ZHCSRK4A April   2020  – September 2020 CC2640R2L

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RHB Package
    4. 7.4 Signal Descriptions – RHB Package
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Consumption Summary
    5. 8.5  General Characteristics
    6. 8.6  125-kbps Coded (Bluetooth 5) – RX
    7. 8.7  125-kbps Coded (Bluetooth 5) – TX
    8. 8.8  500-kbps Coded (Bluetooth 5) – RX
    9. 8.9  500-kbps Coded (Bluetooth 5) – TX
    10. 8.10 1-Mbps GFSK (Bluetooth low energy) – RX
    11. 8.11 1-Mbps GFSK (Bluetooth low energy) – TX
    12. 8.12 2-Mbps GFSK (Bluetooth 5) – RX
    13. 8.13 2-Mbps GFSK (Bluetooth 5) – TX
    14. 8.14 24-MHz Crystal Oscillator (XOSC_HF)
    15. 8.15 32.768-kHz Crystal Oscillator (XOSC_LF)
    16. 8.16 48-MHz RC Oscillator (RCOSC_HF)
    17. 8.17 32-kHz RC Oscillator (RCOSC_LF)
    18. 8.18 ADC Characteristics
    19. 8.19 Temperature Sensor
    20. 8.20 Battery Monitor
    21. 8.21 Synchronous Serial Interface (SSI)
    22. 8.22 DC Characteristics
    23. 8.23 Thermal Resistance Characteristics
    24. 8.24 Timing Requirements
    25. 8.25 Switching Characteristics
    26. 8.26 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Functional Block Diagram
    3. 9.3  Main CPU
    4. 9.4  RF Core
    5. 9.5  Memory
    6. 9.6  Debug
    7. 9.7  Power Management
    8. 9.8  Clock Systems
    9. 9.9  General Peripherals and Modules
    10. 9.10 Voltage Supply Domains
    11. 9.11 System Architecture
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 5 × 5 External Differential (5XD) Application Circuit
      1. 10.2.1 Layout
  11. 11Device and Documentation Support
    1. 11.1  Device Nomenclature
    2. 11.2  Tools and Software
    3. 11.3  Documentation Support
    4. 11.4  支持资源
    5. 11.5  Texas Instruments Low-Power RF Website
    6. 11.6  Low-Power RF eNewsletter
    7. 11.7  Trademarks
    8. 11.8  静电放电警告
    9. 11.9  Export Control Notice
    10. 11.10 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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11.8 静电放电警告

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。