ZHCSEM3F February   2016  – January 2023 TPS82130

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 规格
    1. 6.1 绝对最大额定值
    2. 6.2 ESD 等级
    3. 6.3 建议运行条件
    4. 6.4 热性能信息
    5. 6.5 电气特性
    6. 6.6 典型特性
  7. 7 Detailed Description
    1. 7.1 概述
    2. 7.2 Functional Block Diagram
    3. 7.3 特性说明
      1. 7.3.1 PWM 和 PSM 运行
      2. 7.3.2 低压降运行（100% 占空比）
      3. 7.3.3 开关电流限值
      4. 7.3.4 欠压锁定
      5. 7.3.5 Thermal Shutdown
    4. 7.4 器件功能模式
      1. 7.4.1 启用和禁用（EN）
      2. 7.4.2 软启动（SS/TR）
      3. 7.4.3 电压跟踪（SS/TR）
      4. 7.4.4 电源正常输出（PG）
  8. 8 应用和实现
    1. 8.1 应用信息
    2. 8.2 Typical Applications
      1. 8.2.1 1.8-V Output Application
        1. 8.2.1.1 设计要求
        2. 8.2.1.2 详细设计过程
          1. 8.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 8.2.1.2.2 Setting the Output Voltage
          3. 8.2.1.2.3 Input and Output Capacitor Selection
          4. 8.2.1.2.4 软启动电容器选型
        3. 8.2.1.3 应用性能曲线
    3. 8.3 电源建议
    4. 8.4 布局
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 布局示例
      3. 8.4.3 Thermal Consideration
  9. 9 器件和文档支持
    1. 9.1 器件支持
      1. 9.1.1 开发支持
        1. 9.1.1.1 第三方产品免责声明
        2. 9.1.1.2 Custom Design with WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 商标
    6. 9.6 术语表
    7. 9.7 静电放电警告
  10. 10机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
  • SIL|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4.3 Thermal Consideration

The output current of the TPS82130 must be derated when the device operates in a high ambient temperature or delivers high output power. The amount of current derating is dependent upon the input voltage, output power, PCB layout design, and environmental thermal condition. Care must especially be taken in applications where the localized PCB temperature exceeds 65°C.

The TPS82130 module temperature must be kept less than the maximum rating of 125°C. Three basic approaches for enhancing thermal performance are below:

  • Improve the power dissipation capability of the PCB design.
  • Improve the thermal coupling of the TPS82130 to the PCB.
  • Introduce airflow into the system.

To estimate approximate module temperature of TPS82130, apply the typical efficiency stated in this data sheet to the desired application condition to find the power dissipation of the module. Then, calculate the module temperature rise by multiplying the power dissipation by its thermal resistance. For more details on how to use the thermal parameters in real applications, see the Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs application report and Semiconductor and IC Package Thermal Metrics application report.