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精密运算放大器 (Vos<1mV)

TLV2197-Q1

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汽车类、双通道、高电压、精密 RRIO 运算放大器

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数据表

TLV2197-Q1

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产品详情

Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 36 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 4.5 Vos (offset voltage at 25°C) (max) (mV) 0.5 Offset drift (typ) (µV/°C) 1 Input bias current (max) (pA) 20 GBW (typ) (MHz) 10 Features Cost Optimized, EMI Hardened, MUX Friendly, e-Trim™ Slew rate (typ) (V/µs) 20 Rail-to-rail In, Out Iq per channel (typ) (mA) 1 Vn at 1 kHz (typ) (nV√Hz) 5.5 CMRR (typ) (dB) 140 Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Iout (typ) (A) 0.065 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.1 Input common mode headroom (to positive supply) (typ) (V) 0.1 Output swing headroom (to negative supply) (typ) (V) 0.095 Output swing headroom (to positive supply) (typ) (V) 0.095 THD + N at 1 kHz (typ) (%) 0.00008
Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 36 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 4.5 Vos (offset voltage at 25°C) (max) (mV) 0.5 Offset drift (typ) (µV/°C) 1 Input bias current (max) (pA) 20 GBW (typ) (MHz) 10 Features Cost Optimized, EMI Hardened, MUX Friendly, e-Trim™ Slew rate (typ) (V/µs) 20 Rail-to-rail In, Out Iq per channel (typ) (mA) 1 Vn at 1 kHz (typ) (nV√Hz) 5.5 CMRR (typ) (dB) 140 Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Iout (typ) (A) 0.065 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.1 Input common mode headroom (to positive supply) (typ) (V) 0.1 Output swing headroom (to negative supply) (typ) (V) 0.095 Output swing headroom (to positive supply) (typ) (V) 0.095 THD + N at 1 kHz (typ) (%) 0.00008
VSSOP (DGK) 8 14.7 mm² (3 mm × 4.9 mm)
  • AEC-Q100 qualified for automotive applications:
    • Temperature grade 1: –40°C to +125°C, TA
  • Low offset voltage: ±500 µV (maximum)
  • Low noise: 5.5 nV/√Hz at 1 kHz
  • High common-mode rejection: 140 dB
  • Low bias current: ±5 pA
  • Rail-to-rail input and output
  • Wide bandwidth: 10-MHz GBW
  • High slew rate: 20 V/µs
  • Low quiescent current: 1 mA per amplifier
  • Wide supply: ±2.25 V to ±18 V, 4.5 V to 36 V
  • EMI/RFI filtered inputs
  • Differential input-voltage range to supply rail
  • High capacitive load drive capability: 1 nF
  • Industry-standard package:
    • Single channel in very small 8-pin VSSOP
    • Dual channel in 8-pin VSSOP
    • Quad channel in 14-pin TSSOP
  • AEC-Q100 qualified for automotive applications:
    • Temperature grade 1: –40°C to +125°C, TA
  • Low offset voltage: ±500 µV (maximum)
  • Low noise: 5.5 nV/√Hz at 1 kHz
  • High common-mode rejection: 140 dB
  • Low bias current: ±5 pA
  • Rail-to-rail input and output
  • Wide bandwidth: 10-MHz GBW
  • High slew rate: 20 V/µs
  • Low quiescent current: 1 mA per amplifier
  • Wide supply: ±2.25 V to ±18 V, 4.5 V to 36 V
  • EMI/RFI filtered inputs
  • Differential input-voltage range to supply rail
  • High capacitive load drive capability: 1 nF
  • Industry-standard package:
    • Single channel in very small 8-pin VSSOP
    • Dual channel in 8-pin VSSOP
    • Quad channel in 14-pin TSSOP

The TLV197-Q1, TLV2197-Q1 and TLV4197-Q1 (TLVx197-Q1) family of devices are part of a new generation, of low-cost, 36-V, automotive-qualified, operational amplifiers. The TLVx197-Q1 family uses a method of package-level trim for offset and offset temperature drift implemented during the final steps of manufacturing after the plastic molding process. This method minimizes the influence of inherent input transistor mismatch, as well as errors induced during package molding.

