ZHCSPB0 april   2023 LM5171-Q1

ADVANCE INFORMATION  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Bias Supplies and Voltage Reference (VCC, VDD, and VREF)
      2. 7.3.2  Undervoltage Lockout (UVLO) and Controller Enable or Disable
      3. 7.3.3  High Voltage Inputs (HV1, HV2)
      4. 7.3.4  Current Sense Amplifier
      5. 7.3.5  Control Commands
        1. 7.3.5.1 Channel Enable Commands (EN1, EN2)
        2. 7.3.5.2 Direction Command (DIR1 and DIR2)
        3. 7.3.5.3 Channel Current Setting Commands (ISET1 and ISET2)
      6. 7.3.6  Channel Current Monitor (IMON1, IMON2)
        1. 7.3.6.1 Individual Channel Current Monitor
        2. 7.3.6.2 Multiphase Total Current Monitoring
      7. 7.3.7  Cycle-by-Cycle Peak Current Limit (IPK)
      8. 7.3.8  Inner Current Loop Error Amplifier
      9. 7.3.9  Outer Voltage Loop Error Amplifier
      10. 7.3.10 Soft Start, Diode Emulation, and Forced PWM Control (SS/DEM1 and SS/DEM2)
        1. 7.3.10.1 Soft-Start Control by the SS/DEM Pins
        2. 7.3.10.2 DEM Programming
        3. 7.3.10.3 FPWM Programming and Dynamic FPWM and DEM Change
        4. 7.3.10.4 SS Pin as the Restart Timer
      11. 7.3.11 Gate Drive Outputs, Dead Time Programming and Adaptive Dead Time (HO1, HO2, LO1, LO2, DT/SD)
      12. 7.3.12 Emergent Latched Shutdown (DT/SD)
      13. 7.3.13 PWM Comparator
      14. 7.3.14 Oscillator (OSC)
      15. 7.3.15 Synchronization to an External Clock (SYNCI, SYNCO)
      16. 7.3.16 Overvoltage Protection (OVP)
      17. 7.3.17 Multiphase Configurations (SYNCO, OPT)
        1. 7.3.17.1 Multiphase in Star Configuration
        2. 7.3.17.2 Daisy-Chain Configurations for 2, 3, or 4 Phases parallel operations
        3. 7.3.17.3 Daisy-Chain configuration for 6 or 8 phases parallel operation
      18. 7.3.18 Thermal Shutdown
    4. 7.4 Programming
      1. 7.4.1 Dynamic Dead Time Adjustment
      2. 7.4.2 UVLO Programming
    5. 7.5 I2C Serial Interface
      1. 7.5.1 REGFIELD Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Small Signal Model
        1. 8.1.1.1 Current Loop Small Signal Model
        2. 8.1.1.2 Current Loop Compensation
        3. 8.1.1.3 Voltage Loop Small Signal Model
        4. 8.1.1.4 Voltage Loop Compensation
    2. 8.2 Typical Application
      1. 8.2.1 60-A, Dual-Phase, 48-V to 12-V Bidirectional Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Determining the Duty Cycle
          2. 8.2.1.2.2  Oscillator Programming
          3. 8.2.1.2.3  Power Inductor, RMS and Peak Currents
          4. 8.2.1.2.4  Current Sense (RCS)
          5. 8.2.1.2.5  Current Setting Limits (ISETx)
          6. 8.2.1.2.6  Peak Current Limit
          7. 8.2.1.2.7  Power MOSFETS
          8. 8.2.1.2.8  Bias Supply
          9. 8.2.1.2.9  Boot Strap
          10. 8.2.1.2.10 OVP
          11. 8.2.1.2.11 Dead Time
          12. 8.2.1.2.12 Channel Current Monitor (IMONx)
          13. 8.2.1.2.13 UVLO Pin Usage
          14. 8.2.1.2.14 HVx Pin Configuration
          15. 8.2.1.2.15 Loop Compensation
          16. 8.2.1.2.16 Soft Start
          17. 8.2.1.2.17 PWM to ISET Pins
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  10. 10Mechanical, Packaging, and Orderable Information

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6.1 Absolute Maximum Ratings

Over the recommended operating junction temperature range(1)
MIN MAX UNIT
Input HV1, HV2 to AGND –0.3 85 V
HV1, HV2 to AGND (50ns Transient) 90
SW1, SW2 to PGND -5 85
SW1, SW2 to PGND (20ns Transient) 90
SW1, SW2 to PGND (50ns Transient) -16
HB1 to SW1, HB2 to SW2 –0.3 14
HO1 to SW1, HO2 to SW2 –0.3 HB+0.3
HO1 to SW1, HO2 to SW2 (20ns Transient) –2
LO1, LO2 to PGND -0.3 VCC+0.3
LO1, LO2 to PGND (20ns Transient) -2
CSA1, CSB1,CSA2,CSB2 to PGND -5.0 80
CSA1 to CSB1, CSA2 to CSB2 -0.3 0.3
CFG, DIR1, DIR2, EN1, EN2, FBHV, FBLV, IPK, ISET1, ISET2, OPT, OVP, SCL, SDA, SYNCI, UVLO, VDD, VSET to AGND -0.3 5.5
COMP1, COMP2, DT/SD, ERRHV, ERRLV, IMON1, IMON2, OSC,  SS/DEM1, SS/DEM2, SYNCO, VREF to AGND -0.3 VDD+0.3
LDODRV TO VCC -0.3 5
VCC to PGND -0.3 14
PGND to AGND –0.3 0.3
Junction temperature, TJ(2) –40 150 °C
Storage temperature, Tstg –55 150
(1) Operation outside the Section 6.1 may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Section 6.3. If used outside the Section 6.3 but within the Section 6.1, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.