ZHCSC15C
December 2013 – June 2018
TPS709-Q1
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
典型应用电路
接地电流与 VIN 和温度间的关系
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Undervoltage Lockout (UVLO)
7.3.2
Shutdown
7.3.3
Reverse Current Protection
7.3.4
Internal Current Limit
7.3.5
Thermal Protection
7.4
Device Functional Modes
7.4.1
Normal Operation
7.4.2
Dropout Operation
7.4.3
Disabled
8
Application and Implementation
8.1
Application Information
8.1.1
Input and Output Capacitor Considerations
8.1.2
Dropout Voltage
8.1.3
Transient Response
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.1.1
Board Layout Recommendations to Improve PSRR and Noise Performance
10.1.2
Power Dissipation
10.2
Layout Examples
11
器件和文档支持
11.1
器件支持
11.1.1
开发支持
11.1.1.1
评估模块
11.1.1.2
Spice 模型
11.1.2
器件命名规则
11.2
文档支持
11.2.1
相关文档
11.3
接收文档更新通知
11.4
社区资源
11.5
商标
11.6
静电放电警告
11.7
术语表
12
机械、封装和可订购信息
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
DBV|5
DRV|6
散热焊盘机械数据 (封装 | 引脚)
DRV|6
QFND241B
订购信息
zhcsc15c_oa
zhcsc15c_pm
8.2
Typical Application
Figure 42.
3.3-V, Low-I
Q
Rail