ZHCSDS3C May 2015 – April 2018 ADS52J90
PRODUCTION DATA.
| THERMAL METRIC(1) | ADS52J90 | UNITS | |
|---|---|---|---|
| ZZE (NFBGA) | |||
| 198 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 33.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 4.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 14.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 14.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |