ZHCSKP3J February   2019  – August 2021 TDA4VM , TDA4VM-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1. 3.1 功能模块图
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Related Products
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
      1. 6.3.1  ADC
        1. 6.3.1.1 MCU Domain
      2. 6.3.2  DDRSS
        1. 6.3.2.1 MAIN Domain
      3. 6.3.3  GPIO
        1. 6.3.3.1 MAIN Domain
        2. 6.3.3.2 WKUP Domain
      4. 6.3.4  I2C
        1. 6.3.4.1 MAIN Domain
        2. 6.3.4.2 MCU Domain
        3. 6.3.4.3 WKUP Domain
      5. 6.3.5  I3C
        1. 6.3.5.1 MAIN Domain
        2. 6.3.5.2 MCU Domain
      6. 6.3.6  MCAN
        1. 6.3.6.1 MAIN Domain
        2. 6.3.6.2 MCU Domain
      7. 6.3.7  MCSPI
        1. 6.3.7.1 MAIN Domain
        2. 6.3.7.2 MCU Domain
      8. 6.3.8  UART
        1. 6.3.8.1 MAIN Domain
        2. 6.3.8.2 MCU Domain
        3. 6.3.8.3 WKUP Domain
      9. 6.3.9  MDIO
        1. 6.3.9.1 MCU Domain
      10. 6.3.10 CPSW2G
        1. 6.3.10.1 MCU Domain
      11. 6.3.11 CPSW9G
        1. 6.3.11.1 MAIN Domain
      12. 6.3.12 ECAP
        1. 6.3.12.1 MAIN Domain
      13. 6.3.13 EQEP
        1. 6.3.13.1 MAIN Domain
      14. 6.3.14 EHRPWM
        1. 6.3.14.1 MAIN Domain
      15. 6.3.15 USB
        1. 6.3.15.1 MAIN Domain
      16. 6.3.16 SERDES
        1. 6.3.16.1 MAIN Domain
      17. 6.3.17 OSPI
        1. 6.3.17.1 MCU Domain
      18. 6.3.18 Hyperbus
        1. 6.3.18.1 MCU Domain
      19. 6.3.19 GPMC
        1. 6.3.19.1 MAIN Domain
      20. 6.3.20 MMC
        1. 6.3.20.1 MAIN Domain
      21. 6.3.21 CPTS
        1. 6.3.21.1 MCU Domain
        2. 6.3.21.2 MAIN Domain
      22. 6.3.22 UFS
        1. 6.3.22.1 MAIN Domain
      23. 6.3.23 PRU_ICSSG [Currently Not Supported]
        1. 6.3.23.1 MAIN Domain
      24. 6.3.24 MCASP
        1. 6.3.24.1 MAIN Domain
      25. 6.3.25 DSS
        1. 6.3.25.1 MAIN Domain
      26. 6.3.26 DP
        1. 6.3.26.1 MAIN Domain
      27. 6.3.27 Camera Streaming Interface Receiver (CSI_RX_IF) Subsystem
        1. 6.3.27.1 MAIN Domain
      28. 6.3.28 DSI_TX
        1. 6.3.28.1 MAIN Domain
      29. 6.3.29 VPFE
        1. 6.3.29.1 MAIN Domain
      30. 6.3.30 DMTIMER
        1. 6.3.30.1 MAIN Domain
        2. 6.3.30.2 MCU Domain
      31. 6.3.31 Emulation and Debug
        1. 6.3.31.1 MAIN Domain
      32. 6.3.32 System and Miscellaneous
        1. 6.3.32.1 Boot Mode Configuration
          1. 6.3.32.1.1 MAIN Domain
          2. 6.3.32.1.2 MCU Domain
        2. 6.3.32.2 Clock
          1. 6.3.32.2.1 MAIN Domain
          2. 6.3.32.2.2 WKUP Domain
        3. 6.3.32.3 System
          1. 6.3.32.3.1 MAIN Domain
          2. 6.3.32.3.2 WKUP Domain
        4. 6.3.32.4 EFUSE
      33. 6.3.33 Power Supply
    4. 6.4 Pin Multiplexing
    5. 6.5 Connections for Unused Pins
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On-Hour (POH) Limits
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Operating Performance Points
    6. 7.6  Power Consumption Summary
    7. 7.7  Electrical Characteristics
    8. 7.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.8.2 Hardware Requirements
      3. 7.8.3 Programming Sequence
      4. 7.8.4 Impact to Your Hardware Warranty
    9. 7.9  Thermal Resistance Characteristics
      1. 7.9.1 Thermal Resistance Characteristics for ALF Package
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1 Timing Parameters and Information
      2. 7.10.2 Power Supply Sequencing
        1. 7.10.2.1 Power Supply Slew Rate Requirement
        2. 7.10.2.2 Combined MCU and Main Domains Power-Up Sequencing
        3. 7.10.2.3 Combined MCU and Main Domains Power- Down Sequencing
        4. 7.10.2.4 Isolated MCU and Main Domains Power- Up Sequencing
        5. 7.10.2.5 Isolated MCU and Main Domains, Primary Power- Down Sequencing
        6. 7.10.2.6 Entry and Exit of MCU Only State
        7. 7.10.2.7 Entry and Exit of DDR Retention State
      3. 7.10.3 System Timing
        1. 7.10.3.1 Reset Timing
        2. 7.10.3.2 Safety Signal Timing
        3. 7.10.3.3 Clock Timing
      4. 7.10.4 Clock Specifications
        1. 7.10.4.1 Input and Output Clocks / Oscillators
          1. 7.10.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.1.1 Load Capacitance
            2. 7.10.4.1.1.2 Shunt Capacitance
          2. 7.10.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 7.10.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 7.10.4.1.3.1 Load Capacitance
            2. 7.10.4.1.3.2 Shunt Capacitance
          4. 7.10.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 7.10.4.1.5 Auxiliary OSC1 Not Used
          6. 7.10.4.1.6 WKUP_LFOSC0 Internal Oscillator Clock Source
          7. 7.10.4.1.7 WKUP_LFOSC0 Not Used
        2. 7.10.4.2 Output Clocks
        3. 7.10.4.3 PLLs
        4. 7.10.4.4 Module and Peripheral Clocks Frequencies
      5. 7.10.5 Peripherals
        1. 7.10.5.1  ATL
          1. 7.10.5.1.1 ATL_PCLK Timing Requirements
          2. 7.10.5.1.2 ATL_AWS[x] Timing Requirements
          3. 7.10.5.1.3 ATL_BWS[x] Timing Requirements
          4. 7.10.5.1.4 ATCLK[x] Switching Characteristics
        2. 7.10.5.2  VPFE
        3. 7.10.5.3  CPSW2G
          1. 7.10.5.3.1 CPSW2G MDIO Interface Timings
          2. 7.10.5.3.2 CPSW2G RMII Timings
            1. 7.10.5.3.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 7.10.5.3.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 7.10.5.3.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 7.10.5.3.3 CPSW2G RGMII Timings
            1. 7.10.5.3.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 7.10.5.3.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 7.10.5.3.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 7.10.5.3.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        4. 7.10.5.4  CPSW9G
          1. 7.10.5.4.1 CPSW9G MDIO Interface Timings
          2. 7.10.5.4.2 CPSW9G RMII Timings
            1. 7.10.5.4.2.1 RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 7.10.5.4.2.2 RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 7.10.5.4.2.3 RMII[x]_TXD[1:0], and RMII[x]_TXEN Switching Characteristics – RMII Mode
          3. 7.10.5.4.3 CPSW9G RGMII Timings
            1. 7.10.5.4.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 7.10.5.4.3.2 RGMII[x]_RD[3:0] and RGMII[x]_RCTL Timing Requirements – RGMII Mode
            3. 7.10.5.4.3.3 RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 7.10.5.4.3.4 RGMII[x]_TD[3:0] and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        5. 7.10.5.5  CSI-2
        6. 7.10.5.6  DDRSS
        7. 7.10.5.7  DSS
        8. 7.10.5.8  eCAP
          1. 7.10.5.8.1 Timing Requirements for eCAP
          2. 7.10.5.8.2 Switching Characteristics for eCAP
        9. 7.10.5.9  EPWM
          1. 7.10.5.9.1 Switching Characteristics for eHRPWM
          2. 7.10.5.9.2 Timing Requirements for eHRPWM
        10. 7.10.5.10 eQEP
          1. 7.10.5.10.1 Timing Requirements for eQEP
          2. 7.10.5.10.2 Switching Characteristics for eQEP
        11. 7.10.5.11 GPIO
