ZHCSRK4A April   2020  – September 2020 CC2640R2L

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RHB Package
    4. 7.4 Signal Descriptions – RHB Package
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Consumption Summary
    5. 8.5  General Characteristics
    6. 8.6  125-kbps Coded (Bluetooth 5) – RX
    7. 8.7  125-kbps Coded (Bluetooth 5) – TX
    8. 8.8  500-kbps Coded (Bluetooth 5) – RX
    9. 8.9  500-kbps Coded (Bluetooth 5) – TX
    10. 8.10 1-Mbps GFSK (Bluetooth low energy) – RX
    11. 8.11 1-Mbps GFSK (Bluetooth low energy) – TX
    12. 8.12 2-Mbps GFSK (Bluetooth 5) – RX
    13. 8.13 2-Mbps GFSK (Bluetooth 5) – TX
    14. 8.14 24-MHz Crystal Oscillator (XOSC_HF)
    15. 8.15 32.768-kHz Crystal Oscillator (XOSC_LF)
    16. 8.16 48-MHz RC Oscillator (RCOSC_HF)
    17. 8.17 32-kHz RC Oscillator (RCOSC_LF)
    18. 8.18 ADC Characteristics
    19. 8.19 Temperature Sensor
    20. 8.20 Battery Monitor
    21. 8.21 Synchronous Serial Interface (SSI)
    22. 8.22 DC Characteristics
    23. 8.23 Thermal Resistance Characteristics
    24. 8.24 Timing Requirements
    25. 8.25 Switching Characteristics
    26. 8.26 Typical Characteristics
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  Functional Block Diagram
    3. 9.3  Main CPU
    4. 9.4  RF Core
    5. 9.5  Memory
    6. 9.6  Debug
    7. 9.7  Power Management
    8. 9.8  Clock Systems
    9. 9.9  General Peripherals and Modules
    10. 9.10 Voltage Supply Domains
    11. 9.11 System Architecture
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 5 × 5 External Differential (5XD) Application Circuit
      1. 10.2.1 Layout
  11. 11Device and Documentation Support
    1. 11.1  Device Nomenclature
    2. 11.2  Tools and Software
    3. 11.3  Documentation Support
    4. 11.4  支持资源
    5. 11.5  Texas Instruments Low-Power RF Website
    6. 11.6  Low-Power RF eNewsletter
    7. 11.7  Trademarks
    8. 11.8  静电放电警告
    9. 11.9  Export Control Notice
    10. 11.10 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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订购信息

Power Management

To minimize power consumption, the CC2640R2L MCU supports a number of power modes and power management features (see #GUID-5C3E51B9-39DF-4E3E-9EA4-19102BDCB7F1/SWRS1587743).

Table 9-1 Power Modes
MODESOFTWARE CONFIGURABLE POWER MODESRESET PIN HELD
ACTIVEIDLESTANDBYSHUTDOWN
CPUActiveOffOffOffOff
FlashOnAvailableOffOffOff
SRAMOnOnOnOffOff
RadioAvailableAvailableOffOffOff
Supply SystemOnOnDuty CycledOffOff
Current1.45 mA + 31 µA/MHz650 µA1.5 µA0.15 µA0.1 µA
Wake-up Time to CPU Active(1)14 µs151 µs1015 µs1015 µs
Register RetentionFullFullPartialNoNo
SRAM RetentionFullFullFullNoNo
High-Speed ClockXOSC_HF or
RCOSC_HF
XOSC_HF or
RCOSC_HF
OffOffOff
Low-Speed ClockXOSC_LF or
RCOSC_LF
XOSC_LF or
RCOSC_LF
XOSC_LF or RCOSC_LFOffOff
PeripheralsAvailableAvailableOffOffOff
Wake up on RTCAvailableAvailableAvailableOffOff
Wake up on Pin EdgeAvailableAvailableAvailableAvailableOff
Wake up on Reset PinAvailableAvailableAvailableAvailableAvailable
Brown Out Detector (BOD)ActiveActiveDuty CycledOffN/A
Power On Reset (POR)ActiveActiveActiveActiveN/A
Not including RTOS overhead

In active mode, the application CM3 CPU is actively executing code. Active mode provides normal operation of the processor and all of the peripherals that are currently enabled. The system clock can be any available clock source (see #GUID-5C3E51B9-39DF-4E3E-9EA4-19102BDCB7F1/SWRS1587743).

In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not clocked and no code is executed. Any interrupt event will bring the processor back into active mode.

In standby mode, only the always-on domain (AON) is active. An external wake-up event or RTC event is required to bring the device back to active mode. MCU peripherals with retention do not need to be reconfigured when waking up again, and the CPU continues execution from where it went into standby mode. All GPIOs are latched in standby mode.

In shutdown mode, the device is turned off entirely, including the AON domain. The I/Os are latched with the value they had before entering shutdown mode. A change of state on any I/O pin defined as a wake-up from Shutdown pin wakes up the device and functions as a reset trigger. The CPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the reset status register. The only state retained in this mode is the latched I/O state and the Flash memory contents.