SLVSEE8B November   2019  – May 2021 DRV8899-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 Indexer Timing Requirements
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Stepper Motor Driver Current Ratings
        1. 7.3.1.1 Peak Current Rating
        2. 7.3.1.2 rms Current Rating
        3. 7.3.1.3 Full-Scale Current Rating
      2. 7.3.2  PWM Motor Drivers
      3. 7.3.3  Microstepping Indexer
      4. 7.3.4  Controlling VREF with an MCU DAC
      5. 7.3.5  Current Regulation
      6. 7.3.6  Decay Modes
        1. 7.3.6.1 Slow Decay for Increasing and Decreasing Current
        2. 7.3.6.2 Slow Decay for Increasing Current, Mixed Decay for Decreasing Current
        3. 7.3.6.3 Mode 4: Slow Decay for Increasing Current, Fast Decay for Decreasing current
        4. 7.3.6.4 Mixed Decay for Increasing and Decreasing Current
        5. 7.3.6.5 Smart tune Dynamic Decay
        6. 7.3.6.6 Smart tune Ripple Control
      7. 7.3.7  Blanking Time
      8. 7.3.8  Charge Pump
      9. 7.3.9  Linear Voltage Regulators
      10. 7.3.10 Logic Level Pin Diagrams
        1. 7.3.10.1 nFAULT Pin
      11. 7.3.11 Protection Circuits
        1. 7.3.11.1 VM Undervoltage Lockout (UVLO)
        2. 7.3.11.2 VCP Undervoltage Lockout (CPUV)
        3. 7.3.11.3 Overcurrent Protection (OCP)
          1. 7.3.11.3.1 Latched Shutdown (OCP_MODE = 0b)
          2. 7.3.11.3.2 Automatic Retry (OCP_MODE = 1b)
        4. 7.3.11.4 Open-Load Detection (OL)
        5. 7.3.11.5 Thermal Shutdown (OTSD)
          1. 7.3.11.5.1 Latched Shutdown (OTSD_MODE = 0b)
          2. 7.3.11.5.2 Automatic Recovery (OTSD_MODE = 1b)
        6. 7.3.11.6 Overtemperature Warning (OTW)
        7. 7.3.11.7 Undertemperature Warning (UTW)
        8.      
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode (nSLEEP = 0)
      2. 7.4.2 Disable Mode (nSLEEP = 1, DRVOFF = 1)
      3. 7.4.3 Operating Mode (nSLEEP = 1, DRVOFF = 0)
      4. 7.4.4 nSLEEP Reset Pulse
      5.     
    5. 7.5 Programming
      1. 7.5.1 Serial Peripheral Interface (SPI) Communication
        1. 7.5.1.1 SPI Format
        2. 7.5.1.2 SPI for a Single Slave Device
        3. 7.5.1.3 SPI for Multiple Slave Devices in Parallel Configuration
        4. 7.5.1.4 SPI for Multiple Slave Devices in Daisy Chain Configuration
    6. 7.6 Register Maps
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stepper Motor Speed
        2. 8.2.2.2 Current Regulation
        3. 8.2.2.3 Decay Modes
      3. 8.2.3 Application Curves
      4. 8.2.4 Thermal Application
        1. 8.2.4.1 Power Dissipation
          1. 8.2.4.1.1 Conduction Loss
          2. 8.2.4.1.2 Switching Loss
          3. 8.2.4.1.3 Power Dissipation Due to Quiescent Current
          4. 8.2.4.1.4 Total Power Dissipation
        2. 8.2.4.2 PCB Types
        3. 8.2.4.3 Thermal Parameters for HTSSOP Package
        4. 8.2.4.4 Thermal Parameters for VQFN Package
        5. 8.2.4.5 Device Junction Temperature Estimation
  9. Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
Switching Loss

The power loss due to the PWM switching frequency depends on the slew rate (tSR), supply voltage, motor RMS current and the PWM switching frequency. The switching losses in each H-bridge during rise-time and fall-time are calculated as shown in Equation 6 and Equation 7.

Equation 6. PSW_RISE = 0.5 x VVM x IRMS x tRISE_PWM x fPWM
Equation 7. PSW_FALL = 0.5 x VVM x IRMS x tFALL_PWM x fPWM

Both tRISE_PWM and tFALL_PWM can be approximated as VVM/ tSR. After substituting the values of various parameters, and assuming 105 V/µs slew rate and 30-kHz PWM frequency, the switching losses in each H-bridge are calculated as shown below -

Equation 8. PSW_RISE = 0.5 x 13.5-V x (500-mA / √2) x (13.5-V / 105 V/µs) x 30-kHz = 9.2-mW
Equation 9. PSW_FALL = 0.5 x 13.5-V x (500-mA / √2) x (13.5-V / 105 V/µs) x 30-kHz = 9.2-mW

The total switching loss (PSW) is calculated as twice the sum of rise-time (PSW_RISE) switching loss and fall-time (PSW_FALL) switching loss as shown below -

Equation 10. PSW = 2 x (PSW_RISE + PSW_FALL) = 2 x (9.2-mW + 9.2-mW) = 36.8-mW
Note:

The rise-time (tRISE) and the fall-time (tFALL) are calculated based on typical values of the slew rate (tSR). This parameter is expected to change based on the supply-voltage, temperature and device to device variation.

The switching loss is inversely proportional to the output slew rate. 10 V/µs slew rate will result in approximately ten times higher switching loss than 105 V/µs slew rate. However, lower slew rates tend to result in better EMC performance of the driver. A careful trade-off analysis needs to be performed to arrive at an appropriate slew rate for an application.

The switching loss is directly proportional to the PWM switching frequency. The PWM frequency in an application will depend on the supply voltage, inductance of the motor coil, back emf voltage and OFF time or the ripple current (for smart tune ripple control decay mode).