          1. 7.10.5.11.1 GPIO Timing Requirements
          2. 7.10.5.11.2 GPIO Switching Characteristics
        12. 7.10.5.12 GPMC
          1. 7.10.5.12.1 GPMC and NOR Flash — Synchronous Mode
            1. 7.10.5.12.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 7.10.5.12.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 7.10.5.12.2 GPMC and NOR Flash — Asynchronous Mode
            1. 7.10.5.12.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 7.10.5.12.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 7.10.5.12.3 GPMC and NAND Flash — Asynchronous Mode
            1. 7.10.5.12.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 7.10.5.12.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
          4. 7.10.5.12.4 GPMC0 IOSET
        13. 7.10.5.13 HyperBus
          1. 7.10.5.13.1 Timing Requirements for HyperBus
          2. 7.10.5.13.2 HyperBus 166 MHz Switching Characteristics
          3. 7.10.5.13.3 HyperBus 100 MHz Switching Characteristics
        14. 7.10.5.14 I2C
        15. 7.10.5.15 I3C
        16. 7.10.5.16 MCAN
        17. 7.10.5.17 MCASP
        18. 7.10.5.18 MCSPI
          1. 7.10.5.18.1 MCSPI — Master Mode
          2. 7.10.5.18.2 MCSPI — Slave Mode
        19. 7.10.5.19 MMCSD
          1. 7.10.5.19.1 MMC0 - eMMC Interface
            1. 7.10.5.19.1.1 Legacy SDR Mode
            2. 7.10.5.19.1.2 High Speed SDR Mode
            3. 7.10.5.19.1.3 High Speed DDR Mode
            4. 7.10.5.19.1.4 HS200 Mode
          2. 7.10.5.19.2 MMC1/2 - SD/SDIO Interface
            1. 7.10.5.19.2.1 Default Speed Mode
            2. 7.10.5.19.2.2 High Speed Mode
            3. 7.10.5.19.2.3 UHS–I SDR12 Mode
            4. 7.10.5.19.2.4 UHS–I SDR25 Mode
            5. 7.10.5.19.2.5 UHS–I SDR50 Mode
            6. 7.10.5.19.2.6 UHS–I DDR50 Mode
            7. 7.10.5.19.2.7 UHS–I SDR104 Mode
        20. 7.10.5.20 CPTS
          1. 7.10.5.20.1 CPTS Timing Requirements
          2. 7.10.5.20.2 CPTS Switching Characteristics
        21. 7.10.5.21 OSPI
          1. 7.10.5.21.1 OSPI With Data Training
            1. 7.10.5.21.1.1 OSPI Switching Characteristics – Data Training
          2. 7.10.5.21.2 OSPI Without Data Training
            1. 7.10.5.21.2.1 OSPI Timing Requirements – SDR Mode
            2. 7.10.5.21.2.2 OSPI Switching Characteristics – SDR Mode
            3. 7.10.5.21.2.3 OSPI Timing Requirements – DDR Mode
            4. 7.10.5.21.2.4 OSPI Switching Characteristics – DDR Mode
        22. 7.10.5.22 OLDI
          1. 7.10.5.22.1 OLDI Switching Characteristics
        23. 7.10.5.23 PCIE
        24. 7.10.5.24 Timers
          1. 7.10.5.24.1 Timing Requirements for Timers
          2. 7.10.5.24.2 Switching Characteristics for Timers
        25. 7.10.5.25 UART
          1. 7.10.5.25.1 Timing Requirements for UART
          2. 7.10.5.25.2 UART Switching Characteristics
        26. 7.10.5.26 USB
      6. 7.10.6 Emulation and Debug
        1. 7.10.6.1 Trace
        2. 7.10.6.2 JTAG
          1. 7.10.6.2.1 JTAG Electrical Data and Timing
            1. 7.10.6.2.1.1 JTAG Timing Requirements
            2. 7.10.6.2.1.2 JTAG Switching Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-A72
      2. 8.2.2 Arm Cortex-R5F
      3. 8.2.3 DSP C71x
      4. 8.2.4 DSP C66x
    3. 8.3 Accelerators and Coprocessors
      1. 8.3.1 GPU
      2. 8.3.2 VPAC
      3. 8.3.3 DMPAC
      4. 8.3.4 D5520MP2
      5. 8.3.5 VXE384MP2
    4. 8.4 Other Subsystems
      1. 8.4.1 MSMC
      2. 8.4.2 NAVSS
        1. 8.4.2.1 NAVSS0
        2. 8.4.2.2 MCU_NAVSS
