ZHCSL07C September   2019  – August 2021 TPS8802

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  System Power-up
      2. 8.3.2  LDO Regulators
        1. 8.3.2.1 Power LDO Regulator
        2. 8.3.2.2 Internal LDO Regulator
        3. 8.3.2.3 Microcontroller LDO Regulator
      3. 8.3.3  Photo Chamber AFE
        1. 8.3.3.1 Photo Input Amplifier
        2. 8.3.3.2 Photo Gain Amplifier
      4. 8.3.4  LED Driver
        1. 8.3.4.1 LED Current Sink
        2. 8.3.4.2 LED Voltage Supply
      5. 8.3.5  Carbon Monoxide Sensor AFE
        1. 8.3.5.1 CO Transimpedance Amplifier
        2. 8.3.5.2 CO Connectivity Test
      6. 8.3.6  Boost Converter
        1. 8.3.6.1 Boost Hysteretic Control
        2. 8.3.6.2 Boost Soft Start
      7. 8.3.7  Interconnect Driver
      8. 8.3.8  Piezoelectric Horn Driver
        1. 8.3.8.1 Three-Terminal Piezo
        2. 8.3.8.2 Two-Terminal Piezo
      9. 8.3.9  Battery Test
      10. 8.3.10 AMUX
      11. 8.3.11 Analog Bias Block and 8 MHz Oscillator
      12. 8.3.12 Interrupt Signal Alerts
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
      2. 8.4.2 Fault States
        1. 8.4.2.1 MCU LDO Fault
        2. 8.4.2.2 Over-Temperature Fault
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1  REVID Register (Offset = 0h) [reset = 0h]
      2. 8.6.2  STATUS1 Register (Offset = 1h) [reset = 0h]
      3. 8.6.3  STATUS2 Register (Offset = 2h) [reset = 0h]
      4. 8.6.4  MASK Register (Offset = 3h) [reset = 0h]
      5. 8.6.5  CONFIG1 Register (Offset = 4h) [reset = 20h]
      6. 8.6.6  CONFIG2 Register (Offset = 5h) [reset = 2h]
      7. 8.6.7  ENABLE1 Register (Offset = 6h) [reset = 10h]
      8. 8.6.8  ENABLE2 Register (Offset = 7h) [reset = 0h]
      9. 8.6.9  CONTROL Register (Offset = 8h) [reset = 0h]
      10. 8.6.10 SLPTMR1 Register (Offset = 9h) [reset = 0h]
      11. 8.6.11 SLPTMR2 Register (Offset = Ah) [reset = 0h]
      12. 8.6.12 GPIO_AMUX Register (Offset = Bh) [reset = 0h]
      13. 8.6.13 CO_BATTEST Register (Offset = Ch) [reset = 0h]
      14. 8.6.14 CO Register (Offset = Dh) [reset = 0h]
      15. 8.6.15 VBOOST Register (Offset = Eh) [reset = F2h]
      16. 8.6.16 LEDLDO Register (Offset = Fh) [reset = 0h]
      17. 8.6.17 PH_CTRL Register (Offset = 10h) [reset = 0h]
      18. 8.6.18 LED_DAC_A Register (Offset = 11h) [reset = 0h]
      19. 8.6.19 LED_DAC_B Register (Offset = 12h) [reset = 0h]
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Photo Amplifier Component Selection
        2. 9.2.2.2 LED Driver Component Selection
        3. 9.2.2.3 LED Voltage Supply Selection
        4. 9.2.2.4 Boost Converter Component Selection
        5. 9.2.2.5 Regulator Component Selection
      3. 9.2.3 Application Curves
      4. 9.2.4 3V Battery Smoke and CO Alarm
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Photo Amplifier Layout
      2. 11.1.2 CO Amplifier Layout
      3. 11.1.3 Boost Converter Layout
      4. 11.1.4 Ground Plane Layout
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Register Maps

Table 8-3 lists the memory-mapped registers for the Device registers. All register offset addresses not listed in Table 8-3 should be considered as reserved locations and the register contents should not be modified.

Table 8-3 Device Registers
OffsetAcronymRegister NameSection
0hREVIDDevice InformationGo
1hSTATUS1Status 1Go
2hSTATUS2Status 2Go
3hMASKInterrupt MaskGo
4hCONFIG1Config 1Go
5hCONFIG2Config 2Go
6hENABLE1Enable 1Go
7hENABLE2Enable 2Go
8hCONTROLControlGo
9hSLPTMR1Sleep Timer 1Go
AhSLPTMR2Sleep Timer 2Go
BhGPIO_AMUXGPIO and AMUXGo
ChCO_BATTESTCO and Battery TestGo
DhCOCO AmplifierGo
EhVBOOSTBoost ConverterGo
FhLEDLDOLED LDOGo
10hPH_CTRLPhoto AmplifierGo
11hLED_DAC_ALED DAC AGo
12hLED_DAC_BLED DAC BGo

Complex bit access types are encoded to fit into small table cells. Table 8-4 shows the codes that are used for access types in this section.

Table 8-4 Device Access Type Codes
Access TypeCodeDescription
Read Type
RRRead
RCR
C
Read
to Clear
Write Type
WWWrite
Reset or Default Value
-nValue after reset or the default value