ZHCSJC6F March   2016  – June 2018 TDA2E

PRODUCTION DATA.  

  1. 器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 修订历史记录
  3. Device Comparison
    1. 3.1 Device Comparison Table
  4. Terminal Configuration and Functions
    1. 4.1 Terminal Assignment
      1. 4.1.1 Unused Balls Connection Requirements
    2. 4.2 Ball Characteristics
    3. 4.3 Multiplexing Characteristics
    4. 4.4 Signal Descriptions
      1. 4.4.1  Video Input Ports (VIP)
      2. 4.4.2  Display Subsystem – Video Output Ports
      3. 4.4.3  Display Subsystem – High-Definition Multimedia Interface (HDMI)
      4. 4.4.4  Camera Serial Interface 2 CAL bridge (CSI2)
      5. 4.4.5  External Memory Interface (EMIF SDRAM)
      6. 4.4.6  General-Purpose Memory Controller (GPMC)
      7. 4.4.7  Timers
      8. 4.4.8  Inter-Integrated Circuit Interface (I2C)
      9. 4.4.9  Universal Asynchronous Receiver Transmitter (UART)
      10. 4.4.10 Multichannel Serial Peripheral Interface (McSPI)
      11. 4.4.11 Quad Serial Peripheral Interface (QSPI)
      12. 4.4.12 Multichannel Audio Serial Port (McASP)
      13. 4.4.13 Universal Serial Bus (USB)
      14. 4.4.14 SATA
      15. 4.4.15 Peripheral Component Interconnect Express (PCIe)
      16. 4.4.16 Controller Area Network Interface (DCAN)
      17. 4.4.17 Ethernet Interface (GMAC_SW)
      18. 4.4.18 eMMC/SD/SDIO
      19. 4.4.19 General-Purpose Interface (GPIO)
      20. 4.4.20 Pulse Width Modulation (PWM) Interface
      21. 4.4.21 Test Interfaces
      22. 4.4.22 System and Miscellaneous
        1. 4.4.22.1 Sysboot
        2. 4.4.22.2 Power, Reset, and Clock Management (PRCM)
        3. 4.4.22.3 Real-Time Clock (RTC) Interface
        4. 4.4.22.4 System Direct Memory Access (SDMA)
        5. 4.4.22.5 Interrupt Controllers (INTC)
        6. 4.4.22.6 Observability
      23. 4.4.23 Power Supplies
  5. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power on Hour (POH) Limits
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Operating Performance Points
      1. 5.5.1 AVS and ABB Requirements
      2. 5.5.2 Voltage And Core Clock Specifications
      3. 5.5.3 Maximum Supported Frequency
    6. 5.6 Power Consumption Summary
    7. 5.7 Electrical Characteristics
      1. 5.7.1  LVCMOS DDR DC Electrical Characteristics
      2. 5.7.2  HDMIPHY DC Electrical Characteristics
      3. 5.7.3  Dual Voltage LVCMOS I2C DC Electrical Characteristics
      4. 5.7.4  IQ1833 Buffers DC Electrical Characteristics
      5. 5.7.5  IHHV1833 Buffers DC Electrical Characteristics
      6. 5.7.6  LVCMOS CSI2 DC Electrical Characteristics
      7. 5.7.7  BC1833IHHV Buffers DC Electrical Characteristics
      8. 5.7.8  USBPHY DC Electrical Characteristics
      9. 5.7.9  Dual Voltage SDIO1833 DC Electrical Characteristics
      10. 5.7.10 Dual Voltage LVCMOS DC Electrical Characteristics
      11. 5.7.11 SATAPHY DC Electrical Characteristics
      12. 5.7.12 PCIEPHY DC Electrical Characteristics
    8. 5.8 Thermal Characteristics
      1. 5.8.1 Package Thermal Characteristics
    9. 5.9 Power Supply Sequences
  6. Clock Specifications
    1. 6.1 Input Clock Specifications
      1. 6.1.1 Input Clock Requirements
      2. 6.1.2 System Oscillator OSC0 Input Clock
        1. 6.1.2.1 OSC0 External Crystal
        2. 6.1.2.2 OSC0 Input Clock
      3. 6.1.3 Auxiliary Oscillator OSC1 Input Clock
