ZHCSUF1 January   2024 TPS7H3014-SP

ADVANCE INFORMATION  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Quality Conformance Inspection
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Voltage (IN), VLDO and REFCAP
        1. 7.3.1.1 Undervoltage Lockout (VPOR_IN < VIN < UVLO)
        2. 7.3.1.2 Power-On Reset (VIN < VPOR_IN )
      2. 7.3.2 SENSEx Inputs
        1. 7.3.2.1 VTH_SENSEX and VONx
        2. 7.3.2.2 IHYS_SENSEx and VOFFx
        3. 7.3.2.3 Top and Bottom Resistive Divider Design Equations
      3. 7.3.3 Output Stages (ENx,SEQ_DONE,PWRGD,PULL_UP1 and PULL_UP2)
      4. 7.3.4 User-Programmable TIMERS
        1. 7.3.4.1 DLY_TMR
        2. 7.3.4.2 REG_TMR
      5. 7.3.5 UP and DOWN
      6. 7.3.6 FAULT
      7. 7.3.7 State Machine
    4. 7.4 Daisy Chain
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Self Contained – Sequence UP and DOWN
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Input Power Supplies and Decoupling Capacitors
          2. 8.2.1.2.2 UP and DOWN Thresholds
          3. 8.2.1.2.3 SENSEx Thresholds
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS7H3014-SP UNIT
HFT (CFP)
22 pins
RθJA Junction-to-ambient thermal resistance 34.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.7 °C/W
RθJB Junction-to-board thermal resistance 17.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 16.9 °C/W
ΨJT Junction-to-top characterization parameter 8.6 °C/W
ΨJB Junction-to-board characterization parameter 17 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.