| MIN(1) | MAX | UNIT |
|---|
| VIN to GND | –0.3 | 105 | V |
| HS to GND(2) | –5 | 105 | V |
| BST1/BST2 to GND | –0.3 | 116 | V |
| BST1/BST2 to HS1/HS2 | –0.3 | 16 | V |
| HO1/HO2 to HS1/HS2(3) | –0.3 | BST1/BST2 + 0.3 | V |
| LO1/LO2/SR1/SR2(3) | –0.3 | VCC + 0.3 | V |
| VCC to GND | –0.3 | 16 | V |
| REF,SSOFF,RT,OVP,UVLO to GND | –0.3 | 7 | V |
| RAMP | –0.3 | 7 | V |
| COMP | | –0.3 | V |
| COMP Input Current | | 10 | mA |
| All other inputs to GND(3) | –0.3 | REF + 0.3 | V |
| Junction Temperature | | 150 | °C |
| Storage temperature, Tstg | –55 | 150 | °C |
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For ensured specifications and test conditions, see the
Section 5.5.
(2) The negative HS voltage must never be more negative than VCC–16
V. For example, if VCC = 12 V, the negative transients at HS must not exceed –4
V.
(3) These pins are output pins and as such should not be connected
to an external voltage source. The voltage range listed is the limits the
internal circuitry is designed to reliably tolerate in the application
circuit.