ZHCSK61B August   2019  – December  2019 TPS66120 , TPS66121

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     功能表
      1.      TPS6612x 方框图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Recommended Supply Load Capacitance
    5. 6.5  Thermal Information
    6. 6.6  PPHV Power Switch Characteristics
    7. 6.7  Power Path Supervisory
    8. 6.8  VBUS LDO Characteristics
    9. 6.9  Thermal Shutdown Characteristics
    10. 6.10 Input-output (I/O) Characteristics
    11. 6.11 Power Consumption Characteristics
    12. 6.12 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 20-V Sink (PPHV Power Path)
        1. 7.3.1.1 PPHV Soft Start
        2. 7.3.1.2 PPHV Reverse Current Protection (RCP)
      2. 7.3.2 Overtemperature Protection
      3. 7.3.3 VBUS Overvoltage Protection (OVP)
      4. 7.3.4 Power Management and Supervisory
        1. 7.3.4.1 Supply Connections
        2. 7.3.4.2 Power Up Sequences
          1. 7.3.4.2.1 Normal Power Up
          2. 7.3.4.2.2 Dead Battery Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 State Transitions
        1. 7.4.1.1 DISABLED State
        2. 7.4.1.2 SNK State
      2. 7.4.2 SNK FAULT State
      3. 7.4.3 Device Functional Mode Summary
      4. 7.4.4 Enabling the PPHV Sink Path
      5. 7.4.5 Faults
        1. 7.4.5.1 Fault Types
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External VLDO Capacitor (CVLDO)
        2. 8.2.2.2 PPHV, VBUS Power Path Capacitance
        3. 8.2.2.3 VBUS TVS Protection (Optional)
        4. 8.2.2.4 VBUS Schottky Diode Protection (Optional)
        5. 8.2.2.5 VBUS Overvoltage Protection (Optional)
        6. 8.2.2.6 Dead Battery Support
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 相关链接
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

Thermal Shutdown Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TSD_PPHV_R Thermal Shutdown Temperature of the PPHV power path. Temperature rising 128 150 172 °C
TSD_PPHV_F Thermal Shutdown Temperature of the PPHV power path. Temperature falling 115 140 165 °C
TSDH_PPHV Thermal Shutdown hysteresis of the PPHV power path. 10 °C
TSD_MAIN_R Thermal Shutdown Temperature of the entire device. Temperature rising 140 160 178 °C
TSD_MAIN_F Thermal Shutdown Temperature of the entire device. Temperature falling 120 140 160 °C
TSDH_MAIN Thermal Shutdown hysteresis of the entire device. 20 °C