SDYU001AC June   2015  – November 2025 LSF0101 , LSF0102 , LSF0108 , SN74GTL2014 , SN74HC245 , SN74LS07 , SN74LV123A , SN74LV1T08 , SN74LV1T34 , SN74LV244AT , SN74LV245A , SN74LV4T125 , SN74LVC14A , SN74LVC1G08 , SN74LVC1G125 , SN74LVC245A , SN74LVTH125 , SN74LVTH16244A , SN74LVTH16245A , SN74LVTH245A

 

  1.   1
  2.   Trademarks
  3. 1Introduction
  4. 2Logic Overview
    1. 2.1 Logic Family Quick Reference
    2. 2.2 Comparison of Switching Standards
    3. 2.3 Automotive Logic
    4. 2.4 Ongoing Packaging Investment
    5. 2.5 TI's Programmable Logic Devices: TPLD
    6. 2.6 Function Table
  5. 3Logic Families
    1. 3.1  Legacy Logic
    2. 3.2  AC(T): Advanced CMOS
    3. 3.3  AHC(T): Advanced High-Speed CMOS
    4. 3.4  ALVC: Advanced Low-Voltage CMOS
    5. 3.5  AUC: Advanced Ultra Low Voltage CMOS
    6. 3.6  AUP: Advanced Ultra-Low Power
    7. 3.7  AVC: Advanced Very-Low-Voltage CMOS
    8. 3.8  HC(T): High-Speed CMOS
    9. 3.9  HCS: High-Speed CMOS with Schmitt-trigger inputs
    10. 3.10 LV-A(T): Low Voltage
    11. 3.11 LVxT: Low-Voltage CMOS Single Supply Translating Logic
    12. 3.12 LVC: Low-Voltage CMOS
    13. 3.13 LVT: Low-Voltage BiCMOS Technology
  6. 4Appendix A: Logic Packages
  7. 5Appendix B: Competitor Family Cross Reference
  8. 6Appendix C: Logic Part Number Naming Conventions
  9. 7Appendix D: Standard Logic Functions
  10. 8Revision History

2.4 Ongoing Packaging Investment

TI continues to invest in the future of standard logic products with the latest VSSOP (DGS), SOT-23-THN (DYY), and X2QFN (DTX) packages.

VSSOP and SOT-23-THN packages provide 0.5mm pitch for maximum space savings while also maximizing manufacturability.

TI is not only investing in the standard logic space, but also in popular little logic functions. TI has released the newest and smallest next generation X2SON package (a.k.a. X2QFN) for 5-pin and 6-pin devices. The 5-pin DPW package is just 0.8 × 0.8 × 0.4 mm (0.5-mm pitch), whereas the 6-pin DTB package is only 0.8 × 1.0 × 0.4 mm (0.4-mm pitch)