ZHCUCY7 March   2025

 

  1.   1
  2.   说明
  3.   开始使用
  4.   特性
  5.   应用
  6.   6
  7. 1评估模块概述
    1. 1.1 简介
    2. 1.2 套件内容
    3. 1.3 规格
    4. 1.4 器件信息
  8. 2硬件
    1. 2.1 电源要求
    2. 2.2 温度范围
    3. 2.3 EnergyTrace
    4. 2.4 硬件和调试设置
      1. 2.4.1 使用 LaunchPad XDS110 调试探针
      2. 2.4.2 使用通用 XDS110 调试探针,包括单独的 LaunchPad
    5. 2.5 BoosterPack 连接器引脚排列
    6. 2.6 XDS110 接口连接器
    7. 2.7 调试接口连接器
    8. 2.8 跳线信息
    9. 2.9 按钮
  9. 3LaunchPad 硬件的高级使用
    1. 3.1 外部天线
    2. 3.2 XDS110 GPIO
    3. 3.3 BoosterPack 连接器上的复位选择
    4. 3.4 I2C 上拉电阻器
  10. 4软件
    1. 4.1 入门
    2. 4.2 开箱即用演示
  11. 5硬件设计文件
    1. 5.1 参考原理图
    2. 5.2 PCB 布局
    3. 5.3 物料清单 (BOM)
  12. 6合规信息
    1. 6.1 CE 合规性
    2. 6.2 REACH 合规性
    3. 6.3 报废电子电气设备 (WEEE) 合规性
  13. 7其他信息
    1. 7.1 商标
  14. 8参考资料

物料清单 (BOM)

表 5-1 显示了 LP-EM-CC2340R53 的物料清单 (BOM)。完整的 LP-EM-CC2340R53 BOM 可从 LP-EM-CC2340R53 设计文件下载。