        1. 6.1.3.1 OSC1 External Crystal
        2. 6.1.3.2 OSC1 Input Clock
      4. 6.1.4 RTC Oscillator Input Clock
        1. 6.1.4.1 RTC Oscillator External Crystal
        2. 6.1.4.2 RTC Oscillator Input Clock
        3. 6.1.4.3 RC On-die Oscillator Clock
    2. 6.2 DPLLs, DLLs Specifications
      1. 6.2.1 DPLL Characteristics
      2. 6.2.2 DLL Characteristics
      3. 6.2.3 DPLL and DLL Noise Isolation
  7. Timing Requirements and Switching Characteristics
    1. 7.1  Timing Test Conditions
    2. 7.2  Interface Clock Specifications
      1. 7.2.1 Interface Clock Terminology
      2. 7.2.2 Interface Clock Frequency
    3. 7.3  Timing Parameters and Information
      1. 7.3.1 Parameter Information
        1. 7.3.1.1 1.8V and 3.3V Signal Transition Levels
        2. 7.3.1.2 1.8V and 3.3V Signal Transition Rates
        3. 7.3.1.3 Timing Parameters and Board Routing Analysis
    4. 7.4  Recommended Clock and Control Signal Transition Behavior
    5. 7.5  Virtual and Manual I/O Timing Modes
    6. 7.6  Video Input Ports (VIP)
    7. 7.7  Display Subsystem - Video Output Ports
    8. 7.8  Display Subsystem - High-Definition Multimedia Interface (HDMI)
    9. 7.9  Camera Serial Interface 2 CAL bridge (CSI2)
      1. 7.9.1 CSI-2 MIPI D-PHY
    10. 7.10 External Memory Interface (EMIF)
    11. 7.11 General-Purpose Memory Controller (GPMC)
      1. 7.11.1 GPMC/NOR Flash Interface Synchronous Timing
      2. 7.11.2 GPMC/NOR Flash Interface Asynchronous Timing
      3. 7.11.3 GPMC/NAND Flash Interface Asynchronous Timing
    12. 7.12 Timers
    13. 7.13 Inter-Integrated Circuit Interface (I2C)
      1. Table 7-33 Timing Requirements for I2C Input Timings
      2. Table 7-34 Timing Requirements for I2C HS-Mode (I2C3/4/5/6 Only)
      3. Table 7-35 Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
    14. 7.14 Universal Asynchronous Receiver Transmitter (UART)
      1. Table 7-36 Timing Requirements for UART
      2. Table 7-37 Switching Characteristics Over Recommended Operating Conditions for UART
    15. 7.15 Multichannel Serial Peripheral Interface (McSPI)
    16. 7.16 Quad Serial Peripheral Interface (QSPI)
    17. 7.17 Multichannel Audio Serial Port (McASP)
      1. Table 7-44 Timing Requirements for McASP1
      2. Table 7-45 Timing Requirements for McASP2
      3. Table 7-46 Timing Requirements for McASP3/4/5/6/7/8
    18. 7.18 Universal Serial Bus (USB)
      1. 7.18.1 USB1 DRD PHY
      2. 7.18.2 USB2 PHY
      3. 7.18.3 USB3 DRD ULPI-SDR-Slave Mode-12-pin Mode
    19. 7.19 Serial Advanced Technology Attachment (SATA)
    20. 7.20 Peripheral Component Interconnect Express (PCIe)
    21. 7.21 Controller Area Network Interface (DCAN)
      1. Table 7-64 Timing Requirements for DCANx Receive
      2. Table 7-65 Switching Characteristics Over Recommended Operating Conditions for DCANx Transmit
    22. 7.22 Ethernet Interface (GMAC_SW)
      1. 7.22.1 GMAC MII Timings
        1. Table 7-66 Timing Requirements for miin_rxclk - MII Operation
        2. Table 7-67 Timing Requirements for miin_txclk - MII Operation
        3. Table 7-68 Timing Requirements for GMAC MIIn Receive 10/100 Mbit/s
        4. Table 7-69 Switching Characteristics Over Recommended Operating Conditions for GMAC MIIn Transmit 10/100 Mbits/s
      2. 7.22.2 GMAC MDIO Interface Timings
      3. 7.22.3 GMAC RMII Timings
