SLVSEE8B November   2019  – May 2021 DRV8899-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Indexer Timing Requirements
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 rms Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Controlling VREF with an MCU DAC
      5. 7.3.5  Current Regulation
      6. 7.3.6  Decay Modes
        1. 7.3.6.1 Slow Decay for Increasing and Decreasing Current
        2. 7.3.6.2 Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        3. 7.3.6.3 Mode 4: Slow Decay for Increasing Current, Fast Decay for Decreasing current
        4. 7.3.6.4 Mixed Decay for Increasing and Decreasing Current
        5. 7.3.6.5 Smart tune Dynamic Decay
        6. 7.3.6.6 Smart tune Ripple Control
      7. 7.3.7  Blanking Time
      8. 7.3.8  Charge Pump
      9. 7.3.9  Linear Voltage Regulators
      10. 7.3.10 Logic Level Pin Diagrams
        1. 7.3.10.1 nFAULT Pin
      11. 7.3.11 Protection Circuits
        1. 7.3.11.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.11.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.11.3 Overcurrent Protection (OCP)
          1. 7.3.11.3.1 Latched Shutdown (OCP_MODE = 0b)
          2. 7.3.11.3.2 Automatic Retry (OCP_MODE = 1b)
        4. 7.3.11.4 Open-Load Detection (OL)
        5. 7.3.11.5 Thermal Shutdown (OTSD)
          1. 7.3.11.5.1 Latched Shutdown (OTSD_MODE = 0b)
          2. 7.3.11.5.2 Automatic Recovery (OTSD_MODE = 1b)
        6. 7.3.11.6 Overtemperature Warning (OTW)
        7. 7.3.11.7 Undertemperature Warning (UTW)
        8.      
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Disable Mode (nSLEEP = 1, DRVOFF = 1)
      3. 7.4.3 Operating Mode (nSLEEP = 1, DRVOFF = 0)
      4. 7.4.4 nSLEEP Reset Pulse
      5.     
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI) Communication
        1. 7.5.1.1 SPI Format
        2. 7.5.1.2 SPI for a Single Slave Device
        3. 7.5.1.3 SPI for Multiple Slave Devices in Parallel Configuration
        4. 7.5.1.4 SPI for Multiple Slave Devices in Daisy Chain Configuration
    6. 7.6 Register Maps
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
      4. 8.2.4 Thermal Application
        1. 8.2.4.1 Power Dissipation
          1. 8.2.4.1.1 Conduction Loss
          2. 8.2.4.1.2 Switching Loss
          3. 8.2.4.1.3 Power Dissipation Due to Quiescent Current
          4. 8.2.4.1.4 Total Power Dissipation
        2. 8.2.4.2 PCB Types
        3. 8.2.4.3 Thermal Parameters for HTSSOP Package
        4. 8.2.4.4 Thermal Parameters for VQFN Package
        5. 8.2.4.5 Device Junction Temperature Estimation
  9. Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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订购信息

PCB Types

Thermal analysis in this section is focused for the 2-layer and 4-layer PCB with two different copper thickness (1-oz and 2-oz) and six different copper areas (1-cm2, 2-cm2, 4-cm2, 8-cm2, 16-cm2 and 32-cm2), for both HTSSOP and VQFN packages.

Figure 8-10 and Figure 8-11 show the top-layer which is applicable for both 2/4-layer PCB, for HTSSOP and VQFN packages respectively. The top-layer, mid-layer-1 and bottom-layer of the PCB is filled with ground plane, whereas, the mid-layer-2 is filled with power plane.

For the HTSSOP, 4 x 3 array of thermal vias with 300 µm drill diameter and 25 µm Cu plating were placed below the device package. For the VQFN, 2 x 2 array of thermal vias with 300 µm drill diameter and 25 µm Cu plating were placed below the device package. Thermal vias contacted top-layer, bottom-layer, and mid-layer-1 (ground plane) if applicable. The mid-layers and the bottom-layer were modeled with size A * A for both 2-layer and 4-layer designs. For the VQFN package, there was no copper on top layer outside of device land area.

The thickness of copper for different PCB layers in different PCB types is summarized in Table 8-3. The PCB dimension (A) for different PCB copper area is summarized in Table 8-4 for the HTSSOP package, and in Table 8-5 for the VQFN package.

Table 8-3 PCB Type and Copper Thickness
PCB TypeCopper ThicknessTop LayerBottom LayerMid-Layer 1Mid-Layer 2
2-Layer1-oz PCB1-oz1-ozN/A
2-oz PCB2-oz2-oz
4-Layer1-oz PCB1-oz1-oz1-oz1-oz
2-oz PCB2-oz2-oz1-oz1-oz
GUID-EB318A39-1D05-4412-96BF-55647006809D-low.pngFigure 8-10 PCB - Top Layer (4/2-Layer PCB) for HTSSOP Package
GUID-C2E2CC07-D951-4F39-A53F-A1B9B98734B4-low.pngFigure 8-11 PCB - Top Layer (4/2-Layer PCB) for VQFN Package
Table 8-4 PCB Dimension for HTSSOP package
COPPER AREA (cm2)DIMENSION (A) (mm)
1 cm213.31 mm
2 cm217.64 mm
4 cm223.62 mm
8 cm231.98 mm
16 cm243.76 mm
32 cm260.36 mm
Table 8-5 PCB Dimension for VQFN package
COPPER AREA (cm2)DIMENSION (A) (mm)
1 cm210.00 mm
2 cm214.14 mm
4 cm220.00 mm
8 cm228.28 mm
16 cm240.00 mm
32 cm256.57 mm