SLDA021B March   2014  – February 2020 AM3892 , AM3894

 

  1.   1
    1.     2
    2.     3
      1.      4
        1.       5
      2.      6
    3.     7
      1.      8
        1.       9
      2.      10
        1.       11
        2.       12
          1.        13
      3.      14
      4.      15
    4.     16
      1.      17
      2.      18
      3.      19
      4.      20
    5.     21
      1.      22
        1.       23
      2.      24
      3.      25
      4.      26
      5.      27
      6.      28
      7.      29
      8.      30
    6.     31
      1.      32
      2.      33
      3.      34
      4.      35
      5.      36
      6.      37
    7.     38
      1.      39
      2.      40
      3.      41
      4.      42
    8.     43
      1.      44
      2.      45
      3.      46
      4.      47
    9.     48
      1.      49
      2.      50
      3.      51
      4.      52
      5.      53
      6.      54
      7.      55
        1.       56
        2.       57
      8.      58
      9.      59
      10.      60
    10.     61
    11.     62
      1.      63
      2.      64
    12.     65
  2.   66

2.4 Summary of PCB Design Recommendations

Table 3 lists the basic design recommendations for a WiLink 8 FCBGA PCB.

Table 3. WiLink 8Q FCBGA Package Circuit Board Design Recommendations

Design Area/Parameter
Pad Design Recommendations Pad geometry (mm) 0.32
Pad opening (mm, NSMD) 0.45
PCB Assembly Recommendations Solder paste type (Pb-free) Sn/Ag/Cu-based
Stencil thickness (mm) 0.10 to 0.125
Recommended PCB surface finish OSP
Maximum reflow temperature (°C) +260°C
Maximum reflow time (sec) 40 to 60
Maximum soak temperature (°C) +180°C
Maximum soak time (sec) 90 sec
# Reflow maximum Maximum 3
Package Storage Information Storage conditions ≤ 30°C/85% RH 
Moisture sensitvity level (MSL) L3
Possible prebake recommendations 125C/24H