        1. Table 7-74 Timing Requirements for GMAC REF_CLK - RMII Operation
        2. Table 7-75 Timing Requirements for GMAC RMIIn Receive
        3. Table 7-76 Switching Characteristics Over Recommended Operating Conditions for GMAC REF_CLK - RMII Operation
        4. Table 7-77 Switching Characteristics Over Recommended Operating Conditions for GMAC RMIIn Transmit 10/100 Mbits/s
      4. 7.22.4 GMAC RGMII Timings
        1. Table 7-81 Timing Requirements for rgmiin_rxc - RGMIIn Operation
        2. Table 7-82 Timing Requirements for GMAC RGMIIn Input Receive for 10/100/1000 Mbps
        3. Table 7-83 Switching Characteristics Over Recommended Operating Conditions for rgmiin_txctl - RGMIIn Operation for 10/100/1000 Mbit/s
        4. Table 7-84 Switching Characteristics for GMAC RGMIIn Output Transmit for 10/100/1000 Mbps
    23. 7.23 eMMC/SD/SDIO
      1. 7.23.1 MMC1-SD Card Interface
        1. 7.23.1.1 Default speed, 4-bit data, SDR, half-cycle
        2. 7.23.1.2 High speed, 4-bit data, SDR, half-cycle
        3. 7.23.1.3 SDR12, 4-bit data, half-cycle
        4. 7.23.1.4 SDR25, 4-bit data, half-cycle
        5. 7.23.1.5 UHS-I SDR50, 4-bit data, half-cycle
        6. 7.23.1.6 UHS-I SDR104, 4-bit data, half-cycle
        7. 7.23.1.7 UHS-I DDR50, 4-bit data
      2. 7.23.2 MMC2 - eMMC
        1. 7.23.2.1 Standard JC64 SDR, 8-bit data, half cycle
        2. 7.23.2.2 High-speed JC64 SDR, 8-bit data, half cycle
        3. 7.23.2.3 High-speed HS200 JEDS84, 8-bit data, half cycle
        4. 7.23.2.4 High-speed JC64 DDR, 8-bit data
          1. Table 7-109 Switching Characteristics for MMC2 - JC64 High Speed DDR Mode
      3. 7.23.3 MMC3 and MMC4-SDIO/SD
        1. 7.23.3.1 MMC3 and MMC4, SD Default Speed
        2. 7.23.3.2 MMC3 and MMC4, SD High Speed
        3. 7.23.3.3 MMC3 and MMC4, SD and SDIO SDR12 Mode
        4. 7.23.3.4 MMC3 and MMC4, SD SDR25 Mode
        5. 7.23.3.5 MMC3 SDIO High-Speed UHS-I SDR50 Mode, Half Cycle
    24. 7.24 General-Purpose Interface (GPIO)
    25. 7.25 System and Miscellaneous interfaces
    26. 7.26 Test Interfaces
      1. 7.26.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
        1. 7.26.1.1 JTAG Electrical Data/Timing
          1. Table 7-131 Timing Requirements for IEEE 1149.1 JTAG
          2. Table 7-132 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
          3. Table 7-133 Timing Requirements for IEEE 1149.1 JTAG With RTCK
          4. Table 7-134 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG With RTCK
      2. 7.26.2 Trace Port Interface Unit (TPIU)
        1. 7.26.2.1 TPIU PLL DDR Mode
  8. Applications, Implementation, and Layout
    1. 8.1 Introduction
      1. 8.1.1 Initial Requirements and Guidelines
    2. 8.2 Power Optimizations
      1. 8.2.1 Step 1: PCB Stack-up
      2. 8.2.2 Step 2: Physical Placement
      3. 8.2.3 Step 3: Static Analysis
        1. 8.2.3.1 PDN Resistance and IR Drop
      4. 8.2.4 Step 4: Frequency Analysis
      5. 8.2.5 System ESD Generic Guidelines
        1. 8.2.5.1 System ESD Generic PCB Guideline
        2. 8.2.5.2 Miscellaneous EMC Guidelines to Mitigate ESD Immunity
        3. 8.2.5.3 ESD Protection System Design Consideration
      6. 8.2.6 EMI / EMC Issues Prevention
        1. 8.2.6.1 Signal Bandwidth
        2. 8.2.6.2 Signal Routing
          1. 8.2.6.2.1 Signal Routing—Sensitive Signals and Shielding
          2. 8.2.6.2.2 Signal Routing—Outer Layer Routing
