ZHCSJC6F
March 2016 – June 2018
TDA2E
PRODUCTION DATA.
1
器件概述
1.1
特性
1.2
应用
1.3
说明
1.4
功能方框图
2
修订历史记录
3
Device Comparison
3.1
Device Comparison Table
4
Terminal Configuration and Functions
4.1
Terminal Assignment
4.1.1
Unused Balls Connection Requirements
4.2
Ball Characteristics
4.3
Multiplexing Characteristics
4.4
Signal Descriptions
4.4.1
Video Input Ports (VIP)
4.4.2
Display Subsystem – Video Output Ports
4.4.3
Display Subsystem – High-Definition Multimedia Interface (HDMI)
4.4.4
Camera Serial Interface 2 CAL bridge (CSI2)
4.4.5
External Memory Interface (EMIF SDRAM)
4.4.6
General-Purpose Memory Controller (GPMC)
4.4.7
Timers
4.4.8
Inter-Integrated Circuit Interface (I2C)
4.4.9
Universal Asynchronous Receiver Transmitter (UART)
4.4.10
Multichannel Serial Peripheral Interface (McSPI)
4.4.11
Quad Serial Peripheral Interface (QSPI)
4.4.12
Multichannel Audio Serial Port (McASP)
4.4.13
Universal Serial Bus (USB)
4.4.14
SATA
4.4.15
Peripheral Component Interconnect Express (PCIe)
4.4.16
Controller Area Network Interface (DCAN)
4.4.17
Ethernet Interface (GMAC_SW)
4.4.18
eMMC/SD/SDIO
4.4.19
General-Purpose Interface (GPIO)
4.4.20
Pulse Width Modulation (PWM) Interface
4.4.21
Test Interfaces
4.4.22
System and Miscellaneous
4.4.22.1
Sysboot
4.4.22.2
Power, Reset, and Clock Management (PRCM)
4.4.22.3
Real-Time Clock (RTC) Interface
4.4.22.4
System Direct Memory Access (SDMA)
4.4.22.5
Interrupt Controllers (INTC)
4.4.22.6
Observability
4.4.23
Power Supplies
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Power on Hour (POH) Limits
5.4
Recommended Operating Conditions
5.5
Operating Performance Points
5.5.1
AVS and ABB Requirements
5.5.2
Voltage And Core Clock Specifications
5.5.3
Maximum Supported Frequency
5.6
Power Consumption Summary
5.7
Electrical Characteristics
5.7.1
LVCMOS DDR DC Electrical Characteristics
5.7.2
HDMIPHY DC Electrical Characteristics
5.7.3
Dual Voltage LVCMOS I2C DC Electrical Characteristics
5.7.4
IQ1833 Buffers DC Electrical Characteristics
5.7.5
IHHV1833 Buffers DC Electrical Characteristics
5.7.6
LVCMOS CSI2 DC Electrical Characteristics
5.7.7
BC1833IHHV Buffers DC Electrical Characteristics
5.7.8
USBPHY DC Electrical Characteristics
5.7.9
Dual Voltage SDIO1833 DC Electrical Characteristics
5.7.10
Dual Voltage LVCMOS DC Electrical Characteristics
5.7.11
SATAPHY DC Electrical Characteristics
5.7.12
PCIEPHY DC Electrical Characteristics
5.8
Thermal Characteristics
5.8.1
Package Thermal Characteristics
5.9
Power Supply Sequences
6
Clock Specifications
6.1
Input Clock Specifications
6.1.1
Input Clock Requirements
6.1.2
System Oscillator OSC0 Input Clock
6.1.2.1
OSC0 External Crystal
6.1.2.2
OSC0 Input Clock
6.1.3
