SLDA021B March   2014  – February 2020 AM3892 , AM3894

 

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10.1 Packaging Information

Table 5 defines the WiLink 8Q FCBGA package specifications.

Table 5. WiLink 8Q FCBGA Package Information

Component ID Code/Number/Name
Package Type and Name FCBGA (10 × 10 × 1.17; 0.65 mm)
Package Marking Component TI logo
Orientation #A1 / bottom right corner
Package Attributes Ball count 169
Ball pitch (mm) 0.65
Ball diameter / dimensions (mm) 0.40 ± 0.05
Ball height / substrate standoff (mm) 0.31
Coplanarity (mm) 0.10 (maximum)
Package thickness (mm) 1.260 (maximum)
Maximum footprint (mm × mm)—center to center 10.10 × 10.10
Interconnect method (WB, TAB, FC) FC
Daisy-chain level(if daisy-chain component) Level 3
Available shipping media Tape and reel

Table 6 shows the typical WiLink 8Q FCBGA PCB materials list.

Table 6. WiLink 8Q FCBGA Package Structure and Materials

Structural Information Material
Conductor material Cu
Die bond pad metallization AL
Solder ball composition LF35/SAC305