ZHCSNU9F april   2021  – january 2023 AM2431 , AM2432 , AM2434

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
    1. 3.1 功能方框图
  4. Revision History
  5. Device Comparison
    1. 5.1 Related Products
  6. Terminal Configuration and Functions
    1. 6.1 Pin Diagram
      1. 6.1.1 AM243x ALV Pin Diagram
      2. 6.1.2 AM243x ALX Pin Diagram
    2. 6.2 Pin Attributes
      1.      13
      2.      14
      3. 6.2.1 AM243x Package Comparison Table (ALV vs. ALX)
    3. 6.3 Signal Descriptions
      1.      17
      2. 6.3.1  AM243x_ALX Package - Unsupported Interfaces and Signals
      3. 6.3.2  ADC
        1.       MAIN Domain Instances
          1.        21
      4. 6.3.3  CPSW
        1.       MAIN Domain Instances
          1.        24
          2.        25
          3.        26
          4.        27
          5. 6.3.3.1.1 CPSW3G IOSETs
      5. 6.3.4  CPTS
        1.       MAIN Domain Instances
          1.        31
          2.        32
      6. 6.3.5  DDRSS
        1.       MAIN Domain Instances
          1.        35
      7. 6.3.6  ECAP
        1.       MAIN Domain Instances
          1.        38
          2.        39
          3.        40
      8. 6.3.7  Emulation and Debug
        1.       MAIN Domain Instances
          1.        43
        2.       MCU Domain Instances
          1.        45
      9. 6.3.8  EPWM
        1.       MAIN Domain Instances
          1.        48
          2.        49
          3.        50
          4.        51
          5.        52
          6.        53
          7.        54
          8.        55
          9.        56
          10.        57
      10. 6.3.9  EQEP
        1.       MAIN Domain Instances
          1.        60
          2.        61
          3.        62
      11. 6.3.10 FSI
        1.       MAIN Domain Instances
          1.        65
          2.        66
          3.        67
          4.        68
          5.        69
          6.        70
          7.        71
          8.        72
      12. 6.3.11 GPIO
        1.       MAIN Domain Instances
          1.        75
          2.        76
        2.       MCU Domain Instances
          1.        78
      13. 6.3.12 GPMC
        1.       MAIN Domain Instances
          1.        81
          2. 6.3.12.1.1 GPMC0 IOSETs (ALV)
      14. 6.3.13 I2C
        1.       MAIN Domain Instances
          1.        85
          2.        86
          3.        87
          4.        88
        2.       MCU Domain Instances
          1.        90
          2.        91
      15. 6.3.14 MCAN
        1.       MAIN Domain Instances
          1.        94
          2.        95
      16. 6.3.15 SPI (MCSPI)
        1.       MAIN Domain Instances
          1.        98
          2.        99
          3.        100
          4.        101
          5.        102
        2.       MCU Domain Instances
          1.        104
          2.        105
      17. 6.3.16 MMC
        1.       MAIN Domain Instances
          1.        108
          2.        109
      18. 6.3.17 OSPI
        1.       MAIN Domain Instances
          1.        112
      19. 6.3.18 Power Supply
        1.       114
      20. 6.3.19 PRU_ICSSG
        1.       MAIN Domain Instances
          1.        117