Auxiliary Oscillator OSC1 Input Clock
6.1.3.1
OSC1 External Crystal
6.1.3.2
OSC1 Input Clock
6.1.4
RTC Oscillator Input Clock
6.1.4.1
RTC Oscillator External Crystal
6.1.4.2
RTC Oscillator Input Clock
6.1.4.3
RC On-die Oscillator Clock
6.2
DPLLs, DLLs Specifications
6.2.1
DPLL Characteristics
6.2.2
DLL Characteristics
6.2.3
DPLL and DLL Noise Isolation
7
Timing Requirements and Switching Characteristics
7.1
Timing Test Conditions
7.2
Interface Clock Specifications
7.2.1
Interface Clock Terminology
7.2.2
Interface Clock Frequency
7.3
Timing Parameters and Information
7.3.1
Parameter Information
7.3.1.1
1.8V and 3.3V Signal Transition Levels
7.3.1.2
1.8V and 3.3V Signal Transition Rates
7.3.1.3
Timing Parameters and Board Routing Analysis
7.4
Recommended Clock and Control Signal Transition Behavior
7.5
Virtual and Manual I/O Timing Modes
7.6
Video Input Ports (VIP)
7.7
Display Subsystem - Video Output Ports
7.8
Display Subsystem - High-Definition Multimedia Interface (HDMI)
7.9
Camera Serial Interface 2 CAL bridge (CSI2)
7.9.1
CSI-2 MIPI D-PHY
7.10
External Memory Interface (EMIF)
7.11
General-Purpose Memory Controller (GPMC)
7.11.1
GPMC/NOR Flash Interface Synchronous Timing
7.11.2
GPMC/NOR Flash Interface Asynchronous Timing
7.11.3
GPMC/NAND Flash Interface Asynchronous Timing
7.12
Timers
7.13
Inter-Integrated Circuit Interface (I2C)
Table 7-33
Timing Requirements for I2C Input Timings
Table 7-34
Timing Requirements for I2C HS-Mode (I2C3/4/5/6 Only)
Table 7-35
Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
7.14
Universal Asynchronous Receiver Transmitter (UART)
Table 7-36
Timing Requirements for UART
Table 7-37
Switching Characteristics Over Recommended Operating Conditions for UART
7.15
Multichannel Serial Peripheral Interface (McSPI)
7.16
Quad Serial Peripheral Interface (QSPI)
7.17
Multichannel Audio Serial Port (McASP)
Table 7-44
Timing Requirements for McASP1
Table 7-45
Timing Requirements for McASP2
Table 7-46
Timing Requirements for McASP3/4/5/6/7/8
7.18
Universal Serial Bus (USB)
7.18.1
USB1 DRD PHY
7.18.2
USB2 PHY
7.18.3
USB3 DRD ULPI-SDR-Slave Mode-12-pin Mode
7.19
Serial Advanced Technology Attachment (SATA)
7.20
Peripheral Component Interconnect Express (PCIe)
7.21
Controller Area Network Interface (DCAN)
Table 7-64
Timing Requirements for DCANx Receive
Table 7-65
Switching Characteristics Over Recommended Operating Conditions for DCANx Transmit
7.22
Ethernet Interface (GMAC_SW)
7.22.1
GMAC MII Timings
Table 7-66
Timing Requirements for miin_rxclk - MII Operation
Table 7-67
Timing Requirements for miin_txclk - MII Operation
Table 7-68
Timing Requirements for GMAC MIIn Receive 10/100 Mbit/s
Table 7-69