        3. 8.2.6.3 Ground Guidelines
          1. 8.2.6.3.1 PCB Outer Layers
          2. 8.2.6.3.2 Metallic Frames
          3. 8.2.6.3.3 Connectors
          4. 8.2.6.3.4 Guard Ring on PCB Edges
          5. 8.2.6.3.5 Analog and Digital Ground
    3. 8.3 Core Power Domains
      1. 8.3.1 General Constraints and Theory
      2. 8.3.2 Voltage Decoupling
      3. 8.3.3 Static PDN Analysis
      4. 8.3.4 Dynamic PDN Analysis
      5. 8.3.5 Power Supply Mapping
      6. 8.3.6 DPLL Voltage Requirement
      7. 8.3.7 Example PCB Design
        1. 8.3.7.1 Example Stack-up
        2. 8.3.7.2 vdd Example Analysis
    4. 8.4 Single-Ended Interfaces
      1. 8.4.1 General Routing Guidelines
      2. 8.4.2 QSPI Board Design and Layout Guidelines
    5. 8.5 Differential Interfaces
      1. 8.5.1 General Routing Guidelines
      2. 8.5.2 USB 2.0 Board Design and Layout Guidelines
        1. 8.5.2.1 Background
        2. 8.5.2.2 USB PHY Layout Guide
          1. 8.5.2.2.1 General Routing and Placement
          2. 8.5.2.2.2 Specific Guidelines for USB PHY Layout
            1. 8.5.2.2.2.1  Analog, PLL, and Digital Power Supply Filtering
            2. 8.5.2.2.2.2  Analog, Digital, and PLL Partitioning
            3. 8.5.2.2.2.3  Board Stackup
            4. 8.5.2.2.2.4  Cable Connector Socket
            5. 8.5.2.2.2.5  Clock Routings
            6. 8.5.2.2.2.6  Crystals/Oscillator
            7. 8.5.2.2.2.7  DP/DM Trace
            8. 8.5.2.2.2.8  DP/DM Vias
            9. 8.5.2.2.2.9  Image Planes
            10. 8.5.2.2.2.10 Power Regulators
        3. 8.5.2.3 References
      3. 8.5.3 USB 3.0 Board Design and Layout Guidelines
        1. 8.5.3.1 USB 3.0 interface introduction
        2. 8.5.3.2 USB 3.0 General routing rules
      4. 8.5.4 HDMI Board Design and Layout Guidelines
        1. 8.5.4.1 HDMI Interface Schematic
        2. 8.5.4.2 TMDS General Routing Guidelines
        3. 8.5.4.3 TPD5S115
        4. 8.5.4.4 HDMI ESD Protection Device (Required)
        5. 8.5.4.5 PCB Stackup Specifications
        6. 8.5.4.6 Grounding
      5. 8.5.5 PCIe Board Design and Layout Guidelines
        1. 8.5.5.1 PCIe Connections and Interface Compliance
          1. 8.5.5.1.1 Coupling Capacitors
          2. 8.5.5.1.2 Polarity Inversion
        2. 8.5.5.2 Non-standard PCIe connections
          1. 8.5.5.2.1 PCB Stackup Specifications
          2. 8.5.5.2.2 Routing Specifications
            1. 8.5.5.2.2.1 Impedance
            2. 8.5.5.2.2.2 Differential Coupling
            3. 8.5.5.2.2.3 Pair Length Matching
        3. 8.5.5.3 LJCB_REFN/P Connections
      6. 8.5.6 CSI2 Board Design and Routing Guidelines
        1. 8.5.6.1 CSI2_0 and CSI2_1 MIPI CSI-2 (1.5 Gbps)
          1. 8.5.6.1.1 General Guidelines
          2. 8.5.6.1.2 Length Mismatch Guidelines
            1. 8.5.6.1.2.1 CSI2_0 and CSI2_1 MIPI CSI-2 (1.5 Gbps)
          3. 8.5.6.1.3 Frequency-domain Specification Guidelines
    6. 8.6 DDR3 Board Design and Layout Guidelines
      1. 8.6.1 DDR3 General Board Layout Guidelines
      2. 8.6.2 DDR3 Board Design and Layout Guidelines
        1. 8.6.2.1  Board Designs
        2. 8.6.2.2  DDR3 EMIF
        3. 8.6.2.3  DDR3 Device Combinations
        4. 8.6.2.4  DDR3 Interface Schematic
          1. 8.6.2.4.1 32-Bit DDR3 Interface
          2. 8.6.2.4.2 16-Bit DDR3 Interface