Good dc precision and ac performance including rail-to-rail input/output, an optimized cost structure, and AEC-Q100 grade 1 qualification, make this family an excellent choice for low-side current-sensing and signal-conditioning applications in the automotive space.

More unique features, such as a differential input-voltage range to the supply rail, a high output current (±65 mA), a heavy capacitive load drive of up to 1 nF, and a high slew rate (20 V/µs), make these devices a robust, high-performance operational amplifier family for high-voltage automotive applications.

The TLVx197-Q1 family of op amps is available in standard packages and is specified from –40°C to +125°C.

The TLV197-Q1, TLV2197-Q1 and TLV4197-Q1 (TLVx197-Q1) family of devices are part of a new generation, of low-cost, 36-V, automotive-qualified, operational amplifiers. The TLVx197-Q1 family uses a method of package-level trim for offset and offset temperature drift implemented during the final steps of manufacturing after the plastic molding process. This method minimizes the influence of inherent input transistor mismatch, as well as errors induced during package molding.

Good dc precision and ac performance including rail-to-rail input/output, an optimized cost structure, and AEC-Q100 grade 1 qualification, make this family an excellent choice for low-side current-sensing and signal-conditioning applications in the automotive space.

More unique features, such as a differential input-voltage range to the supply rail, a high output current (±65 mA), a heavy capacitive load drive of up to 1 nF, and a high slew rate (20 V/µs), make these devices a robust, high-performance operational amplifier family for high-voltage automotive applications.

The TLVx197-Q1 family of op amps is available in standard packages and is specified from –40°C to +125°C.
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技术文档

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 TLVx197-Q1 Automotive, High-Voltage, Precision, Rail-to-Rail In, Rail-to-Rail Out Op Amp 数据表 (Rev. B) PDF | HTML 2020-7-17
功能安全信息 TLV2197-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA PDF | HTML 2021-11-12
电路设计 使用 PTC 温度传感器电路的宽温度范围线性负温度系数 (PTC) 输出 英语版 PDF | HTML 2021-9-22
电路设计 使用 PTC 温度传感器电路的宽温度范围线性正温度系数 (PTC) 输出 英语版 PDF | HTML 2021-9-22
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设计与开发

如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。

评估板

AMP-PDK-EVM — 放大器高性能开发套件评估模块

放大器高性能开发套件 (PDK) 是一款用于测试常见运算放大器参数的评估模块 (EVM) 套件，与大多数运算放大器和比较器均兼容。该 EVM 套件提供了一个主板，主板上具有多个插槽式子卡选项以满足封装需求，使工程师能够快速评估和验证器件性能。

AMP-PDK-EVM 套件支持五种常用的业界通用封装，包括：

  • D（SOIC-8 和 SOIC-14）
  • PW (TSSOP-14)
  • DGK (VSSOP-8)
  • DBV（SOT23-5 和 SOT23-6）
  • DCK（SC70-5 和 SC70-6）
用户指南: PDF | HTML
支持的产品和硬件
仿真模型

TLVx197-Q1 PSpice Model (Rev. C)

SBOMBB2C.ZIP (30 KB) - PSpice 模型
支持的产品和硬件
仿真模型

TLVx197-Q1 TINA-TI Reference Design (Rev. B)

SBOMBB3B (316 KB) - TINA-TI 参考设计
支持的产品和硬件
仿真模型

TLVx197-Q1 TINA-TI Spice Model (Rev. B)

SBOMBB1B.ZIP (10 KB) - TINA-TI Spice 模型
支持的产品和硬件
计算工具

OPAMP-NOISECALC — Noise Calculator

This folder contains three tools to help in understandning and managing noise in cicuits. The included tools are:

  • A noise generator tool - This is a Lab View 4-Run Time executable that generates Gaussian white noise, uniform white noise, 1/f noise, short noise, and 60Hz line noise. Temporal data, (...)
支持的产品和硬件
封装 引脚 CAD 符号、封装和 3D 模型
VSSOP (DGK) 8 Ultra Librarian
适用于评估类项目的 TI 标准条款与条件。

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