          2.        118
      21. 6.3.20 Reserved
        1.       120
      22. 6.3.21 SERDES
        1.       MAIN Domain Instances
          1.        123
      23. 6.3.22 System and Miscellaneous
        1. 6.3.22.1 Boot Mode Configuration
          1.        MAIN Domain Instances
            1.         127
        2. 6.3.22.2 Clocking
          1.        MCU Domain Instances
            1.         130
        3. 6.3.22.3 SYSTEM
          1.        MAIN Domain Instances
            1.         133
          2.        MCU Domain Instances
            1.         135
        4. 6.3.22.4 VMON
          1.        137
      24. 6.3.23 TIMER
        1.       MAIN Domain Instances
          1.        140
        2.       MCU Domain Instances
          1.        142
      25. 6.3.24 UART
        1.       MAIN Domain Instances
          1.        145
          2.        146
          3.        147
          4.        148
          5.        149
          6.        150
          7.        151
        2.       MCU Domain Instances
          1.        153
          2.        154
      26. 6.3.25 USB
        1.       MAIN Domain Instances
          1.        157
    4. 6.4 Pin Connectivity Requirements
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Operating Performance Points
    6. 7.6  Power Consumption Summary
    7. 7.7  Electrical Characteristics
      1. 7.7.1  I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.7.2  Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 7.7.3  High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 7.7.4  eMMCPHY Electrical Characteristics
      5. 7.7.5  SDIO Electrical Characteristics
      6. 7.7.6  LVCMOS Electrical Characteristics
      7. 7.7.7  ADC12B Electrical Characteristics (ALV package)
      8. 7.7.8  ADC10B Electrical Characteristics (ALX package)
      9. 7.7.9  USB2PHY Electrical Characteristics
      10. 7.7.10 SerDes PHY Electrical Characteristics
      11. 7.7.11 DDR Electrical Characteristics
    8. 7.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.8.2 Hardware Requirements
      3. 7.8.3 Programming Sequence
      4. 7.8.4 Impact to Your Hardware Warranty
    9. 7.9  Thermal Resistance Characteristics
      1. 7.9.1 Thermal Resistance Characteristics
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1 Timing Parameters and Information
      2. 7.10.2 Power Supply Requirements
        1. 7.10.2.1 Power Supply Slew Rate Requirement
        2. 7.10.2.2 Power Supply Sequencing
          1. 7.10.2.2.1 Power-Up Sequencing
          2. 7.10.2.2.2 Power-Down Sequencing
      3. 7.10.3 System Timing
        1. 7.10.3.1 Reset Timing
        2. 7.10.3.2 Safety Signal Timing
        3. 7.10.3.3 Clock Timing
      4. 7.10.4 Clock Specifications
        1. 7.10.4.1 Input Clocks / Oscillators
          1. 7.10.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.1.1 Load Capacitance
            2. 7.10.4.1.1.2 Shunt Capacitance
          2. 7.10.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
        2. 7.10.4.2 Output Clocks
        3. 7.10.4.3 PLLs
        4. 7.10.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 7.10.5 Peripherals
        1. 7.10.5.1  CPSW3G
          1. 7.10.5.1.1 CPSW3G MDIO Timing
          2. 7.10.5.1.2 CPSW3G RMII Timing
