ZHCSHN9B February   2018  – February 2025 LMK05028

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
    1. 4.1 Device Start-Up Modes
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Diagrams
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Output Clock Test Configurations
  8. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 ITU-T G.8262 (SyncE) Standards Compliance
    2. 7.2 Functional Block Diagrams
      1. 7.2.1 PLL Architecture Overview
      2. 7.2.2 3-Loop Mode
        1. 7.2.2.1 PLL Output Clock Phase Noise Analysis in 3-Loop Mode
      3. 7.2.3 2-Loop REF-DPLL Mode
      4. 7.2.4 2-Loop TCXO-DPLL Mode
      5. 7.2.5 PLL Configurations for Common Applications
    3. 7.3 Feature Description
      1. 7.3.1  Oscillator Input (XO_P/N)
      2. 7.3.2  TCXO/OCXO Input (TCXO_IN)
      3. 7.3.3  Reference Inputs (INx_P/N)
      4. 7.3.4  Clock Input Interfacing and Termination
      5. 7.3.5  Reference Input Mux Selection
        1. 7.3.5.1 Automatic Input Selection
        2. 7.3.5.2 Manual Input Selection
      6. 7.3.6  Hitless Switching
      7. 7.3.7  Gapped Clock Support on Reference Inputs
      8. 7.3.8  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 7.3.8.1 XO Input Monitoring
        2. 7.3.8.2 TCXO Input Monitoring
        3. 7.3.8.3 Reference Input Monitoring
          1. 7.3.8.3.1 Reference Validation Timer
          2. 7.3.8.3.2 Amplitude Monitor
          3. 7.3.8.3.3 Missing Pulse Monitor (Late Detect)
          4. 7.3.8.3.4 Runt Pulse Monitor (Early Detect)
          5. 7.3.8.3.5 Frequency Monitoring
        4. 7.3.8.4 PLL Lock Detectors
        5. 7.3.8.5 Tuning Word History
        6. 7.3.8.6 Status Outputs
        7. 7.3.8.7 Interrupt
      9. 7.3.9  PLL Channels
        1. 7.3.9.1  PLL Frequency Relationships
        2. 7.3.9.2  Analog PLL (APLL)
        3. 7.3.9.3  APLL XO Doubler
        4. 7.3.9.4  APLL Phase Frequency Detector (PFD) and Charge Pump
        5. 7.3.9.5  APLL Loop Filter
        6. 7.3.9.6  APLL Voltage Controlled Oscillator (VCO)
          1. 7.3.9.6.1 VCO Calibration
        7. 7.3.9.7  APLL VCO Post-Dividers (P1, P2)
        8. 7.3.9.8  APLL Fractional N Divider (N) With SDM
        9. 7.3.9.9  REF-DPLL Reference Divider (R)
        10. 7.3.9.10 TCXO/OCXO Input Doubler and M Divider
        11. 7.3.9.11 TCXO Mux
        12. 7.3.9.12 REF-DPLL and TCXO-DPLL Time-to-Digital Converter (TDC)
        13. 7.3.9.13 REF-DPLL and TCXO-DPLL Loop Filter
        14. 7.3.9.14 REF-DPLL and TCXO-DPLL Feedback Dividers
      10. 7.3.10 Output Clock Distribution
      11. 7.3.11 Output Channel Muxes
        1. 7.3.11.1 TCXO/Ref Bypass Mux
      12. 7.3.12 Output Dividers
      13. 7.3.13 Clock Outputs (OUTx_P/N)
        1. 7.3.13.1 AC-Differential Output (AC-DIFF)
        2. 7.3.13.2 HCSL Output
        3. 7.3.13.3 LVCMOS Output (1.8 V, 2.5 V)
        4. 7.3.13.4 Output Auto-Mute During LOL or LOS
      14. 7.3.14 Glitchless Output Clock Start-Up
      15. 7.3.15 Clock Output Interfacing and Termination
      16. 7.3.16 Output Synchronization (SYNC)
      17. 7.3.17 Zero-Delay Mode (ZDM) Configuration
      18. 7.3.18 PLL Cascading With Internal VCO Loopback
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Start-Up Modes
        1. 7.4.1.1 EEPROM Mode
        2. 7.4.1.2 ROM Mode
      2. 7.4.2 PLL Operating Modes
        1. 7.4.2.1 Free-Run Mode
        2. 7.4.2.2 Lock Acquisition
        3. 7.4.2.3 Locked Mode
        4. 7.4.2.4 Holdover Mode
      3. 7.4.3 PLL Start-Up Sequence
      4. 7.4.4 Digitally-Controlled Oscillator (DCO) Mode
        1. 7.4.4.1 DCO Frequency Step Size
        2. 7.4.4.2 DCO Direct-Write Mode
      5. 7.4.5 Zero-Delay Mode (ZDM)
      6. 7.4.6 Cascaded PLL Operation
    5. 7.5 Programming
      1. 7.5.1 Interface and Control
      2. 7.5.2 I2C Serial Interface
        1. 7.5.2.1 I2C Block Register Transfers
      3. 7.5.3 SPI Serial Interface
        1. 7.5.3.1 SPI Block Register Transfer
      4. 7.5.4 Register Map Generation
      5. 7.5.5 General Register Programming Sequence
      6. 7.5.6 EEPROM Programming Flow
        1. 7.5.6.1 EEPROM Programming Using Register Commit (Method #1)
          1. 7.5.6.1.1 Write SRAM Using Register Commit
          2. 7.5.6.1.2 Program EEPROM
        2. 7.5.6.2 EEPROM Programming Using Direct SRAM Writes (Method #2)
          1. 7.5.6.2.1 Write SRAM Using Direct Writes
      7. 7.5.7 Read SRAM
      8. 7.5.8 Read EEPROM
      9. 7.5.9 EEPROM Start-Up Mode Default Configuration
    6. 7.6 Register Maps
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Start-Up Sequence
      2. 8.1.2 Power Down (PDN) Pin
      3. 8.1.3 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 8.1.3.1 Mixing Supplies
        2. 8.1.3.2 Power-On Reset (POR) Circuit
        3. 8.1.3.3 Powering Up From a Single-Supply Rail
        4. 8.1.3.4 Power Up From Split-Supply Rails
        5. 8.1.3.5 Non-Monotonic or Slow Power-Up Supply Ramp
      4. 8.1.4 Slow or Delayed XO Start-Up
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Power Supply Bypassing
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Reliability
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Clock Architect
      2. 9.1.2 TICS Pro
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

重要声明和免责声明

TI 均以原样提供技术性及可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,不保证其中不含任何瑕疵,且不做任何明示或暗示的担保,包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示担保。

所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任:(1) 针对您的应用选择合适的TI 产品;(2) 设计、验证并测试您的应用;(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更,恕不另行通知。TI 对您使用所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源,也不提供其它TI或任何第三方的知识产权授权许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等,TI对此概不负责,并且您须赔偿由此对TI 及其代表造成的损害。

TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE

邮寄地址:上海市浦东新区世纪大道 1568 号中建大厦 32 楼,邮政编码:200122

Copyright © 2025 德州仪器半导体技术(上海)有限公司