ZHCSRK4 数据表 | 德州仪器 TI.com.cn

ZHCSRK4A April 2020 – September 2020 CC2640R2L

PRODUCTION DATA

8.26 Typical Characteristics

Figure 8-4 BLE Sensitivity vs Temperature

Figure 8-6 BLE Sensitivity vs Channel Frequency

Figure 8-8 TX Output Power vs Supply Voltage (VDDS)

Figure 8-10 TX Current Consumption vs Supply Voltage (VDDS)

Figure 8-12 RX Mode Current Consumption vs Temperature

Figure 8-14 Active Mode (MCU Running, No Peripherals) Current Consumption vs Temperature

Figure 8-16 SoC ADC Effective Number of Bits vs Input Frequency (Internal Reference, Scaling Enabled)

Figure 8-18 SoC ADC Output vs Temperature (Fixed Input, Internal Reference)

Figure 8-20 Standby Mode Supply Current vs Temperature

Figure 8-5 BLE Sensitivity vs Supply Voltage (VDDS)

Figure 8-7 TX Output Power vs Temperature

Figure 8-9 TX Output Power vs Channel Frequency

Figure 8-11 RX Mode Current vs Supply Voltage (VDDS)

Figure 8-13 TX Mode Current Consumption vs Temperature

Figure 8-15 Active Mode (MCU Running, No Peripherals) Current Consumption vs Supply Voltage (VDDS)

Figure 8-17 SoC ADC Output vs Supply Voltage (Fixed Input, Internal Reference)

Figure 8-19 SoC ADC ENOB vs Sampling Frequency (Scaling Enabled, Input Frequency = FS / 10)

Figure 8-21 SoC ADC DNL vs ADC Code (Internal Reference)

Figure 8-22 SoC ADC INL vs ADC Code (Internal Reference)