ZHCSDT4D June   2015  – September 2020 BQ29209-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Recommended Cell Balancing Configurations
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Voltage Protection
      2. 8.1.2 Cell Balancing
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Protection (OUT) Timing
      2. 8.3.2 Cell Voltage > VPROTECT
      3. 8.3.3 Cell Connection Sequence
      4. 8.3.4 Cell Balance Enable Control
      5. 8.3.5 Cell Balance Configuration
      6. 8.3.6 Cell Imbalance Auto-Detection (Via Cell Voltage)
      7. 8.3.7 Customer Test Mode
      8. 8.3.8 Test Conditions
    4. 8.4 Device Functional Modes
      1. 8.4.1 NORMAL Mode
      2. 8.4.2 PROTECTION Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Battery Connection
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
    3. 9.3 System Example
      1. 9.3.1 External Cell Balancing
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DRB|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (December 2018) to Revision D (September 2020)

  • 添加了“提供功能安全型”信息Go

Changes from Revision B (November 2018) to Revision C (December 2018)

  • Added a clarification regarding operation if GND is not connected first in sequenceGo

Changes from Revision A (March 2016) to Revision B (November 2018)

  • 更改了简化版原理图 中的元件名称 Go
  • Changed a component name in Section 7.3 Go
  • Added the value of internal cell balancing switch resistances to Section 7.5 Go
  • Changed resistor names Go
  • Added Figure 8-2 to clarify the cell balancing description; updated the equations Go
  • Changed values and component names in Figure 9-1 Go
  • Changed component names and values used in the design example Go
  • Changed external cell balancing figure, equations, and descriptionGo

Changes from Revision * (June 2015) to Revision A (March 2016)

  • 更改了电阻器 RVD 位置，在简化版原理图 中添加了 PACK+ 和 PACK–Go
  • Deleted the Lead Temperature (soldering) from the Section 7.1 table Go
  • Changed resistor RVD location in Figure 9-1 Go
  • Added title to Table 9-1 Go
  • Changed resistor RVD location, added PACK+ and PACK– in Figure 9-3 Go