          3. 7.10.5.1.3 CPSW3G RGMII Timing
          4. 7.10.5.1.4 CPSW3G IOSETs
        2. 7.10.5.2  DDRSS
        3. 7.10.5.3  ECAP
        4. 7.10.5.4  EPWM
        5. 7.10.5.5  EQEP
        6. 7.10.5.6  FSI
        7. 7.10.5.7  GPIO
        8. 7.10.5.8  GPMC
          1. 7.10.5.8.1 GPMC and NOR Flash — Synchronous Mode
          2. 7.10.5.8.2 GPMC and NOR Flash — Asynchronous Mode
          3. 7.10.5.8.3 GPMC and NAND Flash — Asynchronous Mode
          4. 7.10.5.8.4 GPMC0 IOSETs (ALV)
        9. 7.10.5.9  I2C
        10. 7.10.5.10 MCAN
        11. 7.10.5.11 MCSPI
          1. 7.10.5.11.1 MCSPI — Controller Mode
          2. 7.10.5.11.2 MCSPI — Peripheral Mode
        12. 7.10.5.12 MMCSD
          1. 7.10.5.12.1 MMC0 - eMMC Interface
            1. 7.10.5.12.1.1 Legacy SDR Mode
            2. 7.10.5.12.1.2 High Speed SDR Mode
            3. 7.10.5.12.1.3 High Speed DDR Mode
            4. 7.10.5.12.1.4 HS200 Mode
          2. 7.10.5.12.2 MMC1 - SD/SDIO Interface
            1. 7.10.5.12.2.1 Default Speed Mode
            2. 7.10.5.12.2.2 High Speed Mode
            3. 7.10.5.12.2.3 UHS–I SDR12 Mode
            4. 7.10.5.12.2.4 UHS–I SDR25 Mode
            5. 7.10.5.12.2.5 UHS–I SDR50 Mode
            6. 7.10.5.12.2.6 UHS–I DDR50 Mode
            7. 7.10.5.12.2.7 UHS–I SDR104 Mode
        13. 7.10.5.13 CPTS
        14. 7.10.5.14 OSPI
          1. 7.10.5.14.1 OSPI0 PHY Mode
            1. 7.10.5.14.1.1 OSPI0 With PHY Data Training
            2. 7.10.5.14.1.2 OSPI0 Without Data Training
              1. 7.10.5.14.1.2.1 OSPI0 PHY SDR Timing
              2. 7.10.5.14.1.2.2 OSPI0 PHY DDR Timing
          2. 7.10.5.14.2 OSPI0 Tap Mode
            1. 7.10.5.14.2.1 OSPI0 Tap SDR Timing
            2. 7.10.5.14.2.2 OSPI0 Tap DDR Timing
        15. 7.10.5.15 PCIe
        16. 7.10.5.16 PRU_ICSSG
          1. 7.10.5.16.1 PRU_ICSSG Programmable Real-Time Unit (PRU)
            1. 7.10.5.16.1.1 PRU_ICSSG PRU Direct Output Mode Timing
            2. 7.10.5.16.1.2 PRU_ICSSG PRU Parallel Capture Mode Timing
            3. 7.10.5.16.1.3 PRU_ICSSG PRU Shift Mode Timing
            4. 7.10.5.16.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface
              1. 7.10.5.16.1.4.1 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Timing
          2. 7.10.5.16.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 7.10.5.16.2.1 PRU_ICSSG PWM Timing
          3. 7.10.5.16.3 PRU_ICSSG Industrial Ethernet Peripheral (IEP)
            1. 7.10.5.16.3.1 PRU_ICSSG IEP Timing
          4. 7.10.5.16.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (UART)
            1. 7.10.5.16.4.1 PRU_ICSSG UART Timing
          5. 7.10.5.16.5 PRU_ICSSG Enhanced Capture Peripheral (ECAP)
            1. 7.10.5.16.5.1 PRU_ICSSG ECAP Timing
          6. 7.10.5.16.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 7.10.5.16.6.1 PRU_ICSSG MDIO Timing
            2. 7.10.5.16.6.2 PRU_ICSSG MII Timing
            3. 7.10.5.16.6.3 PRU_ICSSG RGMII Timing
        17. 7.10.5.17 Timers
        18. 7.10.5.18 UART
        19. 7.10.5.19 USB
      6. 7.10.6 Emulation and Debug
        1. 7.10.6.1 Trace
        2. 7.10.6.2 JTAG
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-R5F Subsystem (R5FSS)
      2. 8.2.2 Arm Cortex-M4F (M4FSS)
