ZHCSQ84D october   2022  – july 2023 AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
    1. 3.1 功能方框图
  5. 4 Revision History
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
      1. 6.1.1 ZCZ Pin Diagram
    2. 6.2 Pin Attributes
      1.      13
      2.      14
    3. 6.3 Signal Descriptions
      1.      16
      2. 6.3.1  ADC
        1.       18
        2.       19
        3.       20
        4.       21
        5.       22
        6. 6.3.1.1 ADC-CMPSS Signal Connections
      3. 6.3.2  ADC_CAL
        1.       25
      4. 6.3.3  ADC VREF
        1.       27
      5. 6.3.4  CPSW
        1.       29
        2.       30
        3.       31
        4.       32
        5.       33
        6.       34
        7.       35
      6. 6.3.5  CPTS
        1.       37
      7. 6.3.6  DAC
        1.       39
      8. 6.3.7  Emulation and Debug
        1.       41
        2.       42
      9. 6.3.8  EPWM
        1.       44
        2.       45
        3.       46
        4.       47
        5.       48
        6.       49
        7.       50
        8.       51
        9.       52
        10.       53
        11.       54
        12.       55
        13.       56
        14.       57
        15.       58
        16.       59
        17.       60
        18.       61
        19.       62
        20.       63
        21.       64
        22.       65
        23.       66
        24.       67
        25.       68
        26.       69
        27.       70
        28.       71
        29.       72
        30.       73
        31.       74
        32.       75
      10. 6.3.9  EQEP
        1.       77
        2.       78
        3.       79
      11. 6.3.10 FSI
        1.       81
        2.       82
        3.       83
        4.       84
        5.       85
        6.       86
        7.       87
        8.       88
      12. 6.3.11 GPIO
        1.       90
      13. 6.3.12 GPMC
        1.       92
      14. 6.3.13 I2C
        1.       94
        2.       95
        3.       96
        4.       97
        5.       98
      15. 6.3.14 LIN
        1.       100
        2.       101
        3.       102
        4.       103
        5.       104
      16. 6.3.15 MCAN
        1.       106
        2.       107
        3.       108
        4.       109
      17. 6.3.16 SPI (MCSPI)
        1.       111
        2.       112
        3.       113
        4.       114
        5.       115
      18. 6.3.17 MMC
        1.       117
      19. 6.3.18 Power Supply
        1.       119
      20. 6.3.19 PRU-ICSS
        1.       121
        2.       122
        3.       123
        4.       124
        5.       125
      21. 6.3.20 QSPI
        1.       127
      22. 6.3.21 Reserved
        1.       129
      23. 6.3.22 SDFM
        1.       131
        2.       132
      24. 6.3.23 System and Miscellaneous
        1. 6.3.23.1 Boot Mode Configuration
          1.        135
        2. 6.3.23.2 Clocking
          1.        137
          2.        138
          3.        139
        3. 6.3.23.3 SYSTEM
          1.        141
        4. 6.3.23.4 VMON
          1.        143
      25. 6.3.24 UART
        1.       145
        2.       146
        3.       147
        4.       148
        5.       149
        6.       150
      26. 6.3.25 XBAR