表 5-1 LP-EM-CC2340R53 物料清单
数量位号制造商器件型号说明
1B10KOA SPEERRK73Z1JTTD电阻器,厚膜,0,0R/+0.05R,1A,-55oC/+155oC,0603
1C91uFMURATAGRM155Z71A105KE01D电容器,陶瓷 X7R,1μF,10V,-10%/+10%,-55oC/+125oC,0402
2C33、C341.5pFMURATAGRM0335C1H1R5BA01J电容器,陶瓷 C0G/NP0,1.5pF,50V,-0.1pF/+0.1pF,-55oC/+125oC,0201
8C55、C92、C99、C101、C102、C103、C106、C1070.1uFMURATAGRM033C71A104KE14D电容器,陶瓷 X7S,0.1μF,10V,-10%/+10%,-55oC/+125oC,0201
1C8112pFMURATAGRM0335C1H120GA01D电容器,陶瓷 C0G/NP0,12pF,50V,-2%/+2%,-55oC/+125oC,0201
2C91、CA215pFMURATAGRM0335C1H150GA01D电容器,陶瓷 C0G/NP0,15pF,50V,-2%/+2%,-55oC/+125oC,0201
2C104、C10510uFMURATAGRM188Z71A106KA73D电容器,陶瓷 X7R,10uF,10V,-10%/+10%,-55oC/+125oC,0603,SMD
1CR1LPL296-J2L2-25OSRAMLP L296-J2L2-25光电,LED,InGaAlP,绿色,560nm,2V,0.02A,0603
1CR2LS L296-P2Q2-1OSRAMLS L296-P2Q2-1光电,LED,红光,630nm,2V,0.02A,0603
2CR8、CR9TPD6E004RSE德州仪器 (TI)TPD6E004RSER二极管,保护,ESD 阵列 - 6 通道,0.9V 至 5.5V,VBR:7V,-40oC/+85oC,QFN8
1CR10TPD1E0B04DPY德州仪器 (TI)TPD1E0B04DPYR二极管,保护,TVS,BID,6.7V,15W,-40oC/+125oC,X1SON2
2J1、J2SSQ-110-23-L-DSAMTECSSQ-110-23-L-D连接器,接头,母头,直向,2 排,20 引脚,2.54mm,PTH
1J7SMA-10V21-TGGHUS-TSANSMA-10V21-TGG连接器,同轴,射频,母头,直向,1 引脚
1L110uHMURATALQM18DN100M70L电感器,标准,芯片,铁氧体磁芯,10uH,-20%/+20%,0.1A,-55oC/+125oC,0603
1L332.8nHMURATALQP03TN2N8B02J电感器,射频,芯片,非磁芯,2.8nH,-0.1nH/+0.1nH,0.5A,-55oC/+125oC,0201
2P1、P5BB02-HC031-KB1-603000GRADCONNBB02-HC031-KB1-603000连接器,接头,公头,直向,1 排,3 引脚,间距 2.54mm,PTH
1P2BB02-HJ041-KB1-603000GRADCONNBB02-HJ041-KB1-603000连接器,接头,公头,直向,2 排,4 引脚,间距 2.54mm,PTH
1P3SFH11-PBPC-D10-RA-BKSULLINSSFH11-PBPC-D10-RA-BK连接器,接头,母头,直角,2 行,20 引脚,间距 2.54mm,PTH
1P4FTSH-105-01-F-DV-KSAMTECFTSH-105-01-F-DV-K连接器,接头,公头,直向,2 排,10 引脚,间距 1.27mm
1R1100kVISHAYCRCW0201100KJNED电阻器,厚膜,100k,-5%/+5%,0.05W,30V,-55oC/+155oC,0201
4R4、R5、R25、R510VISHAYCRCW06030000Z0EC电阻器,厚膜,0,0R/+0.02R,0.1W,2A,-55oC/+155oC,0603
1R14180VISHAYCRCW0402180RJNED电阻器,厚膜,180,-5%/+5%,0.063W,50V,-55oC/+155oC,0402
1R15220VISHAYCRCW0402220RJNED电阻器,厚膜,220,-5%/+5%,0.063W,50V,-55 °C/+155oC,0402
1R242.2kVISHAYCRCW04022K20JNED电阻器,厚膜,2.2k,-5%/+5%,0.063W,50V,-55oC/+155oC,0402
2R55、R56100VISHAYCRCW0402100RJNED电阻器,厚膜,100,-5%/+5%,0.063W,50V,-55oC/+155oC,0402
2SW1、SW21188E-1K2DIPTRONICS1188E-1K2-V-TR开关,触控,0.05A@12VDC,0.05A@250VAC
1U1CC2340R53E0RKP德州仪器 (TI)CC2340R53E0RKPRIC,微控制器,CC2340R5,32 位 SIMPLELINK 无线 MCU ARM CORTEX -M0+,512kbyte 闪存,1.71V 至 3.8V,VQFN40-EP
1U3MX25R8035FZUIL0MACRONIXMX25R8035FZUIL0IC,内存,闪存,其他,8Mbit,8M X 1 位/ 4M X 2 位/ 2M X 4 位,12ns,1.65V 至 3.6V,uSON8
1U4CAT24C08TDIONSEMICAT24C08TDI-GT3IC,内存,ROM,EEPROM,串行,I2C,8kbit,1k X 8 位,900ns,1.7V 至 5.5V,TSOT23-5
1Y132.768KHzTAI-SAWTZ3359DAAO73晶体,谐振器,32.768KHz,-380PPM/+380PPM,-40oC/+125oC
1Y248MHzTAI-SAWTZ3908AAAO43晶体,谐振器,48MHz,-30PPM/+30PPM,-40DEGC/+125DEGC
1Z601.2pFMURATAGRM0335C1H1R2BA01J电容器,陶瓷 C0G/NP0,1.2pF,50V,-0.1pF/+0.1pF,-55oC/+125oC,0201
1Z612nHMURATALQP03TN2N0B02J电感器,射频,芯片,非磁芯,2nH,-0.1nH/+0.1nH,0.6A,-55oC/+125oC,0201
1Z620.7pFMURATAGRM0335C1HR70BA01J电容器,陶瓷 C0G/NP0,0.7pF,50V,-0.1pF/+0.1pF,-55oC/+125oC,0201