ZHCSQI6A
May 2022 – July 2022
TPS62870-Q1
,
TPS62871-Q1
,
TPS62872-Q1
,
TPS62873-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
说明(续)
6
Device Options
7
Pin Configuration and Functions
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Thermal Information
8.5
Electrical Characteristics
8.6
I2C Interface Timing Characteristics
8.7
Timing Requirements
8.8
Typical Characteristics
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Fixed-Frequency DCS Control Topology
9.3.2
Forced PWM and Power Save Modes
9.3.3
Precise Enable
9.3.4
Start-Up
9.3.5
Switching Frequency Selection
9.3.6
Output Voltage Setting
9.3.6.1
Output Voltage Range
9.3.6.2
Output Voltage Setpoint
9.3.6.3
Non-Default Output Voltage Setpoint
9.3.6.4
Dynamic Voltage Scaling
9.3.7
Compensation (COMP)
9.3.8
Mode Selection and Clock Synchronization (MODE/SYNC)
9.3.9
Spread Spectrum Clocking (SSC)
9.3.10
Output Discharge
9.3.11
Undervoltage Lockout (UVLO)
9.3.12
Overvoltage Lockout (OVLO)
9.3.13
Overcurrent Protection
9.3.13.1
Cycle-by-Cycle Current Limiting
9.3.13.2
Hiccup Mode
9.3.13.3
Current Limit Mode
9.3.14
Power Good (PG)
9.3.14.1
Standalone or Primary Device Behavior
9.3.14.2
Secondary Device Behavior
9.3.15
Remote Sense
9.3.16
Thermal Warning and Shutdown
9.3.17
Stacked Operation
9.4
Device Functional Modes
9.4.1
Power-On Reset
9.4.2
Undervoltage Lockout
9.4.3
Standby
9.4.4
On
9.5
Programming
9.5.1
Serial Interface Description
9.5.2
Standard, Fast, Fast Mode Plus Protocol
9.5.3
I2C Update Sequence
9.6
Register Map
10
Application and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.2.1
Selecting the Inductor
10.2.2.2
Selecting the Input Capacitors
10.2.2.3
Selecting the Compensation Resistor
10.2.2.4
Selecting the Output Capacitors
10.2.2.5
Selecting the Compensation Capacitor, CC
10.2.2.6
Selecting the Compensation Capacitor, CC2
10.2.3
Application Curves
10.3
Best Design Practices
10.4
Power Supply Recommendations
10.5
Layout
10.5.1
Layout Guidelines
10.5.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
第三方产品免责声明
11.2
Documentation Support
11.2.1
Related Documentation
11.3
接收文档更新通知
11.4
支持资源
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RXS|16
MPQF606C
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsqi6a_oa
zhcsqi6a_pm
11.7
术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。