        5. 8.6.2.5  Compatible JEDEC DDR3 Devices
        6. 8.6.2.6  PCB Stackup
        7. 8.6.2.7  Placement
        8. 8.6.2.8  DDR3 Keepout Region
        9. 8.6.2.9  Bulk Bypass Capacitors
        10. 8.6.2.10 High-Speed Bypass Capacitors
          1. 8.6.2.10.1 Return Current Bypass Capacitors
        11. 8.6.2.11 Net Classes
        12. 8.6.2.12 DDR3 Signal Termination
        13. 8.6.2.13 VREF_DDR Routing
        14. 8.6.2.14 VTT
        15. 8.6.2.15 CK and ADDR_CTRL Topologies and Routing Definition
          1. 8.6.2.15.1 Four DDR3 Devices
            1. 8.6.2.15.1.1 CK and ADDR_CTRL Topologies, Four DDR3 Devices
            2. 8.6.2.15.1.2 CK and ADDR_CTRL Routing, Four DDR3 Devices
          2. 8.6.2.15.2 Two DDR3 Devices
            1. 8.6.2.15.2.1 CK and ADDR_CTRL Topologies, Two DDR3 Devices
            2. 8.6.2.15.2.2 CK and ADDR_CTRL Routing, Two DDR3 Devices
          3. 8.6.2.15.3 One DDR3 Device
            1. 8.6.2.15.3.1 CK and ADDR_CTRL Topologies, One DDR3 Device
            2. 8.6.2.15.3.2 CK and ADDR/CTRL Routing, One DDR3 Device
        16. 8.6.2.16 Data Topologies and Routing Definition
          1. 8.6.2.16.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
          2. 8.6.2.16.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
        17. 8.6.2.17 Routing Specification
          1. 8.6.2.17.1 CK and ADDR_CTRL Routing Specification
          2. 8.6.2.17.2 DQS and DQ Routing Specification
  9. Device and Documentation Support
    1. 9.1 Device Nomenclature and Orderable Information
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Receiving Notification of Documentation Updates
    5. 9.5 Community Resources
    6. 9.6 商标
    7. 9.7 静电放电警告
    8. 9.8 出口管制提示
    9. 9.9 术语表
  10. 10Mechanical Packaging Information
    1. 10.1 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Power Supply Sequences

This section describes the power-up and power-down sequence required to ensure proper device operation. The power supply names described in this section comprise a superset of a family of compatible devices. Some members of this family will not include a subset of these power supplies and their associated device modules. Refer to the Section 4.2, Ball Characteristics of the Section 4, Terminal Configuration and Functions to determine which power supplies are applicable.

Figure 5-2 and Figure 5-3 describe the device Power Sequencing when RTC-mode is used.

TDA2E SPRS906_ELCH_01.gifFigure 5-2 Power-Up Sequencing
  1. Grey shaded areas are windows where it is valid to ramp the voltage rail.
  2. Blue dashed lines are not valid windows but show alternate ramp possibilities based on the associated note.
  3. If RTC-mode is used then vdda_rtc, vdd_rtc and vddshv5 must be individually powered with separate power supplies and cannot be combined with other rails.
  4. vdd must ramp before or at the same time as vdd_mpu, vdd_gpu, vdd_dsp and vdd_iva.
  5. vdd_mpu, vdd_gpu, vdd_dsp, vdd_iva can be ramped at the same time or can be staggered.
  6. If any of the vddshv[1-7,9-11] rails (not including vddshv8) are used as 1.8V only, then these rails can be combined with vdds18v.
  7. vddshv8 is separated out to show support for dual voltage. If single voltage is used then vddshv8 can be combined with other vddshvn rails but vddshv8 must ramp after vdd.
  8. vdds and vdda rails must not be combined together.
