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CC2564C

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符合蓝牙核心 5.1 标准的 Bluetooth® 双模收发器

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CC2564C

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产品详情

CPU Proprietary Type Transceiver Technology 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 Operating system FreeRTOS, Linux Features Advanced audio distribution profile, Classic audio, Hands-free profile Edge AI enabled No Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 85
CPU Proprietary Type Transceiver Technology 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 Operating system FreeRTOS, Linux Features Advanced audio distribution profile, Classic audio, Hands-free profile Edge AI enabled No Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 85
VQFNP-MR (RVM) 76 64 mm² (8 mm × 8 mm)
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 
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技术文档

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 CC2564C Dual-Mode Bluetooth® Controller 数据表 (Rev. B) 2020-12-2
应用手册 QFN 和 SON PCB 连接 (Rev. C) PDF | HTML 英语版 (Rev.C) PDF | HTML 2024-1-5
用户指南 CC256x TI Bluetooth Stack SPPLEDemo 应用 PDF | HTML 英语版 PDF | HTML 2023-8-8
用户指南 CC256x TI 蓝牙协议栈基础 HFGAGDemo 应用 PDF | HTML 英语版 PDF | HTML 2023-8-8
用户指南 CC256x TI 蓝牙协议栈 HIDDemo 应用 PDF | HTML 英语版 PDF | HTML 2023-8-4
应用简报 TI 蓝牙 CC2564C 解决方案 (Rev. B) PDF | HTML 英语版 (Rev.B) PDF | HTML 2023-3-22
选择指南 CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 2022-5-13
选择指南 无线连接技术选择指南 (Rev. B) 英语版 (Rev.B) 2022-3-7
更多文献资料 Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. C) PDF | HTML 2021-12-20
用户指南 CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. B) PDF | HTML 2021-12-20
网络安全公告文章 低功耗蓝牙 - 无效的连接请求 (SweynTooth) (Rev. A) PDF | HTML 英语版 (Rev.A) PDF | HTML 2021-12-17
用户指南 CC2564C TI Dual-mode Bluetooth Stack on STM32F4 MCUs (Rev. B) PDF | HTML 2021-12-2
用户指南 CC2564B to CC2564C Migration Guide (Rev. B) PDF | HTML 2021-12-1
网络安全公告文章 低功耗蓝牙、基本速率/增强型数据速率–方法混淆配对漏洞 英语版 PDF | HTML 2021-7-19
用户指南 Bluetopia Stack Build Guide for Linux PDF | HTML 2021-1-15
用户指南 CC2564x Demo Applications User's Guide PDF | HTML 2020-12-17
网络安全公告文章 Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 2020-5-18
应用手册 Capturing Bluetooth Host Controller Interface (HCI) Logs 2019-1-7
白皮书 Which TI Bluetooth® solution should I choose? 2017-5-5
白皮书 White Paper: Why Classic Bluetooth® (BR/EDR)? 2017-5-4
技术文章 Introducing TI’s dual-mode Bluetooth® 4.2 CC2564C solution PDF | HTML 2016-12-13
应用手册 Application Notes for CC2564C Bluetooth® 4.1 and 4.2 2016-11-1

设计与开发

如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。

评估板

CC256XCQFN-EM — CC2564C 双模 Bluetooth® 控制器评估模块

TI CC256xC Bluetooth® 器件是基本速率 (BR)、增强型数据速率 (EDR) 和 LE 主机控制器接口 (HCI) 解决方案，可降低设计工作量，并加快上市速度。该模块基于 TI 的第七代内核，是一款支持蓝牙 5.1 双模协议且经过产品验证的解决方案。CC256xQFN-EM 板用于评估双模蓝牙 (LE) CC2564C 控制器，该控制器可支持经典蓝牙和低功耗 Bluetooth® 无线技术。

用户指南: PDF | HTML
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评估板

PIDEU-3P-PAN13X6C — Panasonic Industry PAN13x6C 蓝牙射频 (RF) 模块

Panasonic 的 PAN1326C2/PAN1316C 系列是主机控制接口 (HCI) Bluetooth® 射频 (RF) 模块，采用 Texas Instruments™ 第七代蓝牙核心集成电路 CC2564C，实现了易于使用的模块格式。PAN1326C2/PAN1316C 符合 Bluetooth® 5.1 标准并且提供出色的射频性能，并且覆盖范围大约是其他低功耗蓝牙解决方案的两倍。该系列有两个版本：一个版本带有集成芯片天线 (ENW89823A5KF)，可尽可能减少射频设计工作；另一个版本带有射频底部焊盘 (...)

来源：Panasonic Industrial Devices Europe GmbH
支持的产品和硬件
子卡

BDE-3P-BD2564CX — BDE BD2564Cx 无线模块

BDE-3P-BD2564Cx 模块是基于 TI CC2564C 的蓝牙 5.1 基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 双模收发器模块。这些模块具有出色的射频性能、高达 +10dBm 的发射功率以及高达 -93dBm 的接收灵敏度。经过认证并免专利费的双模蓝牙 5.1 协议软件栈和配置文件以及各种示例应用，有助于减少设计工作量并确保产品更快上市。该模块提供两种具有不同天线选项的型号：一种是 ANT 引脚用于外部天线，一种是集成 PCB 迹线天线。

来源：BDE Technology Inc.
支持的产品和硬件
子卡

BDE-3P-BDM209B — BDE BDM209B dual-mode Bluetooth® module

BDE-BDM209B is a Bluetooth 5.1 Basic Rate (BR), Enhanced Data Rate (EDR) and Low Energy (LE) Dual-Mode module.

