ZHCS614G October   2011  – September 2022 TPS40422

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  PMBus Interface Protocol General Description
      2. 8.3.2  Voltage Reference
      3. 8.3.3  Output Voltage
      4. 8.3.4  Voltage Feed Forward
      5. 8.3.5  Current Sensing
      6. 8.3.6  Overcurrent Protection
      7. 8.3.7  Current Sharing
      8. 8.3.8  Linear Regulators
      9. 8.3.9  BP Switch-over
      10. 8.3.10 Switching Frequency Setting
      11. 8.3.11 Switching Node and BOOT Voltage
      12. 8.3.12 Reading the Output Current
      13. 8.3.13 Soft-Start Time
      14. 8.3.14 Turn-On/Turn-Off Delay and Sequencing
      15. 8.3.15 Pre-Biased Output Start-Up
      16. 8.3.16 Undervoltage Lockout
      17. 8.3.17 Overvoltage and Undervoltage Fault Protection
      18. 8.3.18 Power Good
      19. 8.3.19 Overtemperature Fault Protection
      20. 8.3.20 Thermal Shutdown
      21. 8.3.21 Programmable Fault Responses
      22. 8.3.22 User Data
      23. 8.3.23 Adjustable Anti-Cross Conduction Delay
      24. 8.3.24 Connection of Unused Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Control Signal
      2. 8.4.2 OPERATION Command
      3. 8.4.3 Control Signal and OPERATION Command
      4. 8.4.4 Two-Phase Mode Operation
    5. 8.5 Programming
      1. 8.5.1 Supported PMBus Commands
        1. 8.5.1.1 PMBus Address
        2. 8.5.1.2 PMBus Connections
        3. 8.5.1.3 PMBus Data Format
        4. 8.5.1.4 PMBus Interface Output Voltage Adjustment
        5. 8.5.1.5 53
    6. 8.6 Register Maps
      1. 8.6.1 Supported Commands
        1. 8.6.1.1  PAGE (00h)
        2. 8.6.1.2  OPERATION (01h)
          1. 8.6.1.2.1 On
          2. 8.6.1.2.2 Margin
        3. 8.6.1.3  ON_OFF_CONFIG (02h)
          1. 8.6.1.3.1 pu
          2. 8.6.1.3.2 cmd
          3. 8.6.1.3.3 CPR
          4. 8.6.1.3.4 pol
          5. 8.6.1.3.5 CPA
        4. 8.6.1.4  CLEAR_FAULTS (03h)
        5. 8.6.1.5  WRITE_PROTECT (10h)
          1. 8.6.1.5.1 bit5
          2. 8.6.1.5.2 bit6
          3. 8.6.1.5.3 bit7
        6. 8.6.1.6  STORE_USER_ALL (15h)
        7. 8.6.1.7  RESTORE_USER_ALL (16h)
        8. 8.6.1.8  CAPABILITY (19h)
        9. 8.6.1.9  VOUT_MODE (20h)
          1. 8.6.1.9.1 Mode:
          2. 8.6.1.9.2 Exponent
        10. 8.6.1.10 VIN_ON (35h)
          1. 8.6.1.10.1 Exponent
          2. 8.6.1.10.2 Mantissa
        11. 8.6.1.11 VIN_OFF (36h)
          1. 8.6.1.11.1 Exponent
          2. 8.6.1.11.2 Mantissa
        12. 8.6.1.12 IOUT_CAL_GAIN (38h)
          1. 8.6.1.12.1 Exponent
          2. 8.6.1.12.2 Mantissa
        13. 8.6.1.13 IOUT_CAL_OFFSET (39h)
          1. 8.6.1.13.1 Exponent
          2. 8.6.1.13.2 Mantissa
        14. 8.6.1.14 IOUT_OC_FAULT_LIMIT (46h)
          1. 8.6.1.14.1 Exponent
          2. 8.6.1.14.2 Mantissa
        15. 8.6.1.15 IOUT_OC_FAULT_RESPONSE (47h)
          1. 8.6.1.15.1 RS[2:0]
        16. 8.6.1.16 IOUT_OC_WARN_LIMIT (4Ah)
          1. 8.6.1.16.1 Exponent
          2. 8.6.1.16.2 Mantissa
        17. 8.6.1.17 OT_FAULT_LIMIT (4Fh)
          1. 8.6.1.17.1 Exponent
          2. 8.6.1.17.2 Mantissa
        18. 8.6.1.18 OT_WARN_LIMIT (51h)
          1. 8.6.1.18.1 Exponent
          2. 8.6.1.18.2 Mantissa
        19. 8.6.1.19 TON_RISE (61h)
          1. 8.6.1.19.1 Exponent
          2. 8.6.1.19.2 Mantissa
        20. 8.6.1.20 STATUS_BYTE (78h)
        21. 8.6.1.21 STATUS_WORD (79h)
        22. 8.6.1.22 STATUS_VOUT (7Ah)
        23. 8.6.1.23 STATUS_IOUT (7Bh)
        24. 8.6.1.24 STATUS_TEMPERATURE (7Dh)
        25. 8.6.1.25 STATUS_CML (7Eh)
        26. 8.6.1.26 STATUS_MFR_SPECIFIC (80h)
        27. 8.6.1.27 READ_VOUT (8Bh)
        28. 8.6.1.28 READ_IOUT (8Ch)
          1. 8.6.1.28.1 Exponent
          2. 8.6.1.28.2 Mantissa
        29. 8.6.1.29 READ_TEMPERATURE_2 (8Eh)
          1. 8.6.1.29.1 Exponent
          2. 8.6.1.29.2 Mantissa
        30. 8.6.1.30 PMBUS_REVISION (98h)