        1.       152
    4. 6.4 Pin Connectivity Requirements
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Electrostatic Discharge (ESD) Extended Automotive Ratings
    3. 7.3  Electrostatic Discharge (ESD) Industrial Ratings
    4. 7.4  Power-On Hours (POH) Summary
      1. 7.4.1 Automotive Temperature Profile
    5. 7.5  Recommended Operating Conditions
    6. 7.6  Operating Performance Points
    7. 7.7  Power Consumption Summary
      1. 7.7.1 Power Consumption - Maximum
      2. 7.7.2 Power Consumption - Typical
      3. 7.7.3 Power Consumption - Traction Inverter
    8. 7.8  Electrical Characteristics
      1. 7.8.1 Digital and Analog IO Electrical Characteristics
      2. 7.8.2 Analog-to-Digital Converter (ADC)
      3. 7.8.3 Comparator Subsystem A (CMPSSA)
      4. 7.8.4 Comparator Subsystem B (CMPSSB)
      5. 7.8.5 Digital-to-Analog Converter (DAC)
      6. 7.8.6 Power Management Unit (PMU)
      7. 7.8.7 Safety Comparators
    9. 7.9  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.9.1 VPP Specifications
      2. 7.9.2 Hardware Requirements
      3. 7.9.3 Programming Sequence
      4. 7.9.4 Impact to Your Hardware Warranty
    10. 7.10 Thermal Resistance Characteristics
      1. 7.10.1 Package Thermal Characteristics
    11. 7.11 Timing and Switching Characteristics
      1. 7.11.1 Timing Parameters and Information
      2. 7.11.2 Power Supply Sequencing
        1. 7.11.2.1 Power-On and Reset Sequencing
          1. 7.11.2.1.1 Power Reset Sequence Description
        2. 7.11.2.2 Power-Down Sequencing
      3. 7.11.3 System Timing
        1. 7.11.3.1 System Timing Conditions
        2. 7.11.3.2 Reset Timing
          1. 7.11.3.2.1 PORz Timing Requirements
          2.        191
          3. 7.11.3.2.2 WARMRSTn Switching Characteristics
          4.        193
          5. 7.11.3.2.3 WARMRSTn Timing Requirements
          6.        195
        3. 7.11.3.3 Safety Signal Timing
          1. 7.11.3.3.1 SAFETY_ERRORn Switching Characteristics
          2.        198
      4. 7.11.4 Clock Specifications
        1. 7.11.4.1 Input Clocks / Oscillators
          1. 7.11.4.1.1 Crystal Oscillator (XTAL) Parameters
          2. 7.11.4.1.2 External Clock Characteristics
        2. 7.11.4.2 Clock Timing
          1. 7.11.4.2.1 Clock Timing Requirements
          2.        205
          3. 7.11.4.2.2 Clock Switching Characteristics
          4.        207
      5. 7.11.5 Peripherals
        1. 7.11.5.1  2-port Gigabit Ethernet MAC (CPSW)
          1. 7.11.5.1.1 CPSW MDIO Timing
            1. 7.11.5.1.1.1 CPSW MDIO Timing Conditions
            2. 7.11.5.1.1.2 CPSW MDIO Timing Requirements
            3. 7.11.5.1.1.3 CPSW MDIO Switching Characteristics
            4.         214
          2. 7.11.5.1.2 CPSW RMII Timing
            1. 7.11.5.1.2.1 CPSW RMII Timing Conditions
            2. 7.11.5.1.2.2 CPSW RMII[x]_REFCLK Timing Requirements - RMII Mode
            3.         218
            4. 7.11.5.1.2.3 CPSW RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RXER Timing Requirements - RMII Mode
            5.         220
            6. 7.11.5.1.2.4 CPSW RMII[x]_TXD[1:0], and RMII[x]_TXEN Switching Characteristics - RMII Mode
            7.         222
          3. 7.11.5.1.3 CPSW RGMII Timing
            1. 7.11.5.1.3.1 CPSW RGMII Timing Conditions
