ZHCSHC3B january   2018  – june 2023 TPS61280D , TPS61280E , TPS61281D

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 说明（续）
  7. 6 Device Comparison Table
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 I2C Interface Timing Characteristics #GUID-BD85FD7C-B9AF-4F5D-9DFF-CD61365A592A/SLVS5401494
    7. 8.7 I2C Timing Diagrams
    8. 8.8 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Voltage Scaling Management (VSEL)
      2. 9.3.2 Spread Spectrum, PWM Frequency Dithering
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Save Mode
      2. 9.4.2 Pass-Through Mode
      3. 9.4.3 Mode Selection
      4. 9.4.4 Current Limit Operation
      5. 9.4.5 Start-Up and Shutdown Mode
      6. 9.4.6 Undervoltage Lockout
      7. 9.4.7 Thermal Shutdown
      8. 9.4.8 Fault State and Power-Good
    5. 9.5 Programming
      1. 9.5.1 Serial Interface Description (TPS61280D/E)
      2. 9.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 9.5.3 HS-Mode Protocol
      4. 9.5.4 TPS6128xD/E I2C Update Sequence
    6. 9.6 Register Maps
      1. 9.6.1  Slave Address Byte
      2. 9.6.2  Register Address Byte
      3. 9.6.3  I2C Registers, E2PROM, Write Protect
      4. 9.6.4  E2PROM Configuration Parameters
      5. 9.6.5  CONFIG Register [reset = 0x01]
      6. 9.6.6  VOUTFLOORSET Register [reset = 0x02]
      7. 9.6.7  VOUTROOFSET Register [reset = 0x03]
      8. 9.6.8  ILIMSET Register [reset = 0x04]
      9. 9.6.9  Status Register [reset = 0x05]
      10. 9.6.10 E2PROMCTRL Register [reset = 0xFF]
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 TPS61281D with 2.5V-4.35 VIN, 1500 mA Output Current (TPS61280D with default I2C Configuration)
        1. 10.2.1.1 Design Requirement
        2. 10.2.1.2 Detailed Design Parameters
          1. 10.2.1.2.1 Inductor Selection
          2. 10.2.1.2.2 Output Capacitor
          3. 10.2.1.2.3 Input Capacitor
          4. 10.2.1.2.4 Checking Loop Stability
        3. 10.2.1.3 Application Performance Curves
      2. 10.2.2 TPS61282D with 2.5V-4.35 VIN, 2000 mA Output Current (TPS61280D with I2C Programmable)
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedures
        3. 10.2.2.3 Application Performance Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Information
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 第三方产品免责声明
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 静电放电警告
    6. 13.6 术语表
  15. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Summary

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12.1 Layout Guidelines

  • For all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies.
  • If the layout is not carefully done, the regulator could show stability problems as well as EMI problems.
  • Therefore, use wide and short traces for the main current path and for the power ground tracks.
  • To minimize voltage spikes at the converter's output:
    • Place the output capacitor(s) as close as possible to GND and VOUT, as shown in Figure 12-1.
    • The input capacitor and inductor should also be placed as close as possible to the IC.
    • Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise.
    • Connect these ground nodes at any place close to the ground pins of the IC.
    • Junction-to-ambient thermal resistance is highly application and board-layout dependent.
    • It is suggested to maximize the pour area for all planes other than SW. Especially the ground pour should be set to fill available PWB surface area and tied to internal layers with a cluster of thermal vias.