SDAA087A September   2025  – February 2026 AM2431 , AM2432 , AM2434 , AM3351 , AM3352 , AM3354 , AM3356 , AM3357 , AM3358 , AM3359 , AM620-Q1 , AM623 , AM625 , AM625-Q1 , AM625SIP , AM62A1-Q1 , AM62A3 , AM62A3-Q1 , AM62A7 , AM62A7-Q1 , AM62D-Q1 , AM62L , AM62P , AM62P-Q1 , AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442 , AM67 , AM67A

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Board Design and Layout Guidance
    1. 2.1 General Board Design Guidance
    2. 2.2 Board Design Guidelines to Follow for Improved Signal Integrity
    3. 2.3 Description of Custom Board Design Simulations Example
  6. 3Custom Board Design Simulations
    1. 3.1 Extraction of Board Model
      1. 3.1.1 Simulations Using IBIS Model and Extracted Board Model
    2. 3.2 Simulation Setup
  7. 4Custom Board Design Examples with Circuit and Examples
    1. 4.1 Simulation Terminologies
    2. 4.2 OSPI Interface Simulation Examples for Different Use Cases
    3. 4.3 RGMII Interface Simulation Examples for Transmit Data Signals with Different Use Cases
  8. 5Summary
  9. 6References
  10. 7Revision History

1 Introduction

The document includes design guidelines that are applicable to custom board design simulation for high speed parallel interfaces. The interfaces support different buffer types (for example: LVCMOS, SDIO, eMMCPHY, or other buffer types, and determines the electrical characteristics) associated with the terminals (pins). Refer to the pin attributes section of the processor-specific data sheet for supported buffer types and the timing and switching characteristics section for the supported speed.

The guidelines can be used for commonly simulated peripherals including eMMC (up to HS200), MMC SD card, MMC SDIO, OSPI, QSPI, and RGMII (Ethernet interface). The simulation approach can be extended to DPI, GPMC, SPI, or other on-board peripheral interfaces. The high speed parallel interface specifications for many of the peripherals are based on JEDEC standards.