Switching Characteristics Over Recommended Operating Conditions for GMAC MIIn Transmit 10/100 Mbits/s
7.22.2
GMAC MDIO Interface Timings
7.22.3
GMAC RMII Timings
Table 7-74
Timing Requirements for GMAC REF_CLK - RMII Operation
Table 7-75
Timing Requirements for GMAC RMIIn Receive
Table 7-76
Switching Characteristics Over Recommended Operating Conditions for GMAC REF_CLK - RMII Operation
Table 7-77
Switching Characteristics Over Recommended Operating Conditions for GMAC RMIIn Transmit 10/100 Mbits/s
7.22.4
GMAC RGMII Timings
Table 7-81
Timing Requirements for rgmiin_rxc - RGMIIn Operation
Table 7-82
Timing Requirements for GMAC RGMIIn Input Receive for 10/100/1000 Mbps
Table 7-83
Switching Characteristics Over Recommended Operating Conditions for rgmiin_txctl - RGMIIn Operation for 10/100/1000 Mbit/s
Table 7-84
Switching Characteristics for GMAC RGMIIn Output Transmit for 10/100/1000 Mbps
7.23
eMMC/SD/SDIO
7.23.1
MMC1-SD Card Interface
7.23.1.1
Default speed, 4-bit data, SDR, half-cycle
7.23.1.2
High speed, 4-bit data, SDR, half-cycle
7.23.1.3
SDR12, 4-bit data, half-cycle
7.23.1.4
SDR25, 4-bit data, half-cycle
7.23.1.5
UHS-I SDR50, 4-bit data, half-cycle
7.23.1.6
UHS-I SDR104, 4-bit data, half-cycle
7.23.1.7
UHS-I DDR50, 4-bit data
7.23.2
MMC2 - eMMC
7.23.2.1
Standard JC64 SDR, 8-bit data, half cycle
7.23.2.2
High-speed JC64 SDR, 8-bit data, half cycle
7.23.2.3
High-speed HS200 JEDS84, 8-bit data, half cycle
7.23.2.4
High-speed JC64 DDR, 8-bit data
Table 7-109
Switching Characteristics for MMC2 - JC64 High Speed DDR Mode
7.23.3
MMC3 and MMC4-SDIO/SD
7.23.3.1
MMC3 and MMC4, SD Default Speed
7.23.3.2
MMC3 and MMC4, SD High Speed
7.23.3.3
MMC3 and MMC4, SD and SDIO SDR12 Mode
7.23.3.4
MMC3 and MMC4, SD SDR25 Mode
7.23.3.5
MMC3 SDIO High-Speed UHS-I SDR50 Mode, Half Cycle
7.24
General-Purpose Interface (GPIO)
7.25
System and Miscellaneous interfaces
7.26
Test Interfaces
7.26.1
IEEE 1149.1 Standard-Test-Access Port (JTAG)
7.26.1.1
JTAG Electrical Data/Timing
Table 7-131
Timing Requirements for IEEE 1149.1 JTAG
Table 7-132
Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
Table 7-133
Timing Requirements for IEEE 1149.1 JTAG With RTCK
Table 7-134
Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG With RTCK
7.26.2
Trace Port Interface Unit (TPIU)
7.26.2.1
TPIU PLL DDR Mode
8
Applications, Implementation, and Layout
8.1
Introduction
8.1.1
Initial Requirements and Guidelines
8.2
Power Optimizations
8.2.1
Step 1: PCB Stack-up
8.2.2
Step 2: Physical Placement
8.2.3
Step 3: Static Analysis
8.2.3.1
PDN Resistance and IR Drop
8.2.4
Step 4: Frequency Analysis
8.2.5
System ESD Generic Guidelines
8.2.5.1
System ESD Generic PCB Guideline
8.2.5.2
Miscellaneous EMC Guidelines to Mitigate ESD Immunity
8.2.5.3