The module offers Bluetooth Classic and Bluetooth LE radio (CC2564C) from Texas Instruments (TI) and an ultra-low-power Arm® Cortex®-M4 32-bit MCU (STM32L431). It integrates all required (...)

来源：BDE Technology Inc.
支持的产品和硬件
IDE、配置、编译器或调试器

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

支持的产品和硬件
驱动程序或库

CC2564CMSP432BTBLESW — CC2564C 基于 MSP432 MCU 的 TI 双模 Bluetooth® 协议栈

CC2564C 基于 MSP432 MCU 软件的 TI 双模 Bluetooth® 栈适用于蓝牙 + 低功耗蓝牙，支持 MSP432 MCU，并且包含实施蓝牙 5.1 规范的单模和双模产品。该蓝牙栈已完全通过认证（QDID172096 和 QDID172097），提供简易命令行示例应用以加速开发，并按需提供 MFI 功能。

为实现完整的评估解决方案，CC2564C 双模蓝牙栈直接与 TI 硬件开发套件配合使用：MSP-EXP432P401R、BOOST-CCEMADAPTER 和 CC256XCQFN-EM。对于音频和语音应用，CC3200AUDBOOST 可连接至 (...)

支持的产品和硬件
驱动程序或库

CC2564CSTBTBLESW — CC2564C 基于 STM32F4 MCU 的 TI 双模 Bluetooth® 协议栈

CC2564C 基于 STM32F4 MCU 软件的 TI 双模 Bluetooth® 栈适用于蓝牙 + 低功耗蓝牙，支持 STM32 ARM Cortex M4 MCU，并且包含实施蓝牙 5.1 规范的单模和双模产品。该蓝牙栈已完全通过认证（QDID172096 和 QDID172097），提供简易命令行示例应用以加速开发，并按需提供 MFI 功能。

为实现完整的评估解决方案，CC2564C 双模蓝牙栈直接与硬件开发套件配合使用：STM3240G-EVAL。此外，适用于 STM32 MCU 的栈已通过认证且免版税。

该软件通过 CC256XEM-STADAPT 板与 (...)

支持的产品和硬件
驱动程序或库

CC256XC-BT-SP — 适用于 CC256xC 的 Bluetooth® 服务包

CC256xC 蓝牙服务包 (SP) 包含具有平台特定型配置和漏洞修复的强制初始化脚本 (BTS) 文件。

此外，此蓝牙服务包还包含适用于 CC2564C 器件的配套文件，有助于进行测试和调试。该服务包由以下文件组成：

  • 初始化脚本 BTS 文件 (initscripts-TIInit_6.12.26.bts)
  • 初始化脚本附加组件
    • 音频/语音处理附加组件 (initscripts-TIInit_6.12.26_avpr_add-on.bts)
    • BLE 附加组件 (initscripts-TIInit_6.12.26.ble_add-on.bts)
  • ILI 文件 (TIInit_6.12.26.ili)
  • (...)
lock = 需要出口许可（1 分钟）
支持的产品和硬件
驱动程序或库

TI-BT-STACK-LINUX-ADDON — TI 蓝牙 Linux 附加组件，适用于 AM335x EVM、AM437x EVM 和 BeagleBone，支持 WL18xx 和 CC256x

该软件包包含安装包、预编译对象以及 TI 蓝牙栈和 Platform Manager 的源代码，可轻松升级 AM437x EVM、AM335x EVM 或 BeagleBone 上的默认 LINUX EZSDK 二进制文件。该软件通过 Linaro GCC 4.7 构建，可添加到采用其他平台上类似工具链的 Linux SDK 中。

该蓝牙栈已完全通过认证（QDID172096 和 QDID172097），提供简易命令行示例应用以加速开发，并按需提供 MFI 功能。

如需许可信息、版本说明和支持的配置文件，请下载该软件包。有关 TI 蓝牙栈和 Platform Manager 的其他信息，请参阅 (...)

支持的产品和硬件
认证

CC256X-REPORTS — 报告：CC256x 法规认证报告

是否在寻找 CC256x 模块认证支持？CC256x-CERTIFCATION 可提供相关的信息和支持，以帮助您成功完成产品认证。在此页面上，您可以找到我们的模块和评估板的最新认证报告。
支持的产品和硬件
设计工具

DUALMODE-BT-DESIGN-REVIEWS — CC256x 设备的硬件设计评审

开启双模 Bluetooth® 硬件设计审核流程：

  • 第 1 步：在申请审核前，重要的一点是审核相应产品页面上的技术文档和设计与开发资源（请参阅下面的 CC256x 产品页面链接）。
  • 第 2 步：下载并填写硬件设计评审申请表。
  • 第 3 步：通过电子邮件将填写好的硬件设计审查申请表和所需文档发送至：dualmode-bt-hw-review@list.ti.com

在双模蓝牙硬件设计审查流程中，您可与主题专家一对一沟通，专家会帮您审查设计并提供重要反馈。申请审查前，需查看相应产品页面上的技术文档及设计与开发资源。了解产品页面上的资源后，您可能无需申请设计审查。< /p>

申请审查双模蓝牙硬件设计前，应在我们的  (...)

支持的产品和硬件
封装 引脚 CAD 符号、封装和 3D 模型
VQFNP-MR (RVM) 76 Ultra Librarian
适用于评估类项目的 TI 标准条款与条件。

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