  9. Pulse duration: rtc_porz must remain low 1ms after vdda_rtc, vddshv5, and vdd_rtc are ramped and stable.
  10. The SYS_32K source must be stable and at a valid frequency 1ms prior to de-asserting rtc_porz high.
  11. Pulse duration: porz must remain low a minimum of 12P(15) after xi_osc0 is stable and at a valid frequency. porz must also remain low until all supply rails are valid and stable. resetn must be high prior to, or simultaneous with, porz rising. During initial power-up, resetn can rise any time after, or concurrently with, its supply voltage, vddshv3 rising.
  12. Setup time: sysboot[15:0] pins must be valid 2P(15) before porz is de-asserted high.
  13. Hold time: sysboot[15:0] pins must be valid 15P(15) after porz is de-asserted high.
  14. porz to rstoutn delay is 2ms.
  15. P = 1/(SYS_CLK1/610) frequency in ns.
TDA2E SPRS906_ELCH_02.gifFigure 5-3 Power-Down Sequencing
  1. xi_osc0 can be turned off anytime after porz assertion and must be turned off before vdda_osc voltage rail is shutdown.
  2. Grey shaded areas are windows where it is valid to ramp the voltage rail.
  3. Blue dashed lines are not valid windows but show alternate ramp possibilities based on the associated note.
  4. If RTC-mode is supported then vdda_rtc, vdd_rtc and vddshv5 must be individually powered with separate power supplies and cannot be combined with other rails.
  5. vdd_mpu, vdd_gpu, vdd_dsp, vdd_iva can be ramped at the same time or can be staggered.
  6. vdd must ramp after or at the same time as vdd_mpu, vdd_gpu, vdd_dsp and vdd_iva.
  7. If any of the vddshv[1-7,9-11] rails (not including vddshv8) are used as 1.8V only, then these rails can be combined with vdds18v. vddshv[1-7,9-11] is allowed to ramp down at either of the two points shown in the timing diagram in either 1.8V mode or in 3.3V mode. If vddshv[1-7,9-11] ramps down at the later time in the diagram then the board design must guarantee that the vddshv[1-7,9-11] rail is never higher than 2.0 V above the vdds18v rail.
  8. vddshv8 is separated out to show support for dual voltage. If a dedicated LDO/supply source is used for vddshv8, then vddshv8 ramp down should occur at one of the two earliest points in the timing diagram. If vddshv8 is powered by the same supply source as the other vddshvn rails, then it is allowed to ramp down at either of the last two points in the timing diagram.

Figure 5-4 describes the RTC-mode Power Sequencing.

TDA2E SPRS906_ELCH_03.gifFigure 5-4 RTC Mode Sequencing
  1. Grey shaded areas are windows where it is valid to ramp the voltage rail.
  2. Blue dashed lines are not valid windows but show alternate ramp possibilities based on the associated note.
  3. vdd must ramp down after or at the same time as vdd_mpu, vdd_gpu, vdd_dsp and vdd_iva.
  4. vdd_mpu, vdd_gpu, vdd_dsp, vdd_iva can be ramped at the same time or can be staggered.
  5. vdd must ramp up before or at the same time as vdd_mpu, vdd_gpu, vdd_dsp and vdd_iva.
  6. If any of the vddshv[1-7,9-11] rails (not including vddshv8) are used as 1.8V only, then these rails can be combined with vdds18v.
  7. vddshv8 is separated out to show support for dual voltage. If single voltage is used then vddshv8 can be combined with other vddshvn rails but vddshv8 must ramp down before vdd and must ramp up after vdd.
  8. If any of the vddshv[1-7,9-11] rails (not including vddshv8) are used as 1.8V only, then these rails can be combined with vdds18v. vddshv[1-7,9-11] is allowed to ramp down at either of the two points shown in the timing diagram in either 1.8V mode or in 3.3V mode. If vddshv[1-7,9-11] ramps down at the later time in the diagram then the board design must guarantee that the vddshvn rail is never higher than 2.0 V above the vdds18v rail.
  9. vddshv8 is separated out to show support for dual voltage. If a dedicated LDO/supply source is used for vddshv8, then vddshv8 ramp down should occur at one of the two earliest points in the timing diagram. If vddshv8 is powered by the same supply source as the other vddshvn rails, then it is allowed to ramp down at either of the last two points in the timing diagram.

Figure 5-5 and Figure 5-6 describe the device Power Sequencing when RTC-mode is NOT used.

