SDAA172 March   2026 AM13E23019

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Schematic Design
    1. 2.1  Package and Device Selection
    2. 2.2  Digital Peripherals
      1. 2.2.1 GPIO
      2. 2.2.2 XBARs
      3. 2.2.3 EPI
      4. 2.2.4 MCAN
      5. 2.2.5 UNICOMM
        1. 2.2.5.1 UART
        2. 2.2.5.2 I2C
        3. 2.2.5.3 SPI
    3. 2.3  Control Peripherals
      1. 2.3.1 eQEP and eCAP
      2. 2.3.2 Timers
    4. 2.4  Analog Peripherals
      1. 2.4.1 Choosing Analog Pins
      2. 2.4.2 Analog Voltage Reference
      3. 2.4.3 ADC Inputs
    5. 2.5  Multiplexed Peripherals
    6. 2.6  Power
      1. 2.6.1 Discrete Power Solution
      2. 2.6.2 Power Decoupling and Filtering
      3. 2.6.3 Analog Voltage Reference
      4. 2.6.4 VSS/VSSA
      5. 2.6.5 Power Consumption
    7. 2.7  Reset
      1. 2.7.1 nRST Pin
      2. 2.7.2 BSL Invoke Pin
      3. 2.7.3 WAKE from LPM Pins
      4. 2.7.4 WAKE From STOP/STANDBY Modes
      5. 2.7.5 WAKE from SHUTDOWN Mode
      6. 2.7.6 AM13E230x Hardware Platform Examples
    8. 2.8  Clocking
      1. 2.8.1 Internal Oscillators
      2. 2.8.2 External Crystal Oscillator (XTAL)
      3. 2.8.3 Digital Clock Input
      4. 2.8.4 Output Clock Generation
    9. 2.9  Debugging and Emulation
      1. 2.9.1 Debug Interfaces
        1. 2.9.1.1 JTAG and SW-DP
        2. 2.9.1.2 Trace
      2. 2.9.2 Debug Probes
    10. 2.10 Boot Interfaces
      1. 2.10.1 UART Bootloader
      2. 2.10.2 I2C Bootloader
      3. 2.10.3 MCAN Bootloader
    11. 2.11 Unused Pins
  6. 3PCB Layout Design
    1. 3.1 Layout Design Overview
      1. 3.1.1 Recommended Layout Practices
      2. 3.1.2 Board Dimensions
      3. 3.1.3 Layer Stackup
        1. 3.1.3.1 4-Layer Stackup
        2. 3.1.3.2 6-Layer Stackup
    2. 3.2 Vias
    3. 3.3 Recommended Board Layout
    4. 3.4 Placing Components
    5. 3.5 Ground Planes
    6. 3.6 Signal Routing Traces
    7. 3.7 Thermal Considerations
  7. 4EOS, EMI/EMC, ESD Considerations
    1. 4.1 Electrical Overstress
    2. 4.2 EMI and EMC
    3. 4.3 Electrostatic Discharge
  8. 5Summary and Checklist
  9. 6References
  10. 7Revision History

2.2.4 MCAN

Controller Area Network (CAN) is a serial communications protocol that efficiently supports distributed real-time control with a high level of reliability. CAN has high immunity to electrical interference and the ability to detect various type of errors. In CAN, many short messages are broadcast to the entire network, which provides data consistency in every node of the system.

The MCAN (Modular CAN) peripheral on AM13E230x MCUs supports both classic CAN and CAN FD (CAN with flexible data-rate) protocols. The CAN FD feature allows higher throughput and increased payload per data frame. Classic CAN and CAN FD devices can coexist on the same network without any conflict, provided that partial network transceivers, which can detect and ignore CAN FD without generating bus errors, are used by the classic CAN devices. The MCAN module is compliant to ISO 11898-1:2015.

In order to connect the AM13E230x MCU to a CAN network, a CAN transceiver must be implemented to serve as the physical layer between the CAN controller (AM13E230x MCU) and the CAN bus. At a high level, the MCAN_RX and MCAN_TX pins connect to the RX and TX pins on the transceiver, respectively. Additional signals may be required as control I/O for the CAN transceiver.

The AM13E230x LaunchPad implements the TCAN3414 transceiver for connecting the system to a CAN bus network. The TCAN3414 transceiver operates from a single 3.3V supply and can operate in CAN and CAN-FD networks up to 8Mbps. For more details on the TCAN3414, refer to the TCAN3414 Data Sheet.

A reference design circuit from the LaunchPad is shown in the following figure.

LP-AM13E230 MCAN Implementation Figure 2-1 LP-AM13E230 MCAN Implementation

Any device GPIO can be used for the STB and SHDN pins. A pull resistor is recommended to keep the transceiver in a known state during power-on.

Transceiver-specific design requirements can be found in the device-specific data sheet.

When using MCAN, it is recommended to implement an external oscillator on the board (XTAL) to clock the AM13E230x device as opposed to using the internal oscillator (SYSOSC). Depending on the required CAN parameters like bit time settings, bit rate, bus length, and propagation delay, the accuracy of the on-chip oscillator may not meet the requirements of the CAN protocol.