ZHCSP78B December 2022 – June 2025 TPS748A-Q1
PRODUCTION DATA
| 参数 | 测试条件 | 最小值 | 典型值 | 最大值 | 单位 | |||
|---|---|---|---|---|---|---|---|---|
| VIN | 输入电压范围 | VOUT + VDO | 6.0 | V | ||||
| VBIAS | BIAS 引脚电压范围 | 2.7 | 6.0 | V | ||||
| VREF | 内部基准(可调节) | TA = +25°C | 0.796 | 0.8 | 0.804 | V | ||
| VBIAS(UVLO) | 上升偏置电源 UVLO | 1.0 | 1.25 | 1.75 | V | |||
| VBIAS(UVLO),HYST | 偏置电源 UVLO 迟滞 | 20 | 43 | 65 | mV | |||
| ΔVOUT(ΔVIN) | 输出电压范围 | VIN = 5V,IOUT = 1.5A | VREF | 3.6 | V | |||
| 精度(1)(5) | 2.97V ≤ VBIAS ≤ 5.5V,50mA ≤ IOUT ≤ 1.5A | -1.25 | ±0.5 | 1.25 | % | |||
| ΔVOUT(ΔIOUT) | 线路调节 | VOUT(nom) + 0.3 ≤ VIN ≤ 5.5V | 0.03 | %/V | ||||
| VOUT | 负载调整率 | 50 mA ≤ IOUT ≤ 1.5 A | 0.09 | %/A | ||||
| VDO(IN) | VIN 压降电压(2) | IOUT = 1.5A,VBIAS – VOUT(nom) ≥ 3.25V(3) | 75 | 150 | mV | |||
| VDO(BIAS) | VBIAS 压降电压(2) | IOUT = 1.5A,VIN = VBIAS | 1.14 | 1.35 | V | |||
| ICL | 输出电流限制 | VOUT = 80% × VOUT(nom) | 2.3 | 3.1 | A | |||
| IBIAS | BIAS 引脚电流 | IOUT = 50mA | 0.67 | 1.1 | mA | |||
| ISHDN | 关断电源电流 (IGND) | VEN ≤ 0.4V,VIN = 1.1V,VOUT = 0.8V | 0.9 | 15 | µA | |||
| IFB | 反馈引脚电流 | -0.22 | ±0.12 | 0.22 | µA | |||
| PSRR | 电源抑制(VIN 至 VOUT) | 1kHz,IOUT = 1.5A,VIN = 1.1V,VOUT = 0.8V | 69 | dB | ||||
| 300kHz,IOUT = 1.5A,VIN = 1.1V,VOUT = 0.8V | 30 | |||||||
| 电源抑制(VBIAS 至 VOUT) | 1kHz,IOUT = 1.5A,VIN = 1.1V,VOUT = 0.8V | 59 | ||||||
| 300kHz,IOUT = 1.5A,VIN = 1.1V,VOUT = 0.8V | 33 | |||||||
| Vn | 输出噪声电压 | BW = 100Hz 至 100kHz,IOUT = 1.5A,CSS = 1nF | 7 | μVrms x Vout | ||||
| tSTR | 最短启动时间 | IOUT = 1.0A 时的 RLOAD,CSS = 开路 | 170 | µs | ||||
| ISS | 软启动充电电流 | VSS = 0.4V | 7.5 | µA | ||||
| tSS | 软启动时间 | Css = 10nF | 1.2 | ms | ||||
| VEN(hi) | 使能输入高电平 | 1.1 | 5.5 | V | ||||
| VEN(lo) | 使能输入低电平 | 0 | 0.4 | V | ||||
| VEN(hys) | 使能引脚迟滞 | 55 | mV | |||||
| VEN(dg) | 使能引脚抗尖峰脉冲时间 | 17 | µs | |||||
| IEN | 使能引脚电流 | VEN = 5V | 0.1 | 0.3 | µA | |||
| VIT | PG 跳变阈值 | VOUT 降低 | 85 | 90 | 94 | %VOUT | ||
| VHYS | PG 跳变迟滞 | 2.5 | %VOUT | |||||
| VPG(lo) | PG 输出低电压 | IPG = 1mA(灌电流),VOUT < VIT | 0.125 | V | ||||
| IPG(lkg) | PG 漏电流 | VPG = 5.25V,VOUT > VIT | 0.01 | 0.1 | µA | |||
| TJ | 工作结温 | -40 | 125 | ℃ | ||||
| TSD | 热关断温度 | 关断,温度升高 | 165 | ℃ | ||||
| 复位,温度降低 | 140 | |||||||