ZHCSHY3C April   2018  – December 2020 DLPC3478

PRODUCTION DATA  

1. 1 特性
2. 2 应用
3. 3 说明
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  ESD Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information
   5. 6.5  Power Electrical Characteristics
   6. 6.6  Pin Electrical Characteristics
   7. 6.7  Internal Pullup and Pulldown Electrical Characteristics
   8. 6.8  DMD Sub-LVDS Interface Electrical Characteristics
   9. 6.9  DMD Low-Speed Interface Electrical Characteristics
   10. 6.10 System Oscillator Timing Requirements
   11. 6.11 Power Supply and Reset Timing Requirements
   12. 6.12 Parallel Interface Frame Timing Requirements
   13. 6.13 Parallel Interface General Timing Requirements
   14. 6.14 BT656 Interface General Timing Requirements
   15. 6.15 Flash Interface Timing Requirements
   16. 6.16 Other Timing Requirements
   17. 6.17 DMD Sub-LVDS Interface Switching Characteristics
   18. 6.18 DMD Parking Switching Characteristics
   19. 6.19 Chipset Component Usage Specification
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1  Input Source
         1. 7.3.1.1 Supported Resolution and Frame Rates
         2. 7.3.1.2 3D Display
         3. 7.3.1.3 Parallel Interface
            1. 7.3.1.3.1 PDATA Bus – Parallel Interface Bit Mapping Modes
      2. 7.3.2  Pattern Display
         1. 7.3.2.1 External Pattern Mode
            1. 7.3.2.1.1 8-bit Monochrome Patterns
            2. 7.3.2.1.2 1-Bit Monochrome Patterns
         2. 7.3.2.2 Internal Pattern Mode
            1. 7.3.2.2.1 Free Running Mode
            2. 7.3.2.2.2 Trigger In Mode
      3. 7.3.3  Device Startup
      4. 7.3.4  SPI Flash
         1. 7.3.4.1 SPI Flash Interface
         2. 7.3.4.2 SPI Flash Programming
      5. 7.3.5  I2C Interface
      6. 7.3.6  Content Adaptive Illumination Control (CAIC)
      7. 7.3.7  Local Area Brightness Boost (LABB)
      8. 7.3.8  3D Glasses Operation
      9. 7.3.9  Test Point Support
      10. 7.3.10 DMD Interface
          1. 7.3.10.1 Sub-LVDS (HS) Interface
   4. 7.4 Device Functional Modes
   5. 7.5 Programming
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Pattern projector for 3D depth scanning
         1. 8.2.1.1 Design Requirements
         2. 8.2.1.2 Detailed Design Procedure
         3. 8.2.1.3 Application Curve
      2. 8.2.2 3D Depth Scanner Using Internal Pattern Streaming Mode
         1. 8.2.2.1 Design Requirements
         2. 8.2.2.2 Detailed Design Procedure
         3. 8.2.2.3 Application Curve
9. 9 Power Supply Recommendations
   1. 9.1 PLL Design Considerations
   2. 9.2 System Power-Up and Power-Down Sequence
   3. 9.3 Power-Up Initialization Sequence
   4. 9.4 DMD Fast Park Control (PARKZ)
   5. 9.5 Hot Plug I/O Usage
10. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 PLL Power Layout
       2. 10.1.2 Reference Clock Layout
          1. 10.1.2.1 Recommended Crystal Oscillator Configuration
       3. 10.1.3 Unused Pins
       4. 10.1.4 DMD Control and Sub-LVDS Signals
       5. 10.1.5 Layer Changes
       6. 10.1.6 Stubs
       7. 10.1.7 Terminations
       8. 10.1.8 Routing Vias
       9. 10.1.9 Thermal Considerations
    2. 10.2 Layout Example
11. 11Device and Documentation Support
    1. 11.1 Device Support
       1. 11.1.1 第三方产品免责声明
       2. 11.1.2 Device Nomenclature
          1. 11.1.2.1 Device Markings
       3. 11.1.3 Video Timing Parameter Definitions
    2. 11.2 Documentation Support
       1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
12. 12Mechanical, Packaging, and Orderable Information