ZHCSIS6B
September 2018 – December 2018
ADS1278-SP
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
简化原理图
4
修订历史记录
5
说明 (续)
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements: SPI Format
7.7
Timing Requirements: Frame-Sync Format
7.8
Quality Conformance Inspection
7.9
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Sampling Aperture Matching
8.3.2
Frequency Response
8.3.2.1
High-Speed, Low-Power, And Low-Speed Modes
8.3.2.2
High-Resolution Mode
8.3.3
Phase Response
8.3.4
Settling Time
8.3.5
Data Format
8.3.6
Analog Inputs (AINP, AINN)
8.3.7
Voltage Reference Inputs (VREFP, VREFN)
8.3.8
Clock Input (CLK)
8.3.9
Mode Selection (MODE)
8.3.10
Synchronization (SYNC)
8.3.11
Power-Down (PWDN)
8.3.12
Format[2:0]
8.3.13
Serial Interface Protocols
8.3.14
SPI Serial Interface
8.3.14.1
SCLK
8.3.14.2
DRDY/FSYNC (SPI Format)
8.3.14.3
DOUT
8.3.14.4
DIN
8.3.15
Frame-Sync Serial Interface
8.3.15.1
SCLK
8.3.15.2
DRDY/FSYNC (Frame-Sync Format)
8.3.15.3
DOUT
8.3.15.4
DIN
8.3.16
DOUT Modes
8.3.16.1
TDM Mode
8.3.16.2
TDM Mode, Fixed-Position Data
8.3.16.3
TDM Mode, Dynamic Position Data
8.3.16.4
Discrete Data Output Mode
8.3.17
Daisy-Chaining
8.3.18
Modulator Output
8.3.19
Pin Test Using Test[1:0] Inputs
8.3.20
VCOM Output
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
器件和文档支持
12.1
接收文档更新通知
12.2
社区资源
12.3
商标
12.4
静电放电警告
12.5
术语表
13
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
HFQ|84
MCQF017A
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsis6b_oa
2
应用
空间系统(卫星、摆渡车、站点)
卫星温度和位置检测
轨道观测系统
精密且科学 应用
高精度仪器