.2 Switching Loss
          3. 8.2.4.1.3 Power Dissipation Due to Quiescent Current
          4. 8.2.4.1.4 Total Power Dissipation
        2. 8.2.4.2 PCB Types
        3. 8.2.4.3 Thermal Parameters for HTSSOP Package
        4. 8.2.4.4 Thermal Parameters for VQFN Package
        5. 8.2.4.5 Device Junction Temperature Estimation
  9. Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Functions

PINI/OTYPEDESCRIPTION
NAMENO.
AOUT13OOutputWinding A output. Connect to stepper motor winding.
AOUT24OOutputWinding A output. Connect to stepper motor winding.
PGND2, 7PowerPower ground. Both PGND pins are shorted internally. Connect to system ground on PCB.
BOUT16OOutputWinding B output. Connect to stepper motor winding
BOUT25OOutputWinding B output. Connect to stepper motor winding
CPH23PowerCharge pump switching node. Connect a X7R, 0.022-µF, VM-rated ceramic capacitor from CPH to CPL.
CPL22
DIR19IInputDirection input. Logic level sets the direction of stepping; internal pulldown resistor.
DRVOFF20IInputLogic high to disable device outputs; logic low to enable; internal pullup to DVDD.
DVDD10PowerLogic supply voltage. Connect a X7R, 0.47-µF, 6.3-V or 10-V rated ceramic capacitor to GND.
GND9PowerDevice ground. Connect to system ground.
VREF12IInputCurrent set reference input. Maximum value 2.2 V. DVDD can be used to provide VREF through a resistor divider.
SCLK17IInputSerial clock input. Serial data is shifted out and captured on the corresponding rising and falling edge on this pin.
SDI16IInputSerial data input. Data is captured on the falling edge of the SCLK pin
SDO15OPush PullSerial data output. Data is shifted out on the rising edge of the SCLK pin.
STEP18IInputStep input. A rising edge causes the indexer to advance one step; internal pulldown resistor.
VCP24PowerCharge pump output. Connect a X7R, 0.22-μF, 16-V ceramic capacitor to VM.
VM1, 8PowerPower supply. Connect to motor supply voltage and bypass to GND with two 0.01-µF ceramic capacitors (one for each pin) plus a bulk capacitor rated for VM.
VSDO14PowerSupply pin for SDO output. Connect to 5-V or 3.3-V depending on the desired logic level.
nFAULT11OOpen DrainFault indication. Pulled logic low with fault condition; open-drain output requires an external pullup resistor.
nSCS13IInputSerial chip select. An active low on this pin enables the serial interface communications. Internal pullup to DVDD.
nSLEEP21IInputSleep mode input. Logic high to enable device; logic low to enter low-power sleep mode; internal pulldown resistor.
PAD---Thermal pad. Connect to system ground.