ZHCSKT9C
January 2020 – March 2021
THP210
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Parameter Measurement Information
7.1
Characterization Configuration
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Super-Beta Input Bipolar Transistors
8.3.2
Power Down
8.3.3
Flexible Gain Setting
8.3.4
Amplifier Overload Power Limit
8.3.5
Unity Gain Stability
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.1.1
I/O Headroom Considerations
9.1.2
DC Precision Analysis
9.1.2.1
DC Error Voltage at Room Temperature
9.1.2.2
DC Error Voltage Over Temperature
9.1.3
Noise Analysis
9.1.4
Mismatch of External Feedback Network
9.1.5
Operating the Power-Down Feature
9.1.6
Driving Capacitive Loads
9.1.7
Driving Differential ADCs
9.1.7.1
RC Filter Selection (Charge Kickback Filter)
9.1.7.2
Settling Time Driving the ADC Sample-and-Hold Operating Behavior
9.1.7.3
THD Performance
9.2
Typical Applications
9.2.1
MFB Filter
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curve
9.2.2
ADS891x With Single-Ended RC Filter Stage
9.2.2.1
Design Requirements
9.2.2.1.1
Measurement Results
9.2.3
Attenuation Configuration Drives the ADS8912B
9.2.3.1
Design Requirements
9.2.3.1.1
Measurement Results
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.1.1
Board Layout Recommendations
11.2
Layout Example
12
Device and Documentation Support
12.1
Device Support
12.1.1
Development Support
12.2
Documentation Support
12.2.1
Related Documentation
12.3
接收文档更新通知
12.4
支持资源
12.5
Trademarks
12.6
静电放电警告
12.7
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
D|8
MSOI002K
DGK|8
MPDS028D
散热焊盘机械数据 (封装 | 引脚)
DGK|8
QFND519
订购信息
zhcskt9c_oa
zhcskt9c_pm
12.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。