ZHCSQI6A May   2022  – July 2022 TPS62870-Q1 , TPS62871-Q1 , TPS62872-Q1 , TPS62873-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. 说明(续)
  6. Device Options
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 I2C Interface Timing Characteristics
    7. 8.7 Timing Requirements
    8. 8.8 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Fixed-Frequency DCS Control Topology
      2. 9.3.2  Forced PWM and Power Save Modes
      3. 9.3.3  Precise Enable
      4. 9.3.4  Start-Up
      5. 9.3.5  Switching Frequency Selection
      6. 9.3.6  Output Voltage Setting
        1. 9.3.6.1 Output Voltage Range
        2. 9.3.6.2 Output Voltage Setpoint
        3. 9.3.6.3 Non-Default Output Voltage Setpoint
        4. 9.3.6.4 Dynamic Voltage Scaling
      7. 9.3.7  Compensation (COMP)
      8. 9.3.8  Mode Selection and Clock Synchronization (MODE/SYNC)
      9. 9.3.9  Spread Spectrum Clocking (SSC)
      10. 9.3.10 Output Discharge
      11. 9.3.11 Undervoltage Lockout (UVLO)
      12. 9.3.12 Overvoltage Lockout (OVLO)
      13. 9.3.13 Overcurrent Protection
        1. 9.3.13.1 Cycle-by-Cycle Current Limiting
        2. 9.3.13.2 Hiccup Mode
        3. 9.3.13.3 Current Limit Mode
      14. 9.3.14 Power Good (PG)
        1. 9.3.14.1 Standalone or Primary Device Behavior
        2. 9.3.14.2 Secondary Device Behavior
      15. 9.3.15 Remote Sense
      16. 9.3.16 Thermal Warning and Shutdown
      17. 9.3.17 Stacked Operation
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-On Reset
      2. 9.4.2 Undervoltage Lockout
      3. 9.4.3 Standby
      4. 9.4.4 On
    5. 9.5 Programming
      1. 9.5.1 Serial Interface Description
      2. 9.5.2 Standard, Fast, Fast Mode Plus Protocol
      3. 9.5.3 I2C Update Sequence
    6. 9.6 Register Map
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Selecting the Inductor
        2. 10.2.2.2 Selecting the Input Capacitors
        3. 10.2.2.3 Selecting the Compensation Resistor
        4. 10.2.2.4 Selecting the Output Capacitors
        5. 10.2.2.5 Selecting the Compensation Capacitor, CC
        6. 10.2.2.6 Selecting the Compensation Capacitor, CC2
      3. 10.2.3 Application Curves
    3. 10.3 Best Design Practices
    4. 10.4 Power Supply Recommendations
    5. 10.5 Layout
      1. 10.5.1 Layout Guidelines
      2. 10.5.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Device Functional Modes