ZHCSS31 september   2020 TSB41BA3F-EP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Terminal Configuration and Functions
    1.     Terminal Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - Driver
    6. 6.6 Electrical Characteristics - Receiver
    7. 6.7 Electrical Characteristics - Device
    8. 6.8 Switching Characteristics
  8. 7 Operating Life Deration
  9. 8 Parameter Measurement Information
  10. 9 Overview
  11. 10Functional Block Diagram
  12. 11Principles Of Operation (1394b Interface)
    1. 11.1 LLC Service Request
    2. 11.2 Status Transfer
    3. 11.3 Receive
    4. 11.4 Transmit
  13. 12Principles Of Operation (1394a-2000 Interface)
    1. 12.1 LLC Service Request
    2. 12.2 Status Transfer
    3. 12.3 Receive
    4. 12.4 Transmit
    5. 12.5 Interface Reset and Disable
  14. 13Applications, Implementation, and Layout
    1. 13.1 Known exceptions to functional specification (errata).
      1. 13.1.1 Errata # 1:Restore from Leaf Node (Nephew)
        1. 13.1.1.1 Detailed Description
        2. 13.1.1.2 Background
        3. 13.1.1.3 Workaround Proposal
        4. 13.1.1.4 Corrective Action
    2. 13.2 Application Information
      1. 13.2.1 Interoperability with earlier revisions of TSB41BA3
      2. 13.2.2 Internal Register Configuration
      3. 13.2.3 Feature Enhancements to revision F
        1. 13.2.3.1 Detect Loss of Descrambler Synchronization
          1. 13.2.3.1.1 Detect Loss of Descrambler Synchronization Advantages and Uses
        2. 13.2.3.2 Fast Retrain
          1. 13.2.3.2.1 Fast-Retrain Advantages and Uses
          2. 13.2.3.2.2 Fast-Retrain Backward Compatibility
        3. 13.2.3.3 Fast Power-On Re-connect
          1. 13.2.3.3.1 Fast Power-On Re-Connect Advantages and Uses
          2. 13.2.3.3.2 Fast Power-On Re-Connect Backward Compatibility
        4. 13.2.3.4 Fast Connection Tone Debounce
        5. 13.2.3.5 Programmable invalidCount
      4. 13.2.4 Power-Class Programming
      5. 13.2.5 Using The TSB41BA3F-EP With A 1394-1995 Or 1394a-2000 Link Layer
      6. 13.2.6 Power-Up Reset
      7. 13.2.7 Crystal Selection
      8. 13.2.8 Bus Reset
      9. 13.2.9 Designing With Powerpad™ Devices
  15. 14Device and Documentation Support
    1. 14.1 Tools and Software
    2. 14.2 Device Nomenclature
    3. 14.3 Documentation Support
    4. 14.4 支持资源
    5. 14.5 Trademarks
    6. 14.6 静电放电警告
    7. 14.7 术语表
  16. 15Mechanical, Packaging, and Orderable Information
    1. 15.1 Packaging Information
    2. 15.2 Mechanical Data

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14.2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, your device). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDXDevelopment-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDSFully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (for example, your device). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX and TMDX) through fully qualified production devices and tools (TMS and TMDS).

Device development evolutionary flow:

    TMXExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    TMPPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    TMSProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDXDevelopment-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDSFully-qualified development-support product.

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, your package), the temperature range (for example, blank is the default commercial temperature range), and the device speed range, in megahertz (for example, your device speed range). Figure 14-1 provides a legend for reading the complete device name for any your device device.

For orderable part numbers of your device devices in the your package package types, see the Package Option Addendum of this document, ti.com, or contact your TI sales representative.

For additional description of the device nomenclature markings on the die, see the Silicon Errata.

Figure 14-1 Device Nomenclature