    3. 8.3 Accelerators and Coprocessors
      1. 8.3.1 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU_ICSSG)
    4. 8.4 Other Subsystems
      1. 8.4.1 PDMA Controller
      2. 8.4.2 Peripherals
        1. 8.4.2.1  ADC
        2. 8.4.2.2  DCC
        3. 8.4.2.3  Dual Date Rate (DDR) External Memory Interface (DDRSS)
        4. 8.4.2.4  ECAP
        5. 8.4.2.5  EPWM
        6. 8.4.2.6  ELM
        7. 8.4.2.7  ESM
        8. 8.4.2.8  GPIO
        9. 8.4.2.9  EQEP
        10. 8.4.2.10 General-Purpose Memory Controller (GPMC)
        11. 8.4.2.11 I2C
        12. 8.4.2.12 MCAN
        13. 8.4.2.13 MCRC Controller
        14. 8.4.2.14 MCSPI
        15. 8.4.2.15 MMCSD
        16. 8.4.2.16 OSPI
        17. 8.4.2.17 Peripheral Component Interconnect Express (PCIe)
        18. 8.4.2.18 Serializer/Deserializer (SerDes) PHY
        19. 8.4.2.19 Real Time Interrupt (RTI/WWDT)
        20. 8.4.2.20 Dual Mode Timer (DMTIMER)
        21. 8.4.2.21 UART
        22. 8.4.2.22 Universal Serial Bus Subsystem (USBSS)
  9. Applications, Implementation, and Layout
    1. 9.1 Device Connection and Layout Fundamentals
      1. 9.1.1 Power Supply
        1. 9.1.1.1 Power Supply Designs
        2. 9.1.1.2 Power Distribution Network Implementation Guidance
      2. 9.1.2 External Oscillator
      3. 9.1.3 JTAG, EMU, and TRACE
      4. 9.1.4 Unused Pins
    2. 9.2 Peripheral- and Interface-Specific Design Information
      1. 9.2.1 General Routing Guidelines
      2. 9.2.2 DDR Board Design and Layout Guidelines
      3. 9.2.3 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 9.2.3.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 9.2.3.2 External Board Loopback
        3. 9.2.3.3 DQS (only available in Octal SPI devices)
      4. 9.2.4 USB VBUS Design Guidelines
      5. 9.2.5 System Power Supply Monitor Design Guidelines
      6. 9.2.6 High Speed Differential Signal Routing Guidance
      7. 9.2.7 Thermal Solution Guidance
    3. 9.3 Clock Routing Guidelines
      1. 9.3.1 Oscillator Routing
      2. 9.3.2 Oscillator Ground Connection
  10. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
      1. 10.3.1 Information About Cautions and Warnings
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ALV|441
  • ALX|293
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

AM243x 是 Sitara 高性能微控制器新增的工业级产品系列。AM243x 器件专为需要结合实时通信和处理的工业应用(例如电机驱动和远程 I/O 模块)而构建。AM243x 系列通过多达四个 Cortex-R5F MCU、一个 Cortex-M4F 和两个 Sitara 支持 TSN 的千兆位 PRU_ICSSG 实例提供可扩展的性能。

AM243x SoC 架构旨在通过高性能 Arm Cortex-R5F 内核、紧密耦合的存储器组、可配置的 SRAM 分区和与外设之间的专用低延迟路径提供出色的实时性能,从而实现数据快速进出 SoC。这种确定性架构允许 AM243x 处理伺服驱动器中的严格控制环路,同时 FSI、GPMC、ECAP、PWM 和编码器接口等外设可帮助启用这些系统中的多种不同架构。

该 SoC 提供灵活的工业通信能力,包括用于 EtherCAT 目标、PROFINET 器件、EtherNet/IP 适配器和 IO-Link 控制器的完整协议栈。PRU_ICSSG 进一步提供了千兆位和基于 TSN 技术的协议所需的能力。此外,PRU_ICSSG 还支持其他接口,包括 UART 接口、Δ-Σ 抽取滤波器和绝对编码器接口。

可通过集成的 Cortex-M4F 及其专用外设启用功能安全特性,这些外设均可与 SoC 的其余部分隔离。AM243x 还支持安全启动。

封装信息
器件型号 封装(1) 封装尺寸
AM2434...ALV FCBGA [带盖](441 引脚) 17.2mm × 17.2mm
AM2434...ALX FC/CSP [SiP](293 引脚) 11.0 mm × 11.0 mm
AM2432...ALV FCBGA [带盖](441 引脚) 17.2mm × 17.2mm
AM2432...ALX FC/CSP [SiP](293 引脚) 11.0 mm × 11.0 mm
AM2431..ALV FCBGA [带盖](441 引脚) 17.2mm × 17.2mm
AM2431..ALX FC/CSP [SiP](293 引脚) 11.0 mm × 11.0 mm
如需更多信息,请参阅节 11机械、封装和可订购信息