ZHCSJY1A June   2019  – January 2021 ADS125H01

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagrams
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Noise Performance
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Voltage Range
      2. 9.3.2 Analog Inputs (AINP, AINN)
        1. 9.3.2.1 ESD Diodes
        2. 9.3.2.2 Input Switch
      3. 9.3.3 Programmable Gain Amplifier (PGA)
        1. 9.3.3.1 PGA Operating Range
        2. 9.3.3.2 PGA Monitors
      4. 9.3.4 Reference Voltage
        1. 9.3.4.1 Reference Monitor
      5. 9.3.5 ADC Modulator
      6. 9.3.6 Digital Filter
        1. 9.3.6.1 Sinc Filter Mode
          1. 9.3.6.1.1 Sinc Filter Frequency Response
        2. 9.3.6.2 FIR Filter
        3. 9.3.6.3 50-Hz and 60-Hz Normal-Mode Rejection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Conversion Control
        1. 9.4.1.1 Continuous-Conversion Mode
        2. 9.4.1.2 Pulse-Conversion Mode
        3. 9.4.1.3 Conversion Latency
        4. 9.4.1.4 Start-Conversion Delay
      2. 9.4.2 Clock Mode
      3. 9.4.3 Reset
        1. 9.4.3.1 Power-On Reset
        2. 9.4.3.2 Reset by RESETPin
        3. 9.4.3.3 Reset by Command
      4. 9.4.4 Calibration
        1. 9.4.4.1 Offset and Full-Scale Calibration
          1. 9.4.4.1.1 Offset Calibration Registers
          2. 9.4.4.1.2 Full-Scale Calibration Registers
        2. 9.4.4.2 Offset Calibration Command (OFSCAL)
        3. 9.4.4.3 Full-Scale Calibration Command (GANCAL)
        4. 9.4.4.4 Calibration Command Procedure
        5. 9.4.4.5 User Calibration Procedure
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Chip-Select Pins (CS1 and CS2)
        2. 9.5.1.2 Serial Clock (SCLK)
        3. 9.5.1.3 Data Input (DIN)
        4. 9.5.1.4 Data Output/Data Ready (DOUT/DRDY)
      2. 9.5.2 Data Ready (DRDY)
        1. 9.5.2.1 DRDY in Continuous-Conversion Mode
        2. 9.5.2.2 DRDY in Pulse-Conversion Mode
        3. 9.5.2.3 Data Ready by Software Polling
      3. 9.5.3 Conversion Data
        1. 9.5.3.1 Status Byte (STATUS0)
        2. 9.5.3.2 Conversion Data Format
      4. 9.5.4 Cyclic Redundancy Check (CRC)
      5. 9.5.5 Commands
        1. 9.5.5.1  General Command Format
        2. 9.5.5.2  NOP Command
        3. 9.5.5.3  RESET Command
        4. 9.5.5.4  START Command
        5. 9.5.5.5  STOP Command
        6. 9.5.5.6  RDATA Command
        7. 9.5.5.7  OFSCAL Command
        8. 9.5.5.8  GANCAL Command
        9. 9.5.5.9  RREG Command
        10. 9.5.5.10 WREG Command
    6. 9.6 Register Map
      1. 9.6.1  Device Identification (ID) Register (address = 00h) [reset = 4xh]
      2. 9.6.2  Main Status (STATUS0) Register (address = 01h) [reset = 01h]
      3. 9.6.3  Mode 0 (MODE0) Register (address = 02h) [reset = 24h]
      4. 9.6.4  Mode 1 (MODE1) Register (address = 03h) [reset = 01h]
      5. 9.6.5  Reserved (RESERVED) Register (address = 04h) [reset = 00h]
      6. 9.6.6  Mode 3 (MODE3) Register (address = 05h) [reset = 00h]
      7. 9.6.7  Reference Configuration (REF) Register (address = 06h) [reset = 05h]
      8. 9.6.8  Offset Calibration (OFCALx) Registers (address = 07h, 08h, 09h) [reset = 00h, 00h, 00h]
      9. 9.6.9  Full-Scale Calibration (FSCALx) Registers (address = 0Ah, 0Bh, 0Ch) [reset = 00h, 00h, 40h]
      10. 9.6.10 Reserved (RESERVED) Register (address = 0Dh) [reset = FFh]
      11. 9.6.11 Reserved (RESERVED) Register (address = 0Eh) [reset = 00h]
      12. 9.6.12 Reserved (RESERVED) Register (address = 0Fh) [reset = 00h]
      13. 9.6.13 MODE4 (MODE4) Register (address = 10h) [reset = 50h]
      14. 9.6.14 PGA Alarm (STATUS1) Register (address = 11h) [reset = xxh]
      15. 9.6.15 Status 2 (STATUS2) Register (address = 12h) [reset = 0xh]
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Example to Determine the PGA Linear Operating Range
      2. 10.1.2 Input Signal Rate of Change (dV/dt)
      3. 10.1.3 Unused Inputs and Outputs
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Decoupling
    2. 11.2 Analog Power-Supply Clamp
    3. 11.3 Power-Supply Sequencing
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 静电放电警告
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

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Layout Guidelines

Good layout practices are crucial to realize the full performance of the ADC. Poor grounding can quickly degrade the ADC noise performance. This section discusses layout recommendations that help provide the best results.

For best performance, dedicate an entire PCB layer to a ground plane and do not route any other signal traces on this layer. However, depending on layout restrictions, a dedicated ground plane may not be practical. If ground plane separation is necessary, make a single, direct connection to the planes at the ADC. Do not connect individual ground planes at multiple locations because this configuration creates ground loops.

Route digital signals away from the CAPP and CAPN pins and away from all analog inputs and associated components to prevent crosstalk.

Because large capacitance on DOUT/DRDY can lead to increased ADC noise levels, minimize the length of the PCB trace. Use a series resistor or a buffer if long traces are used.

Use C0G capacitors for the analog input filter and for the CAPP to CAPN capacitor. Use ceramic capacitors (for example, X7R grade) for the power-supply decoupling capacitors. High-K capacitors (Y5V) are not recommended. Place the required capacitors as close as possible to the device pins using short, direct traces. For optimum performance, use low-impedance connections with multiple vias on the ground-side connections of the bypass capacitors.

When applying an external clock, be sure the clock is free of overshoot and glitches. A source-termination resistor placed at the clock buffer often helps reduce overshoot. Glitches present on the clock input can lead to noisy conversion data.