ZHCSGM4C August 2017 – October 2023 OPA838
PRODUCTION DATA
THERMAL METRIC(1) | OPA838 | UNIT | |||
---|---|---|---|---|---|
DBV (SOT-23) | DCK (SC70) | DCKS (SC70) | |||
6 PINS | 5 PINS | 6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 194 | 203 | 189 | °C/W |
RθJCtop | Junction-to-case (top) thermal resistance | 129 | 152 | 150 | °C/W |
RθJB | Junction-to-board thermal resistance | 39 | 76 | 79 | °C/W |
ψJT | Junction-to-top characterization parameter | 26 | 58 | 61 | °C/W |
ψJB | Junction-to-board characterization parameter | 39 | 76 | 79 | °C/W |