ZHCSUF1 January   2024 TPS7H3014-SP

ADVANCE INFORMATION  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Quality Conformance Inspection
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Voltage (IN), VLDO and REFCAP
        1. 7.3.1.1 Undervoltage Lockout (VPOR_IN < VIN < UVLO)
        2. 7.3.1.2 Power-On Reset (VIN < VPOR_IN )
      2. 7.3.2 SENSEx Inputs
        1. 7.3.2.1 VTH_SENSEX and VONx
        2. 7.3.2.2 IHYS_SENSEx and VOFFx
        3. 7.3.2.3 Top and Bottom Resistive Divider Design Equations
      3. 7.3.3 Output Stages (ENx,SEQ_DONE,PWRGD,PULL_UP1 and PULL_UP2)
      4. 7.3.4 User-Programmable TIMERS
        1. 7.3.4.1 DLY_TMR
        2. 7.3.4.2 REG_TMR
      5. 7.3.5 UP and DOWN
      6. 7.3.6 FAULT
      7. 7.3.7 State Machine
    4. 7.4 Daisy Chain
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Self Contained – Sequence UP and DOWN
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Input Power Supplies and Decoupling Capacitors
          2. 8.2.1.2.2 UP and DOWN Thresholds
          3. 8.2.1.2.3 SENSEx Thresholds
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4.1 Layout Guidelines

  • Make sure that the connection to the VIN pin is low impedance. Place a greater than 1µF ceramic capacitor as near as possible to the VIN pin.
  • Make sure that the connection to the VPULL_UP1 and VPULL_UP2 pins are low impedance. Place a greater than 1µF ceramic capacitor as near as possible to the pins.
  • If needed, place a small capacitor between the SENSEx pins and GND to reduce the sensitivity to transient voltages on the monitored signal.