            2. 7.11.5.1.3.2 CPSW RGMII[x]_RCLK Timing Requirements - RGMII Mode
            3. 7.11.5.1.3.3 CPSW RGMII[x]_RD[3:0], and RGMII[x]_RCTL Timing Requirements
            4.         227
            5. 7.11.5.1.3.4 CPSW RGMII[x]_TCLK Switching Characteristics - RGMII Mode
            6. 7.11.5.1.3.5 CPSW RGMII[x]_TD[3:0], and RGMII[x]_TCTL Switching Characteristics - RGMII Mode
            7.         230
        2. 7.11.5.2  Enhanced Capture (eCAP)
          1. 7.11.5.2.1 ECAP Timing Conditions
          2. 7.11.5.2.2 ECAP Timing Requirements
          3.        234
          4. 7.11.5.2.3 ECAP Switching Characteristics
          5.        236
        3. 7.11.5.3  Enhanced Pulse Width Modulation (ePWM)
          1. 7.11.5.3.1 EPWM Timing Conditions
          2. 7.11.5.3.2 EPWM Timing Requirements
          3.        240
          4. 7.11.5.3.3 EPWM Switching Characteristics
          5.        242
          6.        EPWM Characteristics
        4. 7.11.5.4  Enhanced Quadrature Encoder Pulse (eQEP)
          1. 7.11.5.4.1 EQEP Timing Conditions
          2. 7.11.5.4.2 EQEP Timing Requirements
          3.        247
          4. 7.11.5.4.3 EQEP Switching Characteristics
        5. 7.11.5.5  Fast Serial Interface (FSI)
          1. 7.11.5.5.1 FSI Timing Conditions
          2. 7.11.5.5.2 FSIRX Timing Requirements
          3.        252
          4. 7.11.5.5.3 FSIRX Switching Characteristics
          5. 7.11.5.5.4 FSITX Switching Characteristics
          6.        255
          7. 7.11.5.5.5 FSITX SPI Signaling Mode Switching Characteristics
          8.        257
        6. 7.11.5.6  General Purpose Input/Output (GPIO)
          1. 7.11.5.6.1 GPIO Timing Conditions
          2. 7.11.5.6.2 GPIO Timing Requirements
          3. 7.11.5.6.3 GPIO Switching Characteristics
        7. 7.11.5.7  General Purpose Memory Controller (GPMC)
          1. 7.11.5.7.1 GPMC Timing Conditions
          2. 7.11.5.7.2 GPMC/NOR Flash Timing Requirements - Synchronous Mode 100MHz
          3. 7.11.5.7.3 GPMC/NOR Flash Switching Characteristics - Synchronous Mode 100MHz
          4.        266
          5. 7.11.5.7.4 GPMC/NOR Flash Timing Requirements - Asynchronous Mode 100MHz
          6. 7.11.5.7.5 GPMC/NOR Flash Switching Characteristics - Asynchronous Mode 100MHz
          7.        269
          8. 7.11.5.7.6 GPMC/NAND Flash Timing Requirements - Asynchronous Mode 100MHz
          9. 7.11.5.7.7 GPMC/NAND Flash Switching Characteristics - Asynchronous Mode 100MHz
          10.        272
        8. 7.11.5.8  Inter-Integrated Circuit (I2C)
          1. 7.11.5.8.1 I2C
        9. 7.11.5.9  Local Interconnect Network (LIN)
          1. 7.11.5.9.1 LIN Timing Conditions
          2. 7.11.5.9.2 LIN Timing Requirements
          3. 7.11.5.9.3 LIN Switching Characteristics
        10. 7.11.5.10 Modular Controller Area Network (MCAN)
          1. 7.11.5.10.1 MCAN Timing Conditions
          2. 7.11.5.10.2 MCAN Switching Characteristics
        11. 7.11.5.11 Serial Peripheral Interface (SPI)
          1. 7.11.5.11.1 SPI Timing Conditions
          2. 7.11.5.11.2 SPI Controller Mode Timing Requirements
          3.        285
          4. 7.11.5.11.3 SPI Controller Mode Switching Characteristics (Clock Phase = 0)