ESD Protection System Design Consideration
8.2.6
EMI / EMC Issues Prevention
8.2.6.1
Signal Bandwidth
8.2.6.2
Signal Routing
8.2.6.2.1
Signal Routing—Sensitive Signals and Shielding
8.2.6.2.2
Signal Routing—Outer Layer Routing
8.2.6.3
Ground Guidelines
8.2.6.3.1
PCB Outer Layers
8.2.6.3.2
Metallic Frames
8.2.6.3.3
Connectors
8.2.6.3.4
Guard Ring on PCB Edges
8.2.6.3.5
Analog and Digital Ground
8.3
Core Power Domains
8.3.1
General Constraints and Theory
8.3.2
Voltage Decoupling
8.3.3
Static PDN Analysis
8.3.4
Dynamic PDN Analysis
8.3.5
Power Supply Mapping
8.3.6
DPLL Voltage Requirement
8.3.7
Example PCB Design
8.3.7.1
Example Stack-up
8.3.7.2
vdd Example Analysis
8.4
Single-Ended Interfaces
8.4.1
General Routing Guidelines
8.4.2
QSPI Board Design and Layout Guidelines
8.5
Differential Interfaces
8.5.1
General Routing Guidelines
8.5.2
USB 2.0 Board Design and Layout Guidelines
8.5.2.1
Background
8.5.2.2
USB PHY Layout Guide
8.5.2.2.1
General Routing and Placement
8.5.2.2.2
Specific Guidelines for USB PHY Layout
8.5.2.2.2.1
Analog, PLL, and Digital Power Supply Filtering
8.5.2.2.2.2
Analog, Digital, and PLL Partitioning
8.5.2.2.2.3
Board Stackup
8.5.2.2.2.4
Cable Connector Socket
8.5.2.2.2.5
Clock Routings
8.5.2.2.2.6
Crystals/Oscillator
8.5.2.2.2.7
DP/DM Trace
8.5.2.2.2.8
DP/DM Vias
8.5.2.2.2.9
Image Planes
8.5.2.2.2.10
Power Regulators
8.5.2.3
References
8.5.3
USB 3.0 Board Design and Layout Guidelines
8.5.3.1
USB 3.0 interface introduction
8.5.3.2
USB 3.0 General routing rules
8.5.4
HDMI Board Design and Layout Guidelines
8.5.4.1
HDMI Interface Schematic
8.5.4.2
TMDS General Routing Guidelines
8.5.4.3
TPD5S115
8.5.4.4
HDMI ESD Protection Device (Required)
8.5.4.5
PCB Stackup Specifications
8.5.4.6
Grounding
8.5.5
PCIe Board Design and Layout Guidelines
8.5.5.1
PCIe Connections and Interface Compliance
8.5.5.1.1
Coupling Capacitors
8.5.5.1.2
Polarity Inversion
8.5.5.2
Non-standard PCIe connections
8.5.5.2.1
PCB Stackup Specifications
8.5.5.2.2
Routing Specifications
8.5.5.2.2.1
Impedance
8.5.5.2.2.2
Differential Coupling
8.5.5.2.2.3
Pair Length Matching
8.5.5.3
LJCB_REFN/P Connections
8.5.6
CSI2 Board Design and Routing Guidelines
8.5.6.1
CSI2_0 and CSI2_1 MIPI CSI-2 (1.5 Gbps)
8.5.6.1.1
General Guidelines
8.5.6.1.2
Length Mismatch Guidelines
8.5.6.1.2.1
CSI2_0 and CSI2_1 MIPI CSI-2 (1.5 Gbps)
8.5.6.1.3
Frequency-domain Specification Guidelines
8.6
DDR3 Board Design and Layout Guidelines
8.6.1
DDR3 General Board Layout Guidelines
8.6.2
DDR3 Board Design and Layout Guidelines
8.6.2.1
Board Designs
8.6.2.2
DDR3 EMIF
8.6.2.3
DDR3 Device Combinations
8.6.2.4
DDR3 Interface Schematic
8.6.2.4.1
32-Bit DDR3 Interface
8.6.2.4.2
16-Bit DDR3 Interface
8.6.2.5
