LMV774
(Unless otherwise noted, typical values at VS = 2.7V)
| Guaranteed 2.7V and 5V specifications | |
| Maximum VOS (LMV771) | 850μV (limit) |
| f = 100 Hz | 12.5nV/ |
| f = 10 kHz | 7.5nV/ |
| RL = 600Ω | 100mV from rail |
| RL = 2kΩ | 50mV from rail |
| Open loop gain with RL = 2kΩ | 100dB |
| VCM | 0 to V |
| Supply current (per amplifier) | 550µA |
| Gain bandwidth product | 3.5MHz |
| Temperature range | −40°C to 125°C |
| LMV772Q is AEC-Q100 Grade 1 qualified and is manufactured on Automotive grade flow |
The LMV771/LMV772/LMV772Q/LMV774 are Single, Dual, and Quad low noise precision operational amplifiers intended for use in a wide range of applications. Other important characteristics of the family include: an extended operating temperature range of −40°C to 125°C, the tiny SC70-5 package for the LMV771, and low input bias current.
The extended temperature range of −40°C to 125°C allows the LMV771/LMV772/LMV772Q/LMV774 to accommodate a broad range of applications. The LMV771 expands National Semiconductor’s Silicon Dust amplifier portfolio offering enhancements in size, speed, and power savings. The LMV771/LMV772/LMV772Q/LMV774 are guaranteed to operate over the voltage range of 2.7V to 5.0V and all have rail-to-rail output.
The LMV771/LMV772/LMV772Q/LMV774 family is designed for precision, low noise, low voltage, and miniature systems. These amplifiers provide rail-to-rail output swing into heavy loads. The maximum input offset voltage for the LMV771 is 850 μV at room temperature and the input common mode voltage range includes ground.
The LMV771 is offered in the tiny SC70-5 package, LMV772/LMV772Q in the space saving MSOP-8 and SOIC-8, and the LMV774 in TSSOP-14.
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | Single/Dual/Quad, Low Offset, Low Noise, RRO Op Amps 数据表 (Rev. F) | 2010年 9月 13日 | |||
| 电子书 | The Signal e-book: 有关运算放大器设计主题的博客文章汇编 | 英语版 | 2018年 1月 31日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点