ZHCSJC6F March 2016 – June 2018 TDA2E
PRODUCTION DATA.
For reliability and operability concerns, the maximum junction temperature of the Device has to be at or below the TJ value identified in Table 5-4, Recommended Operating Conditions.
A BCI compact thermal model for this Device is available and recommended for use when modeling thermal performance in a system.
Therefore, it is recommended to perform thermal simulations at the system level with the worst case device power consumption.