ZHCSRK4A April   2020  – September 2020 CC2640R2L

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RHB Package
    4. 7.4 Signal Descriptions – RHB Package
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Consumption Summary
    5. 8.5  General Characteristics
    6. 8.6  125-kbps Coded (Bluetooth 5) – RX
    7. 8.7  125-kbps Coded (Bluetooth 5) – TX
    8. 8.8  500-kbps Coded (Bluetooth 5) – RX
    9. 8.9  500-kbps Coded (Bluetooth 5) – TX
    10. 8.10 1-Mbps GFSK (Bluetooth low energy) – RX
    11. 8.11 1-Mbps GFSK (Bluetooth low energy) – TX
    12. 8.12 2-Mbps GFSK (Bluetooth 5) – RX
    13. 8.13 2-Mbps GFSK (Bluetooth 5) – TX
    14. 8.14 24-MHz Crystal Oscillator (XOSC_HF)
    15. 8.15 32.768-kHz Crystal Oscillator (XOSC_LF)
    16. 8.16 48-MHz RC Oscillator (RCOSC_HF)
    17. 8.17 32-kHz RC Oscillator (RCOSC_LF)
    18. 8.18 ADC Characteristics
    19. 8.19 Temperature Sensor
    20. 8.20 Battery Monitor
    21. 8.21 Synchronous Serial Interface (SSI)
    22. 8.22 DC Characteristics
    23. 8.23 Thermal Resistance Characteristics
    24. 8.24 Timing Requirements
    25. 8.25 Switching Characteristics
    26. 8.26 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Functional Block Diagram
    3. 9.3  Main CPU
    4. 9.4  RF Core
    5. 9.5  Memory
    6. 9.6  Debug
    7. 9.7  Power Management
    8. 9.8  Clock Systems
    9. 9.9  General Peripherals and Modules
    10. 9.10 Voltage Supply Domains
    11. 9.11 System Architecture
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 5 × 5 External Differential (5XD) Application Circuit
      1. 10.2.1 Layout
  11. 11Device and Documentation Support
    1. 11.1  Device Nomenclature
    2. 11.2  Tools and Software
    3. 11.3  Documentation Support
    4. 11.4  支持资源
    5. 11.5  Texas Instruments Low-Power RF Website
    6. 11.6  Low-Power RF eNewsletter
    7. 11.7  Trademarks
    8. 11.8  静电放电警告
    9. 11.9  Export Control Notice
    10. 11.10 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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8.21 Synchronous Serial Interface (SSI)

Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
S1#SWRS1584470 tclk_per (SSIClk period) Device operating as slave 12 65024 system clocks
S2#SWRS1584470 tclk_high (SSIClk high time) Device operating as slave 0.5 tclk_per
S3#SWRS1584470 tclk_low (SSIClk low time) Device operating as slave 0.5 tclk_per
S1 (TX only)#SWRS1584470 tclk_per (SSIClk period) One-way communication to slave, device operating as master 4 65024 system clocks
S1 (TX and RX)#SWRS1584470 tclk_per (SSIClk period) Normal duplex operation, device operating as master 8 65024 system clocks
S2#SWRS1584470 tclk_high (SSIClk high time) Device operating as master 0.5 tclk_per
S3#SWRS1584470 tclk_low (SSIClk low time) Device operating as master 0.5 tclk_per
(1) Refer to SSI timing diagrams #SWRS1581665, #SWRS1586180, and #SWRS1585871.

 

GUID-663226DF-7776-4C16-A4FE-4CE53EB0D2F4-low.gif Figure 8-1 SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement

 

GUID-3365B7D4-E38F-4CDE-9CCB-6E715D0656EE-low.gif Figure 8-2 SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer
GUID-EA6998AB-CE3B-4639-83CE-7DC4381E1B6A-low.gif Figure 8-3 SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1