      3. 8.4.3 PDMA Controller
      4. 8.4.4 Power Supply
      5. 8.4.5 Peripherals
        1. 8.4.5.1  ADC
        2. 8.4.5.2  ATL
        3. 8.4.5.3  CSI
          1. 8.4.5.3.1 Camera Streaming Interface Receiver (CSI_RX_IF) and MIPI DPHY Receiver (DPHY_RX)
          2. 8.4.5.3.2 Camera Streaming Interface Transmitter (CSI_TX_IF)
        4. 8.4.5.4  CPSW2G
        5. 8.4.5.5  CPSW9G
        6. 8.4.5.6  DCC
        7. 8.4.5.7  DDRSS
        8. 8.4.5.8  DSS
          1. 8.4.5.8.1 DSI
          2. 8.4.5.8.2 eDP
        9. 8.4.5.9  VPFE
        10. 8.4.5.10 eCAP
        11. 8.4.5.11 EPWM
        12. 8.4.5.12 ELM
        13. 8.4.5.13 ESM
        14. 8.4.5.14 eQEP
        15. 8.4.5.15 GPIO
        16. 8.4.5.16 GPMC
        17. 8.4.5.17 Hyperbus
        18. 8.4.5.18 I2C
        19. 8.4.5.19 I3C
        20. 8.4.5.20 MCAN
        21. 8.4.5.21 MCASP
        22. 8.4.5.22 MCRC Controller
        23. 8.4.5.23 MCSPI
        24. 8.4.5.24 MMC/SD
        25. 8.4.5.25 OSPI
        26. 8.4.5.26 PCIE
        27. 8.4.5.27 SerDes
        28. 8.4.5.28 WWDT
        29. 8.4.5.29 Timers
        30. 8.4.5.30 UART
        31. 8.4.5.31 USB
        32. 8.4.5.32 UFS
  9. 9 Applications and Implementation
    1. 9.1 Power Supply Mapping
    2. 9.2 Device Connection and Layout Fundamentals
      1. 9.2.1 Power Supply Decoupling and Bulk Capacitors
        1. 9.2.1.1 Power Distribution Network Implementation Guidance
      2. 9.2.2 External Oscillator
      3. 9.2.3 JTAG and EMU
      4. 9.2.4 Reset
      5. 9.2.5 Unused Pins
      6. 9.2.6 Hardware Design Guide for JacintoTM 7 Devices
    3. 9.3 Peripheral- and Interface-Specific Design Information
      1. 9.3.1 LPDDR4 Board Design and Layout Guidelines
      2. 9.3.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 9.3.2.1 No Loopback and Internal Pad Loopback
        2. 9.3.2.2 External Board Loopback
        3. 9.3.2.3 DQS (only available in Octal Flash devices)
      3. 9.3.3 SERDES REFCLK Design Guidelines
      4. 9.3.4 USB VBUS Design Guidelines
      5. 9.3.5 System Power Supply Monitor Design Guidelines
      6. 9.3.6 High Speed Differential Signal Routing Guidance
      7. 9.3.7 Thermal Solution Guidance
  10. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ALF|827
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

TDA4VM 处理器系列基于不断发展的 Jacinto™ 7 架构，面向 ADAS 和自动驾驶车辆 (AV) 应用，基于 TI 在 ADAS 处理器市场上十多年的先进地位所积累的广泛市场知识而构建。在以符合功能安全标准为目标的架构中，独特的高性能计算、深度学习引擎、信号和图像处理专用加速器的组合使 TDA4VM 器件非常适合多种工业应用，例如：机器人、机器视觉、雷达等等。TDA4VM 以业界卓越的功耗/性能比为传统和深度学习算法提供高性能计算，并具有很高的系统集成度，从而使支持集中式 ECU 或独立传感器中多种传感器模式的高级汽车平台实现可扩展性和更低的成本。关键内核包括具有标量和矢量内核的下一代 DSP、专用深度学习和传统算法加速器、用于通用计算的最新 Arm 和 GPU 处理器、集成式下一代成像子系统（ISP）、视频编解码器、以太网集线器以及隔离式 MCU 岛。所有这些都由汽车级安全硬件加速器提供保护。

主要高性能内核概述

“C7x”下一代 DSP 将 TI 业界先进的 DSP 和 EVE 内核整合到单个性能更高的内核中，并增加了浮点矢量计算功能，从而实现了对旧代码的向后兼容性，同时简化了软件编程。在典型的汽车最高结温 125°C 下运行时，新型“MMA”深度学习加速器可在业界超低的功率范围内实现高达 8TOPS 的性能。专用的 ADAS/AV 硬件加速器可提供视觉预处理以及距离和运动处理，而不会影响系统性能。

通用计算内核和集成概述

对 Arm®Cortex®-A72 的独立双核集群配置有助于实现多操作系统应用，而且对软件管理程序的需求非常低。最多六个 Arm®Cortex®-R5F 子系统能够管理低级的时序关键型处理任务，并且可使 Arm®Cortex®-A72 不受应用的影响。集成的“8XE GE8430”GPU 可提供高达 100GFLOPS 的性能，从而为增强视觉应用实现动态 3D 渲染。TI 的第 7 代 ISP 以现有出色的 ISP 为基础，能够灵活地处理更广泛的传感器套件，支持更高的位深度，并且具有面向分析应用的特性。集成的诊断和安全功能可支持高达 ASIL-D/SIL-3 级别的操作，同时集成的安全功能可保护数据免受现代攻击。为了实现需要大量数据带宽的系统，提供了 PCIe 集线器和千兆位以太网交换机以及 CSI-2 端口，以支持众多传感器输入的吞吐量。为了进一步集成，TDA4VM 系列还包含一个 MCU 岛，从而无需使用外部系统微控制器。

器件信息
器件型号(1) 封装 封装尺寸
XTDA4VMXXXGALF FCBGA (827) 24.0mm × 24.0mm
XJ721EGALF FCBGA (827) 24.0mm × 24.0mm
(1) 如需更多信息，请参阅Section 11机械、封装和可订购信息。