          5.        287
          6. 7.11.5.11.4 SPI Peripheral Mode Timing Requirements
          7.        289
          8. 7.11.5.11.5 SPI Peripheral Mode Switching Characteristics
          9.        291
        12. 7.11.5.12 Multi-Media Card/Secure Digital (MMCSD)
          1. 7.11.5.12.1 MMC Timing Conditions
          2. 7.11.5.12.2 MMC Timing Requirements - SD Card Default Speed Mode
          3.        295
          4. 7.11.5.12.3 MMC Switching Characteristics - SD Card Default Speed Mode
          5.        297
          6. 7.11.5.12.4 MMC Timing Requirements - SD Card High Speed Mode
          7.        299
          8. 7.11.5.12.5 MMC Switching Characteristics - SD Card High Speed Mode
          9.        301
        13. 7.11.5.13 Quad Serial Peripheral Interface (QSPI)
          1. 7.11.5.13.1 QSPI Timing Conditions
          2. 7.11.5.13.2 QSPI Timing Requirements
          3.        305
          4. 7.11.5.13.3 QSPI Switching Characteristics
          5.        307
        14. 7.11.5.14 Programmable Real-Time Unit and Industrial Communication Subsystem (PRU-ICSS)
          1. 7.11.5.14.1 PRU-ICSS Programmable Real-Time Unit (PRU)
            1. 7.11.5.14.1.1 PRU-ICSS PRU Timing Conditions
            2. 7.11.5.14.1.2 PRU-ICSS PRU Switching Characteristics - Direct Output Mode
            3.         312
            4. 7.11.5.14.1.3 PRU-ICSS PRU Timing Requirements - Parallel Capture Mode
            5.         314
            6. 7.11.5.14.1.4 PRU-ICSS PRU Timing Requirements - Shift In Mode
            7.         316
            8. 7.11.5.14.1.5 PRU-ICSS PRU Switching Characteristics - Shift Out Mode
            9.         318
          2. 7.11.5.14.2 PRU-ICSS PRU Sigma Delta and Peripheral Interface
            1. 7.11.5.14.2.1 PRU-ICSS PRU Sigma Delta and Peripheral Interface Timing Conditions
            2. 7.11.5.14.2.2 PRU-ICSS PRU Timing Requirements - Sigma Delta Mode
            3.         322
            4. 7.11.5.14.2.3 PRU-ICSS PRU Timing Requirements - Peripheral Interface Mode
            5.         324
            6. 7.11.5.14.2.4 PRU-ICSS PRU Switching Characteristics - Peripheral Interface Mode
            7.         326
          3. 7.11.5.14.3 PRU-ICSS Pulse Width Modulation (PWM)
            1. 7.11.5.14.3.1 PRU-ICSS PWM Timing Conditions
            2. 7.11.5.14.3.2 PRU-ICSS PWM Switching Characteristics
            3.         330
          4. 7.11.5.14.4 PRU-ICSS Industrial Ethernet Peripheral (IEP)
            1. 7.11.5.14.4.1 PRU-ICSS IEP Timing Conditions
            2. 7.11.5.14.4.2 PRU-ICSS IEP Timing Requirements - Input Validated with SYNCx
            3.         334
            4. 7.11.5.14.4.3 PRU-ICSS IEP Timing Requirements - Digital IOs
            5.         336
            6. 7.11.5.14.4.4 PRU-ICSS IEP Timing Requirements - LATCHx_IN
            7.         338
          5. 7.11.5.14.5 PRU-ICSS Universal Asynchronous Receiver Transmitter (UART)
            1. 7.11.5.14.5.1 PRU-ICSS UART Timing Conditions
            2. 7.11.5.14.5.2 PRU-ICSS UART Timing Requirements
            3. 7.11.5.14.5.3 PRU-ICSS UART Switching Characteristics
            4.         343
          6. 7.11.5.14.6 PRU-ICSS Enhanced Capture Peripheral (ECAP)
            1. 7.11.5.14.6.1 PRU-ICSS ECAP Timing Conditions
