ZHCSK61B August   2019  – December  2019 TPS66120 , TPS66121

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     功能表
      1.      TPS6612x 方框图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Recommended Supply Load Capacitance
    5. 6.5  Thermal Information
    6. 6.6  PPHV Power Switch Characteristics
    7. 6.7  Power Path Supervisory
    8. 6.8  VBUS LDO Characteristics
    9. 6.9  Thermal Shutdown Characteristics
    10. 6.10 Input-output (I/O) Characteristics
    11. 6.11 Power Consumption Characteristics
    12. 6.12 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 20-V Sink (PPHV Power Path)
        1. 7.3.1.1 PPHV Soft Start
        2. 7.3.1.2 PPHV Reverse Current Protection (RCP)
      2. 7.3.2 Overtemperature Protection
      3. 7.3.3 VBUS Overvoltage Protection (OVP)
      4. 7.3.4 Power Management and Supervisory
        1. 7.3.4.1 Supply Connections
        2. 7.3.4.2 Power Up Sequences
          1. 7.3.4.2.1 Normal Power Up
          2. 7.3.4.2.2 Dead Battery Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 State Transitions
        1. 7.4.1.1 DISABLED State
        2. 7.4.1.2 SNK State
      2. 7.4.2 SNK FAULT State
      3. 7.4.3 Device Functional Mode Summary
      4. 7.4.4 Enabling the PPHV Sink Path
      5. 7.4.5 Faults
        1. 7.4.5.1 Fault Types
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External VLDO Capacitor (CVLDO)
        2. 8.2.2.2 PPHV, VBUS Power Path Capacitance
        3. 8.2.2.3 VBUS TVS Protection (Optional)
        4. 8.2.2.4 VBUS Schottky Diode Protection (Optional)
        5. 8.2.2.5 VBUS Overvoltage Protection (Optional)
        6. 8.2.2.6 Dead Battery Support
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 相关链接
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

特性

  • 集成 22mΩ(典型值),32V 耐压 NFET 4V 至 22V 灌电流路径,高达 5A
  • 内置软启动可限制浪涌电流
  • 集成高电压 VBUS LDO 稳压器(每种器件类型为 3.3V 或 5.0V)
  • 通过引脚配置的可选 VBUS 过压保护。
  • 系统电源和 VBUS 欠压保护
  • 过热保护
  • 反向电流保护
  • 具有抗尖峰脉冲故障报告功能的故障引脚
  • 小型 WCSP 封装,无需 HDI。