Compatible JEDEC DDR3 Devices
8.6.2.6
PCB Stackup
8.6.2.7
Placement
8.6.2.8
DDR3 Keepout Region
8.6.2.9
Bulk Bypass Capacitors
8.6.2.10
High-Speed Bypass Capacitors
8.6.2.10.1
Return Current Bypass Capacitors
8.6.2.11
Net Classes
8.6.2.12
DDR3 Signal Termination
8.6.2.13
VREF_DDR Routing
8.6.2.14
VTT
8.6.2.15
CK and ADDR_CTRL Topologies and Routing Definition
8.6.2.15.1
Four DDR3 Devices
8.6.2.15.1.1
CK and ADDR_CTRL Topologies, Four DDR3 Devices
8.6.2.15.1.2
CK and ADDR_CTRL Routing, Four DDR3 Devices
8.6.2.15.2
Two DDR3 Devices
8.6.2.15.2.1
CK and ADDR_CTRL Topologies, Two DDR3 Devices
8.6.2.15.2.2
CK and ADDR_CTRL Routing, Two DDR3 Devices
8.6.2.15.3
One DDR3 Device
8.6.2.15.3.1
CK and ADDR_CTRL Topologies, One DDR3 Device
8.6.2.15.3.2
CK and ADDR/CTRL Routing, One DDR3 Device
8.6.2.16
Data Topologies and Routing Definition
8.6.2.16.1
DQS and DQ/DM Topologies, Any Number of Allowed DDR3 Devices
8.6.2.16.2
DQS and DQ/DM Routing, Any Number of Allowed DDR3 Devices
8.6.2.17
Routing Specification
8.6.2.17.1
CK and ADDR_CTRL Routing Specification
8.6.2.17.2
DQS and DQ Routing Specification
9
Device and Documentation Support
9.1
Device Nomenclature and Orderable Information
9.1.1
Standard Package Symbolization
9.1.2
Device Naming Convention
9.2
Tools and Software
9.3
Documentation Support
9.4
Receiving Notification of Documentation Updates
9.5
Community Resources
9.6
商标
9.7
静电放电警告
9.8
出口管制提示
9.9
术语表
10
Mechanical Packaging Information
10.1
Mechanical Data
封装选项
机械数据 (封装 | 引脚)
ABC|760
MPBGAI0B
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsjc6f_oa
1.1
特性
专为 ADAS 应用设计的 架构
支持视频、图像和图形处理
全高清视频(1920 x 1080p,60fps)
多个视频输入和视频输出
Arm® Cortex®-A15 微处理器子系统
C66x 浮点超长指令字 (VLIW) 数字信号处理器 (DSP)
目标代码与 C67x 和 C64x+ 完全兼容
每周期最多 32 次 16 x 16 位定点乘法
高达 512KB 的片上 L3 RAM
3 级 (L3) 和 4 级 (L4) 互连
DDR3/DDR3L 存储器接口 (EMIF) 模块
最高支持 DDR3-1333 (667MHz)
高达 2GB 的单芯片选择
双核 Arm®Cortex®-M4 图像处理单元 (IPU)
IVA-HD 子系统
显示子系统
具有 DMA 引擎和多达 3 条管线的显示控制器
HDMI™编码器:兼容 HDMI 1.4a 和 DVI 1.0
单核 PowerVR®SGX544 3D GPU
2D 图形加速器 (BB2D) 子系统
Vivante®GC320 内核
视频处理引擎 (VPE)
一个视频输入端口 (VIP) 模块
支持多达 4 个复用输入端口
通用存储器控制器 (GPMC)
增强型直接存储器存取 (EDMA) 控制器
2 端口千兆以太网 (GMAC)
最多 2 个外部端口,1 个内部端口
16 个 32 位通用计时器
32 位 MPU 看门狗计时器
六个高速集成电路间 (I
2
C) 端口
10 个可配置 UART/IrDA/CIR 模块
4 个多通道串行外设接口 (McSPI)
四路 SPI 接口 (QSPI)
SATA 接口
8 个多通道音频串行端口 (McASP) 模块
超高速 USB 3.0 双角色设备
高速 USB 2.0 双角色设备
高速 USB 2.0 On-The-Go
四个多媒体卡/安全数字/安全数字输入输出接口 (MMC™/SD®/SDIO)
带有两个 5Gbps 通道的 PCI Express®具有集成型 PHY 的 3.0 端口
1 个与第 2 代兼容的双通道端口
或 2 个与第 2 代兼容的单通道端口
双控制器局域网 (DCAN) 模块
CAN 2.0B 协议
MIPI®CSI-2 摄像头串行接口
多达 215 个通用 I/O (GPIO) 引脚
实时时钟子系统 (RTCSS)
器件安全 特性
硬件加密加速器和 DMA
防火墙
JTAG 锁定
安全密钥
安全 ROM 和引导
电源、复位和时钟管理
片上调试,采用 CTool 技术
28nm CMOS 技术
23mm × 23mm、0.8mm 间距、760 引脚 BGA (ABC)