ZHCSDT4D
June 2015 – September 2020
BQ29209-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Options
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Recommended Cell Balancing Configurations
7.7
Typical Characteristics
8
Detailed Description
8.1
Overview
8.1.1
Voltage Protection
8.1.2
Cell Balancing
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Protection (OUT) Timing
8.3.2
Cell Voltage > VPROTECT
8.3.3
Cell Connection Sequence
8.3.4
Cell Balance Enable Control
8.3.5
Cell Balance Configuration
8.3.6
Cell Imbalance Auto-Detection (Via Cell Voltage)
8.3.7
Customer Test Mode
8.3.8
Test Conditions
8.4
Device Functional Modes
8.4.1
NORMAL Mode
8.4.2
PROTECTION Mode
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Battery Connection
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curve
9.3
System Example
9.3.1
External Cell Balancing
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.2
接收文档更新通知
12.3
支持资源
12.4
Trademarks
12.5
静电放电警告
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
DRB|8
散热焊盘机械数据 (封装 | 引脚)
DRB|8
QFND043N
订购信息
zhcsdt4d_oa
zhcsdt4d_pm
12.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。