SPRUIF3B May   2017  – March 2019 DRA790 , DRA791 , DRA793 , DRA797

 

  1.   DRA79x EVM CPU board
    1.     Trademarks
    2. 1 Introduction
    3. 2 Overview
      1. 2.1 EVM System Configurations
      2. 2.2 CPU Board Feature List
      3. 2.3 CPU Board Component Identification
    4. 3 Hardware
      1. 3.1 Hardware Architecture
      2. 3.2 DRA71x, DRA79x, TDA2E-17, and AM570x Processor
      3. 3.3 Power Architecture
      4. 3.4 Reset Structure
      5. 3.5 Clocks
      6. 3.6 Memory
        1. 3.6.1  SDRAM Memory
        2. 3.6.2  QSPI Flash Memory
        3. 3.6.3  EMMC Flash Memory
        4. 3.6.4  MicroSD Card Cage
        5. 3.6.5  GPMC NOR Flash Memory
        6. 3.6.6  GPMC NAND Flash Memory
        7. 3.6.7  Boot Modes
        8. 3.6.8  JTAG/Emulator and Trace
        9. 3.6.9  UART Terminal
        10. 3.6.10 DCAN and CAN Interfaces
        11. 3.6.11 Universal Serial Bus (USB)
        12. 3.6.12 Wired Ethernet
        13. 3.6.13 Video Output
          1. 3.6.13.1 HDMI Display
          2. 3.6.13.2 LCD Touch Panel
          3. 3.6.13.3 FPD-Link III Output/Panel
        14. 3.6.14 Video Input
          1. 3.6.14.1 Parallel Imaging
          2. 3.6.14.2 Serial Imaging
        15. 3.6.15 Mini-PCIe
        16. 3.6.16 Media Local Bus (MLB)
        17. 3.6.17 Audio
        18. 3.6.18 COM8 Module Interface
        19. 3.6.19 eFuse Programming Supply
        20. 3.6.20 User Interface LEDs
        21. 3.6.21 Power Monitoring
        22. 3.6.22 I2C Peripheral Map
        23. 3.6.23 GPIO List
        24. 3.6.24 I/O Expander List
        25. 3.6.25 Configuration EEPROM
    5. 4 Signal Multiplex Logic
      1. 4.1 GPMC and QSPI Selection (MUX A)
      2. 4.2 GPMC, VIN1, and VOUT3 Selection (MUX B)
      3. 4.3 GPMC and EMMC Selection (MUX C)
      4. 4.4 VIN2A and EMU Selection (MUX D, MUX E)
      5. 4.5 VIN2A and RGMII1 Selection (MUX F)
      6. 4.6 RGMII0 and VIN1B Selection (MUX J)
      7. 4.7 SPI2 and UART3 Selection (MUX K)
      8. 4.8 DCAN2 and I2C3 Selection (MUX L)
    6. 5 USB3 Supported Configurations
      1. 5.1 Option 1
      2. 5.2 Option 2
      3. 5.3 Option 3
    7. 6 References
  2.   Revision History

2.2 CPU Board Feature List

  • Processor
    • DRA71x, DRA79x, TDA2E-17, and AM570x (superset SoC) (17-mm × 17-mm package, 0.65-mm pitch, with 25 × 25 via-channel array)
    • Support for corresponding socket
  • Power supply
    • 12-V DC input
    • Optimized power management solution
    • Compliant with SoC power sequencing requirements
    • Integrated power measurement
  • PCB
    • Dimension (W × D) 170 mm × 170 mm
    • 100% PTH technology
  • Memory
    • DRAM (DDR3L-1333 with ECC):
      • 2GB (four 4Gb × 8 + one 4Gb × 8 ECC)
    • Quad SPI flash: 256Mb
    • EMMC flash: 8Gb (v.4.51 compliant)
    • NAND flash: 2Gb
    • NOR flash: 512Mb
    • I2C EEPROM, 32Kb
    • MicroSD card cage
  • Boot mode selection DIP switch
  • Digital temperature sensor (TMP102)
  • JTAG/Emulator:
    • 60-pin MIPI™-60 JTAG/Trace connector
    • Adapter for 20-pin CTI header: 10 × 2, 1.27-mm pitch
  • Supported interfaces and peripherals:
    • CAN Interface – 2-wire PHY on DCAN1
    • Two USB host receptacles – one USB 3.0 (micro-USB) and one USB 2.0 (mini-USB)
    • Audio codec (AIC3106) with headphone out, line out, line in, and microphone in
    • Three Video outputs (HDMI, FPD-Link III, LCD)
    • Camera sensors support using the Leopard Imaging Module interface
    • PCIe
    • MLB and MLBP on the MICTOR connector
    • RS-232 using the USB FTDI converter (mini-A/B USB)
    • COM8 module interface for Bluetooth® and WLAN support
    • Two RJ45 Gigabit Ethernet (DP83867)
    • I2C GPIO expander
  • Expansion connectors to support application-specific boards.