        31. 8.6.1.31 MFR_SPECIFIC_00 (D0h)
        32. 8.6.1.32 VREF_TRIM (MFR_SPECIFIC_04) (D4h)
        33. 8.6.1.33 STEP_VREF_MARGIN_HIGH (MFR_SPECIFIC_05) (D5h)
        34. 8.6.1.34 STEP_VREF_MARGIN_LOW (MFR_SPECIFIC_06) (D6h)
        35. 8.6.1.35 PCT_VOUT_FAULT_PG_LIMIT (MFR_SPECIFIC_07) (D7h)
        36. 8.6.1.36 126
        37. 8.6.1.37 SEQUENCE_TON_TOFF_DELAY (MFR_SPECIFIC_08) (D8h)
        38. 8.6.1.38 128
        39. 8.6.1.39 OPTIONS (MFR_SPECIFIC_21) (E5h)
        40. 8.6.1.40 DEVICE_CODE (MFR_SPECIFIC_44) (FCh)
          1. 8.6.1.40.1 Identifier Code
          2. 8.6.1.40.2 Revision Code
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Dual-Output Converter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 9.2.1.2.2 Step 1: Inductor Selection
          3. 9.2.1.2.3 Step 2: Output Capacitor Selection
          4. 9.2.1.2.4 Step 3: Input Capacitance Selection
          5. 9.2.1.2.5 Step 4: MOSFET Selection
          6. 9.2.1.2.6 Step 5: Snubber Circuit Design
          7. 9.2.1.2.7 Step 6: Soft-Start Time
          8. 9.2.1.2.8 Step 7: Peripheral Component Design
            1. 9.2.1.2.8.1 RT (Pin 1) Switching Frequency Setting
            2. 9.2.1.2.8.2 FB1 (Pin 2) and FB2 (Pin 8) Output Voltage Setting
            3. 9.2.1.2.8.3 Compensation Network Using COMP1 (Pin 3) , COMP2 (Pin 7), FB1 (Pin 2) FB2 DIFFO1 (Pin 8) (Pin 39)
            4. 9.2.1.2.8.4 Remote Sensing Using VSNS1 (Pin 37), GSNS1 (Pin 38) , VSNS2 (Pin 15), and GSNS2 (Pin 14)
            5. 9.2.1.2.8.5 Temperate Sensing Using TSNS1 (Pin36) and TSNS2 (Pin 16)
            6. 9.2.1.2.8.6 Current Sensing Network Design Using CS1P (Pin 34), CS1N (Pin 35) , CS2P (Pin 18), and CS2N (Pin 17)
            7. 9.2.1.2.8.7 PMBus Address ADDR1 (Pin 9) , and ADDR0 (Pin 10)
            8. 9.2.1.2.8.8 Voltage Decoupling Capacitors
              1. 9.2.1.2.8.8.1  VDD (Pin 31)
              2. 9.2.1.2.8.8.2  BP3 (Pin 32)
              3. 9.2.1.2.8.8.3  BNEXT (Pin 24)
              4. 9.2.1.2.8.8.4  BP6 (Pin 25)
              5. 9.2.1.2.8.8.5  Power Good PGOOD1 (Pin 33), PGOOD2 (Pin 19)
              6. 9.2.1.2.8.8.6  Bootstrap Capacitors BOOT1 (Pin 30), and BOOT2 (Pin 20)
              7. 9.2.1.2.8.8.7  High-Side MOSFET (Gate) Resistor
              8. 9.2.1.2.8.8.8  Synchronization Setting SYNC (Pin 40)
              9. 9.2.1.2.8.8.9  BP6 (Pin 25)
              10. 9.2.1.2.8.8.10 DIFFO (Pin 39)
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout Guidelines
      2. 11.1.2 MOSFET Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.3.11 Switching Node and BOOT Voltage

The maximum voltage rating of the switching node and BOOT pins is 30 V. The limit of 30 V on the BOOT1 and BOOT2 pin voltage should be strictly enforced. If the voltage spike of BOOT1 or BOOT2 is above 30 V during operation, the internal boot diode might be damaged and result in permanent failure. To reduce the voltage spike on the switching node, the R-C snubber can be added. Furthermore, the BOOT resistor can be added to slow down the turn-on of high-side switch. If the voltage spike remains above 30 V with an R-C snubber and a boot resistor, add a gate resistor as shown in Figure 8-5 to slow down the turn-on time of the high-side switch and to further reduce voltage spikes. To eliminate the impact of the gate resistor to the turn-off time of the high-side switch, place a Schottky diode in parallel with the gate resistor.

If the approaches described in this section do not reduce the BOOTx voltage to within 30 V, add an external BOOT diode between the BP6 pin and the BOOTx pin. The forward voltage of the external BOOT diode must be less than that of internal BOOT diode and the voltage rating should be higher than the BOOT voltage spike.

GUID-AC695590-586A-4876-8D99-5F1A9FA51255-low.gifFigure 8-5 Adding a BOOT Resistor and Gate Resistor