TDA2E SPRS906_ELCH_04.gifFigure 5-5 Power-Up Sequencing
  1. Grey shaded areas are windows where it is valid to ramp the voltage rail.
  2. Blue dashed lines are not valid windows but show alternate ramp possibilities based on the associated note.
  3. If RTC-mode is not supported then the following combinations are approved:
    - vdda_rtc can be combined with vdds18v
    - vdd_rtc can be combined with vdd
    - vddshv5 can be combined with other 1.8V or 3.3V vddshvn rails.
    If combinations listed above are not followed then sequencing for these 3 voltage rails should follow the RTC mode timing requirements.
  4. vdd must ramp before or at the same time as vdd_mpu, vdd_gpu, vdd_dsp and vdd_iva.
  5. vdd_mpu, vdd_gpu, vdd_dsp, vdd_iva can be ramped at the same time or can be staggered.
  6. If any of the vddshv[1-7,9-11] rails (not including vddshv8) are used as 1.8V only, then these rails can be combined with vdds18v.
  7. vddshv8 is separated out to show support for dual voltage. If single voltage is used then vddshv8 can be combined with other vddshvn rails but vddshv8 must ramp after vdd.
  8. vdds and vdda rails must not be combined together, with the one exception of vdda_rtc when RTC-mode is not supported.
  9. Pulse duration: rtc_porz must remain low 1ms after vdda_rtc, vddshv5, and vdd_rtc are ramped and stable.
  10. The SYS_32K source must be stable and at a valid frequency 1ms prior to de-asserting rtc_porz high.
  11. Pulse duration: porz must remain low a minimum of 12P(15) after xi_osc0 is stable and at a valid frequency. porz must also remain low until all supply rails are valid and stable. resetn must be high prior to, or simultaneous with, porz rising. During initial power-up, resetn can rise any time after, or concurrently with, its supply voltage, vddshv3 rising.
  12. Setup time: sysboot[15:0] pins must be valid 2P(15) before porz is de-asserted high.
  13. Hold time: sysboot[15:0] pins must be valid 15P(15) after porz is de-asserted high.
  14. porz to rstoutn delay is 2ms.
  15. P = 1/(SYS_CLK1/610) frequency in ns.
TDA2E SPRS906_ELCH_05.gifFigure 5-6 Power-Down Sequencing
  1. Grey shaded areas are windows where it is valid to ramp the voltage rail.
  2. Blue dashed lines are not valid windows but show alternate ramp possibilities based on the associated note.
  3. xi_osc0 can be turned off anytime after porz assertion and must be turned off before vdda_osc voltage rail is shutdown.
  4. If RTC-mode is not used then the following combinations are approved:
    - vdda_rtc can be combined with vdds18v
    - vdd_rtc can be combined with vdd
    - vddshv5 can be combined with other 1.8V or 3.3V vddshvn rails
    If combinations listed above are not followed then sequencing for these 3 voltage rails should follow the RTC mode timing requirements.
  5. vdd_mpu, vdd_gpu, vdd_dsp, vdd_iva can be ramped at the same time or can be staggered.
  6. vdd must ramp after or at the same time as vdd_mpu, vdd_gpu, vdd_dsp and vdd_iva.
  7. If any of the vddshv[1-7,9-11] rails (not including vddshv8) are used as 1.8V only, then these rails can be combined with vdds18v. vddshv[1-7,9-11] is allowed to ramp down at either of the two points shown in the timing diagram in either 1.8V mode or in 3.3V mode. If vddshv[1-7,9-11] ramps down at the later time in the diagram then the board design must guarantee that the vddshv[1-7,9-11] rail is never higher than 2.0 V above the vdds18v rail.
  8. vddshv8 is separated out to show support for dual voltage. If a dedicated LDO/supply source is used for vddshv8, then vddshv8 ramp down should occur at one of the two earliest points in the timing diagram. If vddshv8 is powered by the same supply source as the other vddshvn rails, then it is allowed to ramp down at either of the last two points in the timing diagram.

Figure 5-7 describes vddshv[1-7,9-11] Supplies Falling Before vdds18v Supplies Delta.

TDA2E SPRS906_ELCH_06.gifFigure 5-7 vddshv* Supplies Falling After vdds18v Supplies Delta
  1. Vdelta MAX = 2V
  2. If vddshv8 is powered by the same supply source as the other vddshv[1-7,9-11] rails.