            2. 7.11.5.14.6.2 PRU-ICSS ECAP Timing Requirements
            3.         347
            4. 7.11.5.14.6.3 PRU-ICSS ECAP Switching Characteristics
            5.         349
          7. 7.11.5.14.7 PRU-ICSS MDIO and MII
            1. 7.11.5.14.7.1 PRU-ICSS MDIO Timing
              1. 7.11.5.14.7.1.1 PRU-ICSS MDIO Timing Conditions
              2. 7.11.5.14.7.1.2 PRU-ICSS MDIO Timing Requirements
              3. 7.11.5.14.7.1.3 PRU-ICSS MDIO Switching Characteristics
              4.          355
            2. 7.11.5.14.7.2 PRU-ICSS MII Timing
              1. 7.11.5.14.7.2.1 PRU-ICSS MII Timing Conditions
              2. 7.11.5.14.7.2.2 PRU-ICSS MII Timing Requirements - MII[x]_RX_CLK
              3.          359
              4. 7.11.5.14.7.2.3 PRU-ICSS MII Timing Requirements - MII[x]_RXD[3:0], MII[x]_RX_DV, and MII[x]_RX_ER
              5.          361
              6. 7.11.5.14.7.2.4 PRU-ICSS MII Switching Characteristics - MII[x]_TX_CLK
              7.          363
              8. 7.11.5.14.7.2.5 PRU-ICSS MII Switching Characteristics - MII[x]_TXD[3:0] and MII[x]_TXEN
              9.          365
        15. 7.11.5.15 Sigma Delta Filter Module (SDFM)
          1. 7.11.5.15.1 SDFM Timing Conditions
          2. 7.11.5.15.2 SDFM Switching Characteristics
        16. 7.11.5.16 Universal Asynchronous Receiver/Transmitter (UART)
          1. 7.11.5.16.1 UART Timing Conditions
          2. 7.11.5.16.2 UART Timing Requirements
          3. 7.11.5.16.3 UART Switching Characteristics
          4.        373
      6. 7.11.6 Emulation and Debug
        1. 7.11.6.1 JTAG
          1. 7.11.6.1.1 JTAG Timing Conditions
          2. 7.11.6.1.2 JTAG Timing Requirements
          3. 7.11.6.1.3 JTAG Switching Characteristics
          4.        379
        2. 7.11.6.2 Trace
          1. 7.11.6.2.1 Debug Trace Timing Conditions
          2. 7.11.6.2.2 Debug Trace Switching Characteristics
          3.        383
    12. 7.12 Decoupling Capacitor Requirements
      1. 7.12.1 Decoupling Capacitor Requirements
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-R5F Subsystem
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Device Connection and Layout Fundamentals
      1. 9.1.1 External Oscillator
      2. 9.1.2 JTAG, EMU, and TRACE
      3. 9.1.3 Hardware Design Guide
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ZCZ|324
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

AM263x Sitara™ Arm® 微控制器旨在满足下一代工业和汽车嵌入式产品复杂的实时处理需求。AM263x MCU 系列包含多个具有多达四个 400MHz Arm® Cortex®-R5F 内核的引脚对引脚兼容器件。可选择将 Arm® R5F 子系统编程为在锁步或双核模式下运行，从而实现多种功能安全配置。工业通信子系统 (PRU-ICSS) 支持集成工业以太网通信协议（例如 PROFINET®、TSN、Ethernet/IP®、EtherCAT® 以及多个其他协议）、标准以太网连接和自定义 I/O 接口。该系列面向使用高级模拟感应和数字驱动模块的未来电机控制和数字电源应用而设计。

多个 R5F 内核排列成具有 256KB 共享紧耦合存储器 (TCM) 和 2MB 共享 SRAM 的集群子系统，显著降低了对外部存储器的需求。片上存储器、外设和互联中包含广泛的 ECC，增强了可靠性。由硬件安全管理器 (HSM) 管理的粒度防火墙支持开发人员满足严格的安全敏感型系统设计要求。AM263x 器件还提供加解密加速和安全启动功能。

TI 为 AM263x 系列微控制器提供了一整套微控制器软件和开发工具。

封装信息
器件型号(1)(2) 封装 封装尺寸
AM2634...ZCZ nFBGA（324 引脚） 15.0mm × 15.0mm
AM2632...ZCZ nFBGA（324 引脚） 15.0mm × 15.0mm
AM2631...ZCZ nFBGA（324 引脚） 15.0mm × 15.0mm
AM2634...ZCZQ1 nFBGA（324 引脚） 15.0mm × 15.0mm
AM2632...ZCZQ1 nFBGA（324 引脚） 15.0mm × 15.0mm
AM2631...ZCZQ1 nFBGA（324 引脚） 15.0mm × 15.0mm
(1) 如需更多信息，请参阅节 11机械、封装和可订购信息。
(2) 所有器件均采用托盘或卷带包装。