SLAU857A May   2021  – July 2021 MSP430FR2476 , MSP430FR2512 , MSP430FR2522 , MSP430FR2532 , MSP430FR2533 , MSP430FR2632 , MSP430FR2633 , MSP430FR2672 , MSP430FR2673 , MSP430FR2675 , MSP430FR2676

 

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PCB Layout

Some of the goals of PCB layout and mechanical structure design are the same, to improve signal strength and to reduce EMC problems. Table 4-4 is the PCB layout checklist. For specific examples, refer to TI EVM board CAPTIVATE-BSWP (self-inductive) and CAPTIVATE-PHONE (mutual-capacitive).

Table 4-4 PCB Layout Checklist
NumberComponentRecommendation
1Button (self-capacitance)ShapeSolid circle or square.
sizeThe diameter/side length is 10 mm to 12 mm.
Distance to ground grid copperThe button is placed on the top layer of the PCB, and the ground copper is 0.5 times the thickness of the cover layer of the button.
2Button (mutual capacitance)ShapeSquare or round, inner Rx, outer Tx.
SizeOuter diameter/side length is 10mm and 12mm.

RX width is 0.5 mm, Tx width is 1 mm, and the distance between Rx and Tx is 0.5 mm.

Distance to grid copperThe button is placed on the top layer of the PCB, and the ground copper is 0.5 times the thickness of the cover layer of the button.
3Slider or wheel

(self-capacitance)

ShapeRefer to Automating Capacitive Touch Sensor PCB Design Using OpenSCAD Scripts
SizeThe electrode width is 10 to 12 mm, and the length depends on the required touch area.
Number of electrodesMore than or equal to 3 electrodes, add electrodes according to the sensitivity and resolution requirements.
4Proximity sensor

(self-capacitance)

Shape sizeSolid copper clad, hollow copper clad or wire, the sensing distance is positively related to the enclosed area.
5Sensor wiringWidth8 mil or the minimum thickness allowed by the PCB manufacturer.
LengthMinimize the length from the sensor to the controller.
Points to note when routingKeep 10 mil to 20 mil spacing with grounding copper.

No sharp angles.

Reduce via holes, via hole diameter 10 mil.

Keep away from other touch signal wires, digital signal wires and analog signal wires by more than 4mm or choose vertical routing.

7Ground copperUse grid-like copper plating (line width 8 mil, grid width 64 mil, angle 45°).

Self-capacitive design, double-sided copper-clad, selective copper-clad directly under the button.

Mutual-capacitance type can use copper plating on only the bottom surface of the board.
8Series resistance, TVS tube, EMC filter capacitor placementPlace within 10 mm of MCU pin.
8Moisture and liquid resistanceSelf-inductive solution: Reduce the grounding copper and improve the touch sensitivity to reduce the parasitic capacitance change caused by water.

Mutual-capacitive scheme: Liquid Tolerant Capacitive Touch Buttonpad Reference Design

In terms of sensitivity, buttons and slider wheels that are similar in width to a finger, and sensor traces that are narrow and short can enhance the capacitance change caused by touch. Fewer vias and thinner copper can reduce the capacitance to ground. However, grounding copper also directly affects EMC anti-noise ability. The specific layout and grid density must be adjusted according to test results. Because capacitive touch is both a source of interference and a sensitive device, for EMC considerations, in addition to adding protection devices, route